Call Us Now ! Tel : +86 755 27374946
Order Online Now ! Email : info@bichengpcb.com
RO4003C PCBs are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance.
Item NO.:
BIC-005-v3.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
GreenShipping Port:
ShenzhenLead Time:
7-10 daysRogers 4003 60mil 1.524mm Circuit Board RO4003C High Frequency PCB Double Sided RF PCB for WLAN
The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. RO4003C material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4003C material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.
The
temperature coefficient of dielectric constant is among the lowest of any circuit
board material, and the dielectric constant is stable over a broad frequency
range. RO4003C material's thermal
coefficient of expansion(CTE) provides several key benefits to the PCB
designers. The expansion coefficient of RO4003C is similar to that of copper
which allows the material to exhibit excellent dimensional stability, a
property needed for mixed dielectric multi-layer boards constructions. The low
Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in
severe thermal shock applications. RO4003C material has a Tg of >280C so its
expansion characteristics remain stable over the entire range of PCB processing
temperatures.
PCB Specifications:
PCB SIZE | 84 x 78mm=1PCS |
BOARD TYPE | RF PCB, Microwave PCB |
Number of Layers | Double sided PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 35um(1oz)+PLATE |
RO4003C 60mil | |
copper ------- 35um(1oz)+PLATE | |
TECHNOLOGY | |
Minimum Trace and Space: | 10mil/12mil |
Minimum / Maximum Holes: | 0.3/2.3mm |
Number of Different Holes: | 4 |
Number of Drill Holes: | 155 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control | NO |
BOARD MATERIAL | |
Glass Epoxy: | RO4003C 60mil, Tg 288℃ |
Final foil external: | 1.5oz |
Final foil internal: | 0oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel) |
Solder Mask Apply To: | no Solder mask reqruied |
Solder Mask Color: | no solder mask required |
Solder Mask Type: | no solder mask reqruied |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | no silkscreen required |
Colour of Component Legend | no silkscreen required |
Manufacturer Name or Logo: | no silkscreen required |
VIA | Plated Through Hole(PTH) |
FLAMIBILITY RATING | N/A |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Typical applications are as follows:
Data
Sheet of Rogers 4003C (RO4003C):
Property | RO4003C | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ |
0.0027 0.0021 |
Z |
10
GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus |
19,650(2,850) 19,450(2,821) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Tensile Strength |
139(20.2) 100(14.5) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Flexural Strength |
276 (40) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.3 | X,Y |
mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
11 14 46 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 425 | ℃ TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % |
48hrs
immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength |
1.05 (6.0) |
N/mm (pli) |
after
solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
Flammability | N/A | UL 94 | |||
Lead-free Process Compatible | Yes |
MANUFACTURING PROCESS:
BICHENG PCB CERTIFICATE:
If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Rogers TMM4 PCB 30mil 0.762mm 2-layer High Frequency Circuit Board
RT/duroid 6010.2LM PCB 0.254mm Rogers 10mil 2-layer high Frequency Laminates Immersion Silver Surface Finish
RO4350B PCB 3-layer 1.7mm RO4450F Bondply Material Multilayer Laminates ENIG Surface Finish
Rogers RO4003C PCB 4-layer 0.7mm Thick RO4450F Bondply Multilayer ENIG High Frequency Laminates
Rogers RO3203 PCB 30mil 2-layer Immersion Silver High Frequency Circuit Materials
Rogers RO3035 PCB 20mil Laminate 2-layer High Frequency Circuit Board
RF-35 PCB 60mil 1.524mm Taconic laminates 2-layer High Frequency Circuit Board
F4BTME298 PCB 60mil 1.524 mm 2-layer F4BTME Series High Frequency Circuit Boards
© Copyright: 2024 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported