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Home Rogers PCB Board Rogers 4003 60mil 1.524mm RO4003C High Frequency RF PCB

Rogers 4003 60mil 1.524mm RO4003C High Frequency RF PCB

RO4003C PCBs are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance.

  • Item NO.:

    BIC-005-v3.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 100/$99
  • Product Origin:

    China
  • Color:

    Green
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers 4003 60mil 1.524mm Circuit Board RO4003C High Frequency PCB Double Sided RF PCB for WLAN


The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and aboveRO4003C material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4003C material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials. 

 

 2 Layer 60mil RO4003C PCB

 

The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range.  RO4003C material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4003C is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4003C provides reliable plated through-hole quality, even in severe thermal shock applications. RO4003C material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.


RO4003C PCB


PCB Specifications:

PCB SIZE 84 x 78mm=1PCS
BOARD TYPE RF PCB, Microwave PCB
Number of Layers Double sided PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1oz)+PLATE
RO4003C 60mil
copper ------- 35um(1oz)+PLATE
TECHNOLOGY
Minimum Trace and Space: 10mil/12mil
Minimum / Maximum Holes: 0.3/2.3mm
Number of Different Holes: 4
Number of Drill Holes: 155
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
BOARD MATERIAL
Glass Epoxy:  RO4003C 60mil, Tg 288
Final foil external:  1.5oz
Final foil internal:  0oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING
Surface Finish Electroless nickel over Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel)
Solder Mask Apply To:  no Solder mask reqruied
Solder Mask Color:  no solder mask required
Solder Mask Type: no solder mask reqruied
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend no silkscreen required
Colour of Component Legend no silkscreen required
Manufacturer Name or Logo:  no silkscreen required
VIA Plated Through Hole(PTH)
FLAMIBILITY RATING N/A
DIMENSION TOLERANCE
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


 

Typical applications are as follows:


RO4003C PCB

 

 

Data Sheet of Rogers 4003C (RO4003C):


Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z 10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z 10 GHz/23
2.5 GHz/23
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/ -50to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150 IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/ -55to288 IPC-TM-650 2.4.41
Tg >280 TMA A IPC-TM-650 2.4.24.3
Td 425 TGA ASTM D 3850
Thermal Conductivity 0.71 W/M/oK 80 ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50
ASTM D 570
Density 1.79 gm/cm3 23 ASTM D 792
Copper Peel Stength 1.05
(6.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-free Process Compatible Yes

MANUFACTURING PROCESS:

 

PTE PCB manufacturing process


BICHENG PCB WORKSHOP:

 

BICHENG PCB


BICHENG PCB CERTIFICATE:


BICHENG PCB

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