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How to Distinguish the Step (Stack-up) of HDI PCB? Tag#Stacked via Staggered via HDI | PCB 1+N+1 HDI PCB | 2+N+2 HDI PCB HDI stands for high density interconnection. It contains non-mechanical drilling, the ring of microvias and blind via below 6 mil, internal and external layers of track width, track gap below 4 mil, pad diameter is not more than 0.35 mm. We call this kind of multi-layer PCB...
RT/duroid 6035HTc high-frequency circuit material is a ceramic-filled PTFE composite material used in high-power radio frequency and microwave equipment. The thermal conductivity of RT/duroid 6035HTC laminate is 2.4 times that of standard RT/duroid 60o0 products, and the copper foil (electrolytic copper and reverse copper) used has long-term thermal stability, which is ideal for high-power device ...
Summary of the classification of pcb circuit boards, detailed introduction of the use and characteristics of single-sided circuit boards, double-sided circuit boards, and multi-layer circuit boards. PCB circuit board classification PCB circuit boards are divided into single-sided circuit boards, double-sided circuit boards, and multilayer circuit boards according to the number of superimposed laye...
With the rapid development of electronic communication technology, in order to achieve high-speed and high-frequency signal transmission, more and more high-frequency printed circuit boards are used in communication equipment. The dielectric materials used in high-frequency boards have excellent electrical properties and good Chemical stability, then which of the following is its main manifestatio...
Rogers RO3006 laminate is a ceramic filled PTFE composite designed for commercial microwave and radio frequency applications. These high-frequency circuit materials have excellent mechanical and electrical properties, making them stable and reliable. RO3006 material provides a stable dielectric constant, which helps to eliminate dielectric constant variation. These materials have stable mechanical...
Choosing the Right RF PCB Material When designing RF PCBS applications, the choice of PCB substrate materials is a key performance factor. For complex microwave structures that are mechanically reliable and electrically stable, an optimal combination of electrical and mechanical properties is required. The extremely low dielectric constant thermal coefficient provides the electrical stability soug...
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