RO3003 PCB 2-layer 50mil 1.27mm Rogers 3003 ENIG No Solder Mask Black Silkscreen

RO3003 PCB 2-layer 50mil 1.27mm Rogers 3003 ENIG No Solder Mask Black Silkscreen

The RO3003 2-layer 50 mil PCB is a high-performance printed circuit board tailored for commercial microwave and RF applications. Leveraging Rogers RO3003 ceramic-filled PTFE composite material, it delivers exceptional dielectric stability, low loss, and reliable mechanical properties, making it an ideal choice for high-frequency scenarios up to 77 GHz. Below is a detailed breakdown of its technical specifications, material characteristics, and application values.

PCB Construction Details

The following table comprehensively presents the key construction parameters of the 2 Layer Rogers RO3003 PCB, covering base material, dimensions, electrical performance, and manufacturing standards.

PCB Stackup

The 2-layer rigid Rogers PCB adopts a simple yet efficient stackup structure, ensuring stable signal transmission and mechanical performance.

PCB Statistics

The statistical data below reflects the component layout and connection design characteristics of the Rogers 3003 PCB, providing a clear reference for assembly and application.

Material Overview: Rogers RO3003

Rogers RO3003 high-frequency laminates are ceramic-filled PTFE composites dedicated to commercial microwave and RF applications. A standout advantage is their excellent dielectric constant (Dk) stability across different temperatures and frequencies, eliminating the step change in Dk near room temperature that is common in PTFE glass materials. This unique property makes it perfectly suited for cutting-edge applications such as 77 GHz automotive radar, advanced driver assistance systems (ADAS), and 5G wireless infrastructure (mmWave).

Core Features

• Material: Rogers RO3003 ceramic-filled PTFE composites
• Dielectric constant: 3±0.04 at 10 GHz/23°C
• Dissipation factor: 0.001 at 10 GHz/23°C
• Decomposition temperature (Td): >500°C
• Thermal Conductivity: 0.5 W/mK
• Moisture Absorption: 0.04%
• Coefficient of Thermal Expansion (-55 to 288°C): X axis 17 ppm/°C, Y axis 16 ppm/°C, Z axis 25 ppm/°C

Product Benefits

1) Low dielectric loss enables application in scenarios up to 77 GHz, meeting high-frequency transmission requirements.

2) Excellent mechanical properties against temperature fluctuations support reliable stripline and multi-layer board constructions.

3) Uniform mechanical properties across a range of dielectric constants: ideal for multi-layer board designs with varying dielectric constants and suitable for hybrid designs with epoxy glass multi-layer boards.

4) Stable dielectric constant with temperature and frequency: an optimal choice for band pass filters, microstrip patch antennas, and voltage controlled oscillators.

5) Low in-plane expansion coefficient (matching copper): ensures more reliable surface mounted assemblies, fits applications sensitive to temperature changes, and provides excellent dimensional stability.

6) Adopts volume manufacturing process, offering economical laminate pricing and cost-effectiveness.

Typical Applications

The RO3003 50 mil substrate PCB is widely applicable in multiple high-frequency fields, including:

• Automotive radar applications
• Global positioning satellite antennas
• Cellular telecommunications systems (power amplifiers and antennas)
• Patch antennas for wireless communications
• Direct broadcast satellites
• Datalink on cable systems
• Remote meter readers
• Power backplanes

Additional Key Information

• Type of artwork supplied: Gerber RS-274-X
• Accepted standard: IPC-Class-2, ensuring compliance with industry quality requirements
• Availability: Worldwide supply, facilitating global project deployment and procurement

Conclusion

In summary, the RO3003 high frequency PCB combines superior material performance, precise manufacturing, and wide applicability. It is a high-quality, cost-effective solution for customers in RF, microwave, automotive electronics, and 5G communication industries, effectively supporting the development and production of high-performance electronic products.