Taconic RF-10 PCB 2-layer 20mil 0.508mm High Frequency Substrate Immersion silver

Taconic RF-10 PCB 2-layer 20mil 0.508mm High Frequency Substrate Immersion silver

Introducing our RF-10 2-layer 20mil PCB, a cutting-edge solution tailored for high-frequency RF applications that demand exceptional performance, stability, and cost-effectiveness. Built on RF-10 copper clad laminates—a composite of ceramic-filled PTFE and woven fiberglass—this PCB redefines reliability in critical electronic systems, offering a perfect balance of technical excellence and economic value.

Core Substrate: RF-10 Laminates Advantage

At the heart of this Taconic RF PCB lies the20milRF-10 substrate, engineered to address the evolving needs of RF applications. Composed of ceramic-filled PTFE and thin woven fiberglass reinforcement,TaconicRF-10 delivers a high dielectric constant (DK) for circuit size reduction, low dissipation factor for minimal signal loss, and enhanced rigidity for easy handling and superior dimensional stability—critical for multilayer and high-frequency designs. It bonds seamlessly to smooth low-profile copper, ensuring optimal insertion loss at higher frequencies where skin effect losses are prominent, while maintaining industry-competitive delivery times and cost efficiency.

Product Features: Unmatched Technical Specifications

The RF-10 2-layer PCB boasts outstanding technical attributes that set it apart in the market:

1) Dielectric Performance: Dielectric Constant of 10.2±0.3 at 10GHz with a low Dissipation Factor of 0.0025 at the same frequency, ensuring stable signal transmission.

2) Thermal & Mechanical Stability:High Thermal Conductivity (0.85 W/mk unclad) for efficient heat management; low X/Y/Z CTE (16/20/25 ppm/°C) and minimal Moisture Absorption (0.08%) for long-term reliability.

3) Safety & Durability:Flammability Rating of V-0, meeting strict safety standards for critical applications.

Key Benefits: Driving Application Excellence

This Taconic PCB Materials translates technical features into tangible value for users:

1) Size Optimization:High DK enables significant RF circuit miniaturization, ideal for space-constrained devices.

2) Reliability:Tight DK tolerance, excellent dimensional stability, and low expansion rates ensure consistent performance in harsh environments.

3) Cost-Efficiency: Offers an exceptional price/performance ratio, balancing high-end performance with affordability.

4) Thermal Management:High thermal conductivity prevents overheating, extending component lifespan.

Detailed Technical Specifications

1. PCB Construction Details

Summarizes core manufacturing parameters, including material, dimensions, and quality control measures.

2. PCB Stackup

Outlines the layered structure of the 2-layer rigid PCB, ensuring clarity on material distribution.

3. PCB Statistics

Presents key data on components, pads, and connections, supporting assembly and design planning.

Supplementary Information

• Artwork Type: Gerber RS-274-X, ensuring compatibility with standard manufacturing processes.
• Quality Standard: Complies with IPC-Class-2, meeting industry benchmarks for quality and consistency.
• Availability: Globally accessible, supporting worldwide production and supply chain needs.

Target Applications

Designed to excel in high-demand RF and aerospace scenarios:

• Microstrip Patch Antennas & GPS Antennas
• Passive Components (filters, couplers, power dividers)
• Aircraft Collision Avoidance Systems
• Satellite Components

The RF-10 Taconic high frequency PCB is more than a circuit board—it’s a reliable foundation for next-generation RF technology, combining precision engineering, cost-effectiveness, and global availability to empower your most critical applications.