WanglingWL-CT440 PCB Double-sided 10mil Immersion Silver High Frequency Board
The WL-CT440, a precision-engineereddouble-sided printed circuit board designed for high-frequency and high-reliability applications. Fabricated on Wangling WL-CT440 low-loss, ceramic-filled hydrocarbon resin laminate, this Wangling PCB delivers superior electrical performance, exceptional thermal stability, and robust mechanical characteristics, making it an ideal solution for RF communications, aerospace systems, and advanced radar technologies. Unlike standard FR-4, the WL-CT440 material offers a stable dielectric constant (Dk) and an extremely low dissipation factor (Df), minimizing signal loss and phase distortion at high frequencies.
PCB Construction Details
The following table summarizes the core physical and manufacturing specifications of the WL-CT440 PCB.
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Feature
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Specification
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Layer Count
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2-layer
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Base Material
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WL-CT440
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Board Dimensions
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56.5mm x 89.65mm =1PCS,+/- 0.15mm
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Min. Trace Width / Space
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6 mils / 7 mils
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Min. Finished Hole Size
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0.35mm
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Via Structure
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Through-Hole Vias Only (No Blind/Buried)
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Finished Board Thickness
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0.3mm (≈11.8 mils)
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Finished Copper Weight (Outer)
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1 oz (35 μm, 1.4 mils)
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Via Plating Thickness
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20 μm (min)
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Surface Finish
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Immersion Gold
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Top Silkscreen Legend
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White
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Bottom Silkscreen Legend
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None
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Top Solder Mask
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Green
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Bottom Solder Mask
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None
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Electrical Test
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100% Electrical test used prior to shipment
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PCB Stackup
This 2-layer board employs a simple yet highly controlled symmetric stackup to ensure consistent impedance and performance.
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Layer
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Material
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Thickness
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Layer 1
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Copper (Electrodeposited)
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35 μm / 1 oz
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Core
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WL-CT440 Laminate
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0.254 mm / 10 mil
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Layer 2
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Copper (Electrodeposited)
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35 μm / 1 oz
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PCB Statistics
The design utilization and component placement data for the 0.254mm WL-CT440 PCB are as follows.
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Item
|
Quantity
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Total Components
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23
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Total Pads
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56
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Through-Hole Pads
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30
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Surface-Mount Pads (Top Side)
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26
|
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Surface-Mount Pads (Bottom Side)
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0
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Total Vias
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32
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Total Nets
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2
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Material Introduction & Key Features
The WL-CT440 laminate is a thermosetting, ceramic-filled hydrocarbon resin system reinforced with fiberglass cloth. It is engineered to provide a high-performance, process-friendly alternative to PTFE-based materials, offering FR-4-like manufacturability with vastly superior high-frequency characteristics. Its key attributes include:
1) Stable Electrical Properties: A dielectric constant (Dk) of 4.1 and an ultra-low dissipation factor (Df) of 0.005 at 10 GHz ensure minimal signal attenuation and phase stability.
2) Exceptional Thermal & Mechanical Stability: With a Tg > 280°C, a low and stable Temperature Coefficient of Dk (TCDk≈-21 ppm/°C), and a CTE closely matched to copper, it provides outstanding reliability under thermal stress.
3) Robust Operational Characteristics: Features include low moisture absorption (0.12%), high thermal conductivity (0.66 W/mK), and a UL-94 V0 flammability rating.
Manufacturing & Supply
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Artwork Format: Gerber RS-274-X
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Quality Standard: Manufactured and inspected per IPC-A-600 Class 2 acceptability criteria.
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Availability: Supported by a global supply chain for prototype and production volumes.
Typical Applications
This combination of board design and material excellence makes the WL-CT440 high Frequency PCB perfectly suited for:
- Aerospace equipment, space, cabin equipment, aircraft
-Microwave, antenna, phase-sensitive antenna
-Early warning radar, airborne radar,.
-Phased array antenna, beam wave network
-Satellite communication, navigation
-Power amplifier
In summary, this 10mil WL-CT440 PCB represents a convergence of advanced material science and precision manufacturing, offering a reliable, high-performance foundation for next-generation electronic systems operating in demanding frequency and environmental regimes.
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