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PTFE commonly known as "plastic king ", is a polymer
compound made of tetrafluoroethylene by polymerization. It has excellent
chemical stability, corrosion resistance, sealing, high lubrication and
non-viscosity, electrical insulation and good aging resistance.
Item NO.:
BIC-108-v21.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysPTFE High Frequency PCB on DK2.65 F4B 0.8mm 1oz Copper With Immersion Gold and Black Solder Mask
Used as engineering plastic, it can be made into PTFE tube, rod, belt, plate, film and so on. Generally it’s used in high performance requirements of corrosion-resistant pipes, containers, pumps, valves as well as radar, high-frequency communication equipment, radio equipment.
Excellent performance:
1)high temperature resistance: long-term use temperature 200~260 degrees Celsius.
2)low temperature resistance: still soft at -100 degrees Celsius;
3)corrosion resistance: resistant aqua regia and all organic solvents;
4)climate resistance: best aging life in plastics;
5)high lubrication: with the smallest friction coefficient in plastics (0.04);
6)Non-viscous: with minimal surface tension in solid materials without adhering to any substance;
7)non-toxic: with physiological inertness;
8)excellent electrical properties, ideal for C class of insulating materials, a thick layer of stack of newspaper can block 1500 V of high voltage;
9)smoother than ice.
F4BM-1/2 High Frequency PCB
F4BM-1/2 is laminated by laying up of varnished glass cloth with Teflon resin,according to the scientific formulation and strict technology process. This product takes some advantages over F4B series in the electrical performance(wider range of dielectric constant、lower dielectric loss angle tangent、increased resistance、and more stability of performance)
At RF and Microwave frequencies, the dielectric constant of PTFE materials is as low as 3.5 or below, which keeps strong signal during transmission across PCB, making them ideal for overcoming the high speed limitation of FR-4.
PCB Capability (PTFE):
| PCB Material: | Fibre glass coated PTFE |
| Code: | F4BM-1/2 (family series) |
| Dielectric constant: | 2.2, 2.55, 2.65, |
| 3.0 and 3.5 | |
| Layer count: | 1 Layer, 2 Layers and multi-layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
| PCB thickness: | 0.25mm, 0.5mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm,3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Silver, OSP,etc. |
Data Sheet of F4B (PTFE):
| Name | Test condition | Unit | Value | |||
| Density | Normal state | g/ cm3 | 2.1~2.35 | |||
| Moisture Absorption | Dip in the distilled water of 20±2℃ for 24 hours | % | ≤0.02 | |||
| Operating Temperature | High-low temperature chamber | ℃ | -50℃~+260℃ | |||
| Thermal Conductivity | W/m/k | 0.8 | ||||
| CTE (typical) | 0~100℃ (εr :2.1~2.3) | ppm/℃ | 25(x) | |||
| 34(y) | ||||||
| 252(z) | ||||||
| CTE (typical) | 0~100℃ (εr :2.3~2.9) | ppm/℃ | 14(x) | |||
| 21(y) | ||||||
| 173(z) | ||||||
| CTE (typical) | 0~100℃ (εr :2.9~3.5) | ppm/℃ | 12(x) | |||
| 15(y) | ||||||
| 95(z) | ||||||
| Shrinkage Factor | 2 hours in boiling water | % | 0.0002 | |||
| Surface Resistivity | 500V DC | Normal state | M·Ω | ≥1×104 | ||
| Constant humidity and temperature | ≥1×103 | |||||
| Volume Resistivity | Normal state | MΩ.cm | ≥1×106 | |||
| Constant humidity and temperature | ≥1×105 | |||||
| Pin Resistance | 500V DC | Normal state | MΩ | ≥1×105 | ||
| Constant humidity and temperature | ≥1×103 | |||||
| Surface dielectric strength | Normal state | d=1mm(Kv/mm) | ≥1.2 | |||
| Constant humidity and temperature | ≥1.1 | |||||
| Dielectric Constant | 10GHZ | εr | 2.20,2.55,2.65,3.0,3.5 (±2%) | |||
| Dissipation Factor | 10GHZ | tgδ | 2.2 | ≤7×10-4 | ||
| 2.55~2.65 | ≤1×10-3 | |||||
| 3.0~3.5 | ≤1.5×10-3 | |||||
PCB MANUFACTURING PROCESS:
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