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Home High Frequency PCB Rogers DiClad 880 High Frequency PCB 20mil 30mil 60mil with Gold, Tin and Silver

Rogers DiClad 880 High Frequency PCB 20mil 30mil 60mil with Gold, Tin and Silver

The dielectric constant of the circuit boards is adjusted by the precise control of the woven fiberglass and PTFE mixed ratio.



  • Item NO.:

    BIC-201-v155.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers DiClad 880 High Frequency PCB 20mil 30mil 60mil with Gold, Tin and Silver

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction:


Rogers DiClad 880 PCBs are woven fiberglass reinforced, PTFE-based composites (without ceramic fillers) that offer lower dielectric constant and dissipation factors by using fewer plies of woven fiberglass and a higher ratio of PTFE content. Their DK and DF value are similar to RT/duroid 5880.


The more the fiberglass, the larger the dielectric constant, however, the size stability is better. The woven fiberglass in the boards is stacked in the same direction to keep the performance of the XY direction consistent. Because of the use of woven fiberglass reinforcement, the size stability is better than RT/duroid 5880 and RT/duroid 5870 in the XY direction, but their thermal expansion coefficient in the Z-axis direction is larger.


Features:

1.   Extremely Low Loss Tangent at 0.0009

2.   Excellent Dimensional Stability

3.   Product Performance Uniformity


Benefits:

1.   Electrical Properties are Highly Uniform Across Frequency

2.   Consistent Mechanical Performance

3.   Excellent Chemical Resistance


Typical Applications:

1.   Commercial Phased Array Networks

2.   Digital Radio Antennas

3.   Filters, Couplers, LNAs

4.   Low Loss Base Station Antennas

5.   Military Radar Feed Networks

6.   Missile Guidance Systems


DiClad PCB bichengpcb


Our PCB Capability (DiClad 880):


PCB Capability (DiClad 880) 
PCB Material: Woven Fiberglass Reinforced, PTFE-based Composites
Designation: DiClad 880
Dielectric constant: 2.20  (10 GHz)
Dissipation factor 0.0009 (10 GHz)
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 30mil (0.762mm),  60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..


Our Advantages:


1.   Engineering design prevents problems from occurring in pre-production;

2.   ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;

3.   AOI inspection;

4.   Powerful PCB capabilities support your research and development, sales and marketing;

5.   Delivery on time higher than 98% on-time-delivery rate;

6.   Any Layer HDI PCBs;

7.   16000㎡workshop; 30000㎡output capability per month; 8000 types of PCB's per month;

8.   Quick CADCAM checking and free PCB quotation;

9.   Diversified shipping method: FedEx, DHL, TNT, EMS;

10. No MOQ, low cost for prototypes and small runs quantity;



Appendix: Typical Properties of DiClad 880:


Property Test Method Condition DiClad 880
Dielectric Constant  @ 10 GHz IPC TM-650 2.5.5.5 C23/50 2.17, 2.20
Dielectric Constant  @ 1 MHz IPC TM-650 2.5.5.3 C23/50 2.17, 2.20
Dissipation Factor @ 10 GHz IPC TM-650 2.5.5.5 C23/50 0.0009
Dissipation Factor @ 1 MHz IPC TM-650 2.5.5.3 C23/50 0.0008
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5
Adapted
-10°C to +140°C -160
Peel Strength  (lbs.per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 1.4 x 109
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 2.9 x 106
Arc Resistance ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 267, 202
Tensile Strength (kpsi) ASTM D-882 A, 23°C 8.1, 7.5
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 237
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 357
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Density (g/cm3) ASTM D-792 Method A A, 23°C 2.23
Water Absorption (%) MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
E1/105 + D24/23 0.02
Coefficient of Thermal IPC TM-650 2.4.24 0°C to 100°C
Expansion (ppm/°C) Mettler 3000
X  Axis Thermomechanical 25
Y Axis Analyzer 34
Z Axis 252
Thermal Conductivity(W/mK) ASTM E-1225 100°C 0.261
Outgassing NASA SP-R-0022A 125°C, ≤ 10-6torr
Total Mass Loss (%) Maximum 1.00% 0.01
Collected Volatile Maximum 0.10% 0.01
Condensable Material (%)
Water Vapor Regain (%) 0.01
Visible Condensate (±) NO
FlammabilityUL File E 80166 UL 94 Vertical Burn IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements ofUL94-V0



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