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20 mil RO4003C PCB
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What Material Does the High Frequency Board Use?

  • May 25. 2022

What Material Does the High Frequency Board Use? Rogers Use More



What material does the hf board use? What boards are available? Do not know what high-frequency board materials, how to process, what are the characteristics of each material, today, Bicheng will tell you some practical information that focuse on providing high-frequency circuit board!


High frequency board refers to the special electromagnetic frequency circuit board, used in high frequency (greater than 300 MHZ frequency or wavelength is less than 1 meter) and microwave (greater than 3 GHZ frequency or wavelength is less than 0.1 meters) in the field of PCB, is on the microwave base copper clad using common rigid circuit board manufacturing method of a part of the process or the use of special processing methods and the production of circuit boards. In general, hf boards can be defined as circuit boards with frequencies above 1GHz.


With the rapid development of science and technology, more and more equipment are designed in the microwave frequency band (& GT; 1GHZ) and even millimeter wave field (30GHZ) above the application, which also means that the frequency is getting higher and higher, the substrate of the circuit board is also getting higher and higher requirements. For example, substrate materials need to have excellent electrical properties, good chemical stability, with the increase of power signal frequency in the substrate loss requirements are very small, so the importance of high frequency plate is highlighted.


The application fields of PCB high-frequency board mainly include: mobile communication products, power amplifier, low noise amplifier, etc., power splitter, coupler, duplecter, filter and other passive devices, automobile anti-collision system, satellite system, radio system and other fields. The high-frequency of electronic equipment is the development trend.



Rogers high frequency board

High frequency board material classification and processing method:


Powder ceramic filled thermosetting materials:


Rogers 4350B/4003C PCB


Arlon 25 n / 25 fr


Taconic's TLG series



Processing method:

And epoxy resin/glass woven cloth (FR4) similar processing process, but the plate is more brittle, easy to break, drilling and gong plate drill nozzle and gong knife life is reduced by 20%.


PTFE(polytetrafluoroethylene) material


Rogers RO3000 series, RT series, TMM series


Arlon AD/AR series, IsoClad series, CuClad series


Taconic RF series, TLX series, TLY series


F4B, F4BM, F4BK, TP-2 of Taixing Microwave



Processing method:


1, Cutting: must keep the protective film cutting, to prevent scratches, indentation


2, Drilling hole:


With a new drill (standard 130), a stack of the best, the pressure foot is 40psi;


The aluminum sheet is the cover plate, and then the PTFE plate is tightened with 1mm dense amine plate;


After drilling with air gun to blow out the dust in the hole;


With the most stable drilling rig, drilling parameters (basically, the smaller the hole, the faster the drilling rate, the smaller Chip load, the smaller the return rate);


Hole processing;


Plasma treatment or sodium naphthalene activation treatment is beneficial to the metallization of pores.


3, PTH inmersion copper:


After micro-etching (the micro-etching rate has been controlled by 20 micro-inches), the PTH pull starts from the oil cylinder into the plate;


If necessary, go through the second PTH, just from the predicted? The cylinder began to enter the plate;


Resistance welding.


4. Pre-treatment:


Use acid washing plate, can not use mechanical grinding plate;


After pre-treatment, baking plate (90℃, 30min), brush green oil to cure;


The baking plate is divided into three sections: one section is 80℃, 100℃, 150℃, 30min each (if oil is found on the substrate surface, you can rework: wash off the green oil and reactivate it);


5, Routing board


The white paper was laid on the PTFE board circuit surface, and the fr-4 substrate or phenolic substrate with a thickness of 1.0MM was etched to remove copper was clamped together;


High frequency plate rout plate lamination method, gong plate after the edge of the board needs to be carefully repaired and scratched by hand, strictly prevent damage to the base material and copper surface, and then use a considerable size of sulfurless paper separation, and visual detection, to reduce burr, the key is gong plate process to xiao effect is good.



The technic process:

NPTH PTFE plate processing process


Cutting - drilling - dry film - inspection - etching - corrosion inspection - welding resistance - character - tin spraying - molding - testing - final inspection - packaging - shipment


PTH PTFE plate processing process


Cutting - drilling - hole treatment (plasma treatment or sodium naphthalene activation treatment)- copper sink - plate electricity - dry film - inspection - graphic electricity - etching - corrosion inspection - resistance welding - character - tin spraying - molding - testing - final inspection - packaging - shipment



The difficulties High frequency board processing:

1. Copper sink: the hole wall is not easy to copper


2. Control of map rotation, etching, line width gap and sand hole


3. Green oil process: control of adhesion and foaming of green oil


4. Scratches on the surface of the board are strictly controlled in each process.


The above is about what kind of materials high-frequency board with some introduction, high-frequency board material selection I believe we have their own thoughts? In this Bicheng xiaobian remind the selection of materials to choose a good PCB manufacturer oh, otherwise it is not able to make a beautiful board!


Finally, let me introduce a new product recently. If you are interested, please contact us for details.


Rogers DiClad 880 High Frequency PCB


Brief Introduction

Rogers DiClad 880 PCBs are woven fiberglass reinforced, PTFE-based composites (without ceramic fillers) that offer lower dielectric constant and dissipation factors by using fewer plies of woven fiberglass and a higher ratio of PTFE content. Their DK and DF value are similar to RT/duroid 5880.


The dielectric constant of the circuit boards is adjusted by the precise control of the woven fiberglass and PTFE mixed ratio. The more the fiberglass, the larger the dielectric constant, however, the size stability is better. The woven fiberglass in the boards is stacked in the same direction to keep the performance of the XY direction consistent. Because of the use of woven fiberglass reinforcement, the size stability is better than RT/duroid 5880 and RT/duroid 5870 in the XY direction, but their thermal expansion coefficient in the Z-axis direction is larger.


Features:

1. Extremely Low Loss Tangent at 0.0009

2. Excellent Dimensional Stability

3. Product Performance Uniformity


Benefits:

1. Electrical Properties are Highly Uniform Across Frequency

2. Consistent Mechanical Performance

3. Excellent Chemical Resistance


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