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20 mil RO4003C PCB
20 mil RO4003C PCB
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  • What Are the Key Features and Benefits of DiClad 870 PCB?
    • June 21. 2024

    DiClad 870 PCB: Unleashing Performance and Stability for High-Frequency Applications Introduction The world of high-frequency printed circuit boards (PCBs) demands materials that can deliver exceptional performance, stability, and electrical properties. In this realm, Rogers DiClad 870 PCB comes to the forefront as a woven fiberglass reinforced, PTFE-based composite that offers outstanding charact...

  • What Are the Advantages of Using A Hybrid PCB with RO4003C and S1000-2M Materials?
    • February 11. 2025

    What Are the Advantages of Using A Hybrid PCB with RO4003C and S1000-2M Materials? Introduction: In the fast-paced world of electronics, the demand for high-frequency and low-loss circuit boards continues to drive innovation. To meet these requirements, we present our newly shipped Hybrid PCB, incorporating the advanced materials RO4003C and S1000-2M. Designed for superior performance and cos...

  • Can You Handle High-frequency (RF/microwave) PCBs? Materials?
    • April 16. 2025

    Can You Handle High-frequency (RF/microwave) PCBs? Materials? Introduction High-frequency PCBs, particularly those used in RF (Radio Frequency) and microwave applications, require specialized materials and manufacturing expertise. Unlike standard FR-4 PCBs, these boards must maintain signal integrity, minimize dielectric losses, and withstand extreme thermal conditions. A common question we encoun...

  • How Do You Handle PCB Panelization?
    • April 16. 2025

    How Do You Handle PCB Panelization? PCB Panelization: Optimizing Panel Size for Cost-Efficiency (V-Cut vs. Tab Routing) Introduction In PCB manufacturing, panelizationis a critical step that directly impacts production efficiency, material utilization, and overall cost. Panelization involves arranging multiple PCB designs onto a single manufacturing panel to optimize fabrication and assembly ...

  • Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs
    • May 21. 2025

    Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs Introduction In high-speed PCB design, signal integrity is paramount. As data rates increase, crosstalk—unwanted electromagnetic coupling between traces—becomes a critical challenge. A well-optimized multilayer stackup is essential to minimize crosstalk while ensuring signal integrity, power delivery, and manufacturability. This ar...

  • What Are the Design Considerations for Hybrid High-Frequency PCBs?
    • June 12. 2025

    What Are the Design Considerations for Hybrid High-Frequency PCBs? Introduction Hybrid (mixed dielectric) high-frequency PCBs combine different materials to optimize electrical performance, thermal stability, and manufacturability. These mixed dielectric hybrid boards are widely used in RF/microwave applications, aerospace, radar systems, and telecommunications, where signal integrity and thermal ...

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