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F4B series high frequency material is mainly PTFE
glass fiber cloth and ceramic-filled PTFE glass fiber cloth etc. It is a series
of high frequency materials of Chinese brand, which is cheap in price and
stable in quality.
Item NO.:
BIC-098-v18.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysPTFE High Frequency PCB 1.5mm DK 2.65 PTFE RF Circuit Board with 3oz Copper Coating Immersion Gold
PTFE high frequency PCB widely applied to radar, navigation, satellite communication, 4G communications, 5G communications and the like.
PCB Specifications:
Layer count: |
Double sided |
Base material: |
F4B DK 2.65 |
Dimension: |
210 x 115mm |
Finished thickness |
1.6mm ±10% |
Finished Copper weight: |
3oz |
SMOBC: |
No |
Surface finish: |
Immersion gold |
The main specifications of this board is double sided board, substrate is F4B, DK at 2.65, 210mm long by 115mm wide, 1.6mm finished thick, finished copper 3oz, no solder mask no silkscreen, and surface finish is immersion gold.
Let’s see the stack up.
Top layer and bottom layer are3oz copper finished. F4b dielectric material is in the middle of 2 layers copper, showing dielectric constant at 2.65
From the photo of this board, the track is thicker than normal boards; surface finish is immersion gold and no solder mask and silkscreen.
Our PCB Capability (PTFE):
PCB Material: |
PTFE |
Code: |
F4B series |
Dielectric constant: |
2.2, 2.55 and 2.65 |
2.17, 2.45, 2.75 and 3.0 |
|
Layer count: |
1 Layer, 2 Layer, Multilayer, Hybrid type |
Copper weight: |
0.5oz, 1oz, 2oz, 3oz |
PCB thickness: |
0.17mm, 0.25mm, 0.5mm, 0.8mm, 1.0mm, |
1.5mm, 2.0mm, 3.0mm, 4.0mm and 5.0mm, etc. |
|
PCB Size: |
≤400mm X 500mm |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin etc. |
The dielectric constant of F4B material is wide, ranging 2.2 to 3.0 etc. Board thickness ranges 0.17mm to 5.0mm. We can provide you with prototype service, small batches and mass production service.
Appendix: Data Sheet of PTFE(F4B):
Name | Test condition | Unit | Value | |||
Density | Normal state | g/ cm3 | 2.1~2.35 | |||
Moisture Absorption | Dip in the distilled water of 20±2℃ for 24 hours | % | ≤0.02 | |||
Operating Temperature | High-low temperature chamber | ℃ | -50℃~+260℃ | |||
Thermal Conductivity | W/m/k | 0.8 | ||||
CTE (typical) | 0~100℃ (εr :2.1~2.3) | ppm/℃ | 25(x) | |||
34(y) | ||||||
252(z) | ||||||
CTE (typical) | 0~100℃ (εr :2.3~2.9) | ppm/℃ | 14(x) | |||
21(y) | ||||||
173(z) | ||||||
CTE (typical) | 0~100℃ (εr :2.9~3.5) | ppm/℃ | 12(x) | |||
15(y) | ||||||
95(z) | ||||||
Shrinkage Factor | 2 hours in boiling water | % | 0.0002 | |||
Surface Resistivity | 500V DC | Normal state | M·Ω | ≥1×104 | ||
Constant humidity and temperature | ≥1×103 | |||||
Volume Resistivity | Normal state | MΩ.cm | ≥1×106 | |||
Constant humidity and temperature | ≥1×105 | |||||
Pin Resistance | 500V DC | Normal state | MΩ | ≥1×105 | ||
Constant humidity and temperature | ≥1×103 | |||||
Surface dielectric strength | Normal state | d=1mm(Kv/mm) | ≥1.2 | |||
Constant humidity and temperature | ≥1.1 | |||||
Dielectric Constant | 10GHZ | εr | 2.20,2.55,2.65,3.0,3.5 (±2%) | |||
Dissipation Factor | 10GHZ | tgδ | 2.2 | ≤7×10-4 | ||
2.55~2.65 | ≤1×10-3 | |||||
3.0~3.5 | ≤1.5×10-3 |
PCB MANUFACTURING PROCESS:
BICHENG PCB WORSHOP:
BICHENG TEAM PRACTICE:
BICHENG PCB CERTIFICATE:
If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
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