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Home PTFE PCB Board RF PCB RF-60TC Coating with Immersion Gold Tin HASL OSP

RF PCB RF-60TC Coating with Immersion Gold Tin HASL OSP

RF-60TC is by improving dielectric heat dissipation and exceptionally lower dielectric losses, a better gain and efficiency are got in miniaturized antenna applications.

  • Item NO.:

    BIC-166-v46.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$1.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP for Miniaturized Antenna

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RF-60TC is a ceramic-filled PolyTetraFluoride(PTFE) based (fiberglass substrate for the PCB of high power RF and microwave applications. It is designed to provide lower operating temperature in high power applications and the 6.15DK market. 


RF-60TC PCB Material


RF-60TC's enhanced heat transfer function allows additional design margin to extend the life of active components and improve long-term reliability.


RF-60TC with extremely low profile and reverse treated copper is excellent to reduce insertion loss. Heavy metal based laminate is also available. RF-60TC’s low CTE and improved dimensional stability make it possible to build multi-layer PCB with improved PTH reliability.


RF-60TC PCB


Our PCB Capability (RF-60TC):


PCB Material: PTFE based, ceramic filled fiberglass
Designation: RF-60TC
Dielectric constant: 6.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm),  60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..


Benefits:


1.Improved loss tangent

- Lower insertion loss

- Enhanced antenna gain / efficiency


2.High thermal conductivity

- Exceptional thermal management

- Lower operating temperature

- Higher power application

- Loong term reliablity


3.Enhanced dimensional stability


4.Low Z-axis CTE

- Multilayer application available

- Reliable plated through hole


5.Excellent adhesion to metal

- Lower profile copper available

- Heavy metal back available


6.Stable DK over frequency

7.Stable DK over temperature


8.Low moisture absorption


RF-60TC DK6.15

RF-60TC df vs frequency

RF-60TC dk vs frequency


Applications:


High power amplifier

Miniaturized antennas (GPS / PATCH / RFID Reader)

Filters, couplers, dividers

Satellites


Typical Value of RF-60TC:


RF-60TC Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1(Modified) 6.15 ± 0.15 6.15 ± 0.15
Df @ 10 GHz IPC-650 2.5.5.5.1(Modified) 0.002 0.002
TcK ppm/°C -3.581 ppm/°C -3.581
Dielectric Breakdown IPC-650 2.5.6 kV 55 kV 55
Dielectric Strength IPC-650 2.5.6.2 V/mil 550 V/mm 21,654
Arc Resistance IPC-650 2.5.1 Seconds >180 Seconds >180
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Flexural Strength(MD) IPC-650 2.4.4 psi 10,000 N/mm2 69
Flexural Strength(CD) IPC-650 2.4.4 psi 9,000 N/mm2 62
Tensile Strength(MD) IPC-650 2.4.19 psi 9,000 N/mm2 62
Tensile Strength(CD) IPC-650 2.4.19 psi 7,000 N/mm2 48
Young’s Modulus(MD) ASTM D 3039/IPC-TM-650 2.4.19 kpsi 721 N/mm2 4971
Poisson’s Ratio(MD) ASTM D 3039/IPC-TM-650 2.4.19 0.155 0.155
Peel Strength(1 oz. ED) IPC-650 2.4.8 lbs/in 8 N/mm 1.43
Thermal Conductivity(Unclad) IPC-650 2.4.50 W/M*K 0.9 W/M*K 0.9
Thermal Conductivity(CH/CH) IPC-650 2.4.50 W/M*K 1 W/M*K 1
Thermal Conductivity(C1/C1) IPC-650 2.4.50 W/M*K 1.05 W/M*K 1.05
Dimensional Stability(MD) IPC-650 2.4.39 Sec. 5.4(After Bake) mils/in 0.01 mm/M 0.01
Dimensional Stability(CD) IPC-650 2.4.39 Sec. 5.4(After Bake) mils/in 0.69 mm/M 0.69
Dimensional Stability(MD) IPC-650 2.4.39 Sec. 5.5(Thermal Stress) mils/in 0.06 mm/M 0.06
Dimensional Stability(CD) IPC-650 2.4.39 Sec. 5.5(Thermal Stress) mils/in 0.8 mm/M 0.8
Surface Resistivity IPC-650 2.5.17.1(After Humidity) Mohm 1.0 x 108 Mohm 1.0 x 108
Volume Resistivity IPC-650 2.5.17.1(After Humidity) Mohm/cm 1.0 x 108 Mohm/cm 1.0 x 108
CTE(X, Y axis) IPC-650 2.4.41(RT- 150°C) ppm/°C 9.9 ppm/°C 9.9
CTE(Z axis) IPC-650 2.4.41(RT- 150°C) ppm/°C 40 ppm/°C 40
Density(Specific Gravity) IPC-650 2.3.5 g/cm3 2.84 g/cm3 2.84
Specific Heat IPC-650 2.4.50 J/gK 0.94 J/gK 0.94
Td(2% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 930 °C 500
Td(5% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 960 °C 515
Flammability Rating UL 94 V-0 V-0


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