What Makes TMM13i High Frequency PCBs Ideal for Demanding RF and Microwave Applications?

In the world of high-frequency electronics, the choice of printed circuit board (PCB) material is critical to achieving optimal performance and reliability. Rogers Corporation’s TMM13i isotropic thermoset microwave material stands out as an exceptional choice for high-frequency applications. This ceramic thermoset polymer composite is specifically engineered to deliver high reliability in plated through-hole strip-line and micro-strip configurations. By combining the beneficial properties of both ceramic and PTFE substrates, Rogers TMM13i allows designers to leverage the processing ease of soft substrate materials without compromising on electrical or thermal performance.

One of the key features of TMM13i laminate is their exceptionally low thermal coefficient of dielectric constant, rated at -70 ppm/°C. This ensures remarkable stability of the dielectric constant across a broad temperature spectrum, making it an excellent candidate for applications subject to significant temperature variations. Such thermal stability is essential in environments where performance consistency cannot be compromised.

Moreover, TMM13i PCB exhibits isotropic coefficients of thermal expansion (CTE)—19 ppm/°C in the X and Y axes, and 20 ppm/°C in the Z direction. These values are closely matched to those of copper, which significantly enhances the reliability of plated through holes and reduces etch shrinkage. This CTE matching minimizes the risk of delamination or cracking under thermal stress, thereby extending the lifecycle of the assembled PCB.

Another advantage of TMM13i substrate is its high dielectric constant of 12.85±0.35. This property allows for considerable miniaturization of circuit components, supporting the trend toward more compact and integrated electronic devices. In addition, the material’s low dissipation factor of 0.0019 at 10 GHz ensures minimal signal loss and improved energy efficiency, which is particularly valuable in high-speed digital and RF microwave circuits.

Our PCB Manufacturing Capabilities with TMM13i Material

We take pride in offering advanced PCB fabrication services utilizing Rogers TMM13i high-frequency laminates. Our manufacturing facilities support a wide variety of PCB configurations—including single-layer, double-layer, multilayer, and hybrid boards—to meet diverse and customized project requirements.

We provide flexible copper weight options, including 1 oz (35 µm) and 2 oz (70 µm), to address specific conductivity and current-carrying needs. Our processes also support multiple dielectric thicknesses, from 15 mil (0.381 mm) up to 500 mil (12.7 mm), accommodating both standard and high-power designs.

For larger format designs, we can produce PCBs with dimensions up to 400 mm x 500 mm. Additionally, we offer a variety of solder mask colors—such as green, black, blue, yellow, and red—enabling alignment with your aesthetic branding or functional identification requirements.

To ensure superior performance and longevity, we provide a comprehensive selection of surface finishes: bare copper, HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), immersion tin, immersion silver, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), and pure gold.

Applications of TMM13i High Frequency PCBs

TMM13i-based PCBs are ideally suited for a broad range of high-performance applications. These include chip testers, dielectric polarizers, lenses, filters, couplers, and various RF and microwave circuits. Their excellent electrical properties also make them a preferred material in satellite communication systems, where signal integrity and thermal stability are paramount.

Whether you are designing advanced aerospace systems, telecommunications infrastructure, or sophisticated test and measurement equipment,TMM13i High Frequency PCBs provide the reliability and performance needed to succeed in demanding environments.