• May 21. 2025

Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs Introduction In high-speed PCB design, signal integrity is paramount. As data rates increase, crosstalk—unwanted electromagnetic coupling between traces—becomes a critical challenge. A well-optimized multilayer stackup is essential to minimize crosstalk while ensuring signal integrity, power delivery, and manufacturability. This ar...

• June 12. 2025

How to Choose Between RO4350B, PTFE, and Ceramic-Filled Substrates？ Introduction High-frequency PCBs are critical in modern RF and microwave applications, including 5G communications, radar systems, and satellite technology. Selecting the right substrate material is essential to ensure signal integrity, thermal stability, and manufacturability. Three of the most commonly used high-frequency PCB ma...