TP960 PCB 2-layer 19.6mil DK9.6 ENIG TP Series Bare High Frequency Laminate

TP960 PCB 2-layer 19.6mil DK9.6 ENIG TP Series Bare High Frequency Laminate

The TP960 PCB represents a sophisticated and application-specific solution for demanding high-frequency and microwave circuits. Engineered for stability and performance in critical environments, this double-sided board leverages the unique properties of the TP PCB series thermoplastic material to deliver consistent electrical characteristics where conventional FR-4 materials fall short. Featuring an Electroless Nickel Immersion Gold (ENIG) surface finish, it provides an excellent combination of surface planarity, oxidation resistance, and reliable solderability, making it ideal for both assembly and long-term reliability.

PCB Construction Details

The table below summarizes the fundamental physical and manufacturing specifications of the 19.6mil TP960 PCB, highlighting its precision engineering for high-frequency applications.

PCB Stackup

This DK9.6 PCB utilizes a simple yet effective two-layer stackup, with a homogeneous TP960 core providing stable dielectric properties. The stackup is detailed in the following table.

PCB Statistics

The board's design complexity is captured in the following statistical breakdown of its features and connectivity.

Material Technology: TP Series Introduction

The TP PCB substrate series is a groundbreaking family of high-frequency thermoplastic materials. Unlike traditional reinforced laminates, the dielectric layer of TP PCB materials is composed of a ceramic-filled polyphenylene oxide (PPO) resin system without fiberglass reinforcement. This unique composition allows for precise tuning of the dielectric constant (Dk) by adjusting the ceramic-to-resin ratio. The manufacturing process is specialized, yielding a substrate with exceptional dielectric consistency, low loss, and high reliability across a broad frequency spectrum. The nomenclature indicates the cladding: TP is the bare laminate, TP-1 is single-sided clad, and TP-2 is double-sided clad, as used in this product. The Dk can be tailored from 3.0 to 25.0, with common grades such as TP300 (Dk~3.0), TP440 (Dk~4.4), TP960 (Dk~9.6), and TP2000 (Dk~20).

TP960 Material Key Features

The TP960 PCB material, with a nominal dielectric constant of 9.6, offers a suite of properties critical for stable high-frequency operation:

1) Stable Dielectric Constant: Dk of 9.6±0.19 at 10 GHz, ensuring predictable impedance and phase response.

2) Ultra-Low Loss: Dissipation factor (Df) of 0.0012 at 10 GHz minimizes signal attenuation.

3) Excellent Thermal Stability: A low thermal coefficient of Dk (TCDk) of -40 ppm/°C from -55°C to +150°C maintains electrical performance across extreme temperatures.

4) Controlled Thermal Expansion: Coefficients of Thermal Expansion (CTE) are tightly controlled (X/Y: 40 ppm/°C, Z: 55 ppm/°C), enhancing reliability during thermal cycling.

5) Good Thermal Management: Thermal conductivity of 0.65 W/mK aids in heat dissipation.

6) High Reliability: Minimal moisture absorption (0.01%) and a UL 94-V0 flammability rating ensure robustness in harsh conditions.

Typical Applications

This combination of material properties and PCB construction makes the TP960 high frequency PCB ideally suited for advanced electronic systems where performance cannot be compromised, including:

• Global Satellite Navigation System (GNSS) receivers and antennas
• Missile-borne guidance and telemetry electronics
• Fuze and radar proximity sensor technology
• Miniaturized, high-performance antennas and antenna feeder networks

Quality & Documentation

This product is manufactured in compliance with IPC-6012 Class 2 requirements for rigid printed boards. All production files were supplied in the industry-standard Gerber RS-274-X format. The board is available for sourcing worldwide, supported by full traceability and a certificate of conformity.

In summary, the TP960 2-Layer PCB is a high-performance, application-specific circuit solution that marries the exceptional and stable dielectric properties of TP960 high DK PCB material with precise, high-reliability manufacturing. Its design supports dense RF circuitry, making it an optimal choice for developers and engineers working on the forefront of microwave and defense technology.