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20 mil RO4003C PCB
20 mil RO4003C PCB
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Why Should You Go with Rogers Printed Circuit Boards?

  • March 08. 2023
Rogers PCB is a high-frequency board made from raw materials produced by Rogers. It differs from standard PCB boards in that it contains epoxy resin (FR4). It does not have a glass fiber in the middle and the high-frequency material is a ceramic base. Rogers has a higher dielectric constant and is more stable at high temperatures. Its dielectric constant thermal expansion coefficient is very similar to copper foil, and it can be used to compensate for the shortcomings of PTFE substrates. It is particularly well suited to high-speed electronic design, commercial microwave, and radio frequency applications. Its low water absorption makes it ideal for high-humidity applications, supplying customers in the high-frequency board industry with the highest quality materials and related resources, thereby fundamentally improving product quality.

The low dielectric loss characteristics of the ROGERS 4003C PCB and 4350B are exceptional. As a result, they are a less expensive and more processable high-frequency material option than PTFE. They are widely used in antennas and power amplifiers for cellular base stations, microwave point-to-point connections (P2P), automotive radars and sensors, radio frequency identification (RFID), direct broadcast satellite high-frequency head (LNB), and other fields. Furthermore, the thermal expansion coefficient of the X and Y axes is comparable to that of copper. The Z-axis expansion coefficient is much lower than FR4 (46ppm/℃) and the Tg value is higher (>280℃), ensuring good thermal stability.

RO4003C RF PCB


When the operating frequency of the circuit exceeds 500MHz, the materials available to design engineers are significantly reduced. Rogers RO4350B material enables RF engineers to easily design circuits such as network matching and transmission line impedance control. RO4350B material outperforms ordinary circuit raw materials in high-frequency applications due to its low dielectric loss characteristics. It has the lowest dielectric constant with temperature variation among comparable materials. Its dielectric constant is relatively stable over a wide frequency range, at 3.48; the recommended design value is 3.66. LoPra copper foil has a low insertion loss, making it suitable for broadband applications.


Bicheng always has all the thickness and specifications of RO4003C, RO3003C, RO4350B, RO5880, Duroid RO5870 PCB, and RO4450F  prepregs, which can meet your immediate response needs. We have rich experience in RFID data process engineering and a complete high-frequency material processing control system to ensure product design functions.


Rogers 5870 PCB


Rogers is a PCB prototyping circuit board that has a specific technical threshold, is difficult to operate, and is costly. General PCB factories rarely fulfill orders due to the troublesome production methods and the small number of customer orders. RayMing is a Rogers high-frequency PCB prototype manufacturer that can meet customers' various high-frequency PCB needs. It currently has 410 pure ceramic pressure layers and 412 mixed pressure layers.


As 5G technology progresses, an increasing number of devices require high-performance high-frequency PCBs and RF PCBs with low signal losses and electrical noise. Rogers PCB materials are inexpensive and meet all technological requirements.


RO3000 series: The following high-frequency laminates are based on ceramic-filled PTFE circuit materials: RO3003, RO3006, RO3010, and RO3035.


RT6000 series: Based on ceramic-filled PTFE circuit materials, this series is intended for electronic and microwave circuits that require high dielectric constants. The models are as follows: RT6006 dielectric constant 6.15, RT6010 dielectric constant 10.2.


TMM series: composite materials based on ceramics, hydrocarbons, and thermosetting polymers. TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, and many more models are available.

3001 Bonding Film (Thermoplastic Chloro-fluorocopolymer)
RO3000® series High-Frequency Laminates (PTFE/Ceramic)
RO3035® series High-Frequency Laminates (PTFE/Ceramic)
RO3200® series High-Frequency Laminates (PTFE/Ceramic)
RO4000® High-Frequency Laminate with TICER Foil
RO4000® laminates datasheet and fabrication guidelines: RO4003C, RO4350B
RO4400® prepreg datasheet and fabrication guidelines: RO4450B, RO4450F
RO4500® Antenna Grade Laminates for High Volume Applications
RT/duroid® 5870/5880 Glass Microfiber Reinforced PTFE Composites
RT/duroid® 6002 laminate datasheet
RT/duroid® 6006/6010 laminate datasheet
RT/duroid® 6202 laminate datasheet
RT/duroid® 6202PR laminate datasheet
TMM Thermoset laminate datasheet: TMM3, TMM4, TMM6, TMM10, TMM10i

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