• May 21. 2025

Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs Introduction In high-speed PCB design, signal integrity is paramount. As data rates increase, crosstalk—unwanted electromagnetic coupling between traces—becomes a critical challenge. A well-optimized multilayer stackup is essential to minimize crosstalk while ensuring signal integrity, power delivery, and manufacturability. This ar...

• July 04. 2025

Looking for Reliable PTFE PCBs? What makes F4BM PCB Stand Out? Brief introduction Wangling F4BM high frequency materials are PTFE glass fiber cloth copper clad laminates that combine glass fiber cloth,PTFE resin, andPTFE film through a meticulous manufacturing process. These F4BM series laminates offer improved electrical performance compared to F4B due to their wider range of dielectric...

• August 04. 2025

How Rogers RT/duroid 6010.2LM Achieves Ultra-Low Loss and Stable 10.2 Dk for Compact X-Band PCBs Introduction In the rapidly advancing world of high-frequency electronics, achieving optimal performance demands specialized materials engineered for precision and reliability. Rogers Corporation's RT/duroid 6010.2LM laminates stand at the forefront of this technology, offering an exceptional ceramic-P...