RO4350B PCB 2-Layer 1.524mm 60mil ENIG Rogers 4350B No Solder Mask White Silkscreen

RO4350B PCB 2-Layer 1.524mm 60mil ENIG Rogers 4350B No Solder Mask White Silkscreen

Designed for demanding radio frequency (RF) and high-frequency applications, our RO4350B 2-Layer PCB combines cutting-edge material science with precise manufacturing to deliver exceptional electrical performance, reliability, and cost efficiency. Built on Rogers’industry-leading 1.524 mm RO4350B substrate—a proprietary woven glass-reinforced hydrocarbon/ceramic composite—this RO4350B PCB  bridges the gap between high-performance PTFE-based materials and cost-effective epoxy/glass substrates, making it ideal for applications requiring tight dielectric control, low loss, and robust manufacturability.

PCB Construction Details

Below is a comprehensive overview of the RO4350B 60mil PCB’s core construction parameters, ensuring clarity on dimensional accuracy, material specifications, and manufacturing standards.

PCB Stackup

The 2-layer rigid RF PCB features a streamlined, optimized stackup to maximize signal integrity and thermal performance.

PCB Statistics

Key statistical data highlighting the RO4350B Frequency PCB’s design complexity and connectivity features:

Material Excellence: Rogers RO4350B

At the heart of this PCB is Rogers RO4350B, a laminate engineered to deliver exceptional electrical performance without sacrificing manufacturability. Unlike PTFE-based materials, which require specialized processing and handling, Rogers 4350B uses standard epoxy/glass manufacturing workflows, reducing production complexity and costs. Its proprietary composition ensures tight dielectric constant (Dk) control—3.48±0.05 at 10GHz/23°C—and a low dissipation factor of 0.0037 at 10GHz, critical for minimizing signal loss in high-frequency designs.

RO4350B high frequency PCB also excels in thermal and mechanical stability: it boasts a high glass transition temperature (Tg) of >280°C, low water absorption (0.06%), and a UL 94 V-0 flammability rating, making it suitable for high-power RF devices and harsh operating environments. Its controlled coefficient of thermal expansion (CTE)—10 ppm/°C (X-axis), 12 ppm/°C (Y-axis), and 32 ppm/°C (Z-axis)—ensures reliability under thermal cycling, a must for automotive and aerospace applications.

Features & Applications

This Rogers PCB leverages RO4350B’s strengths to address diverse high-frequency needs:

1) Superior Signal Integrity: Tight Dk control and low loss enable consistent performance in 5G, radar, and satellite communications.

2) Robust Manufacturing: Compatible with standard PCB processes, reducing lead times and costs.

3) Durability: UL 94 V-0 rating and low water absorption ensure longevity in harsh conditions.

Typical applications

This custom RO4350B ENIG PCB’s typical applicationsinclude:

• Cellular base station antennas
• Power amplifiers
• RF identification (RFID) tags
• Automotive radar systems
• Low-noise blocks (LNBs) for direct broadcast satellites.

Quality & Availability

Manufactured to IPC-Class 2 standards, this Rogers RO4350B PCB meets rigorous quality benchmarks for reliability and performance. Artwork is supplied in Gerber RS-274-X format, ensuring compatibility with most design software. Available worldwide, it offers global customers a trusted solution for high-frequency projects requiring a balance of performance, cost, and ease of integration.

Whether for next-gen wireless infrastructure or advanced automotive sensors, our RO4350B 2-Layer 60mil PCB delivers the precision and reliability your high-frequency designs demand.