• September 03. 2026

Which RF Applications Suit TF960 PCB? A Dk 9.6 Low-Loss Selection Guide Quick Answer TF960 PCB is a high-frequency laminate made from modified PTFE resin, ceramic fillers, and glass fabric. With a dielectric constant (Dk) of 9.6 ± 0.19 and dissipation factor (Df) of 0.0012 at 10 GHz, it targets RF and microwave circuits requiring low insertion loss and stable impedance. It supports 260°C lead-free...

• September 04. 2026

Why Choose a 4-Layer 5mil RT6202+FR-4 Hybrid PCB for High-Frequency RF Designs? Introduction When designing RF and microwave circuits above 3 GHz, engineers face a persistent dilemma: standard FR-4 substrates introduce unacceptable signal loss and dielectric instability, while fully Rogers-based multilayer boards carry prohibitive material costs for digital and power sections. A 4-layer 5mil RT620...

• October 22. 2026

Is a 4-Layer 8mil RO4003C Tg170 FR-4 Hybrid PCB Right for You? Every mixed-signal design eventually reaches the same decision. One section of the board carries RF or microwave traces — antenna feeds, matching networks, a front-end that must hit a defined impedance — while the rest is ordinary power and digital control. The material question follows immediately: all FR-4, all high-frequency laminat...

• October 22. 2026

How to Select 1080 Prepreg for Rogers RO3010 and FR-4 Hybrid Lamination? Introduction Hybrid multilayer PCBs that pair ceramic-filled PTFE high-frequency laminates such as Rogers RO3010 with conventional FR-4 prepreg have become a standard construction for cost-sensitive RF designs. Place the premium high-Dk material only where RF signals travel, and use economical FR-4 bonding sheets elsewhere. Y...