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  • The development status of global PCB industry segmented products
    The development status of global PCB industry segmented products
    • December 30, 2021

    The development status of global PCB industry segmented products "With the accelerated investment and expansion of China's fabs and the advancement of the independent and controllable national strategy of the semiconductor industry, the domestic demand for IC substrates will grow rapidly. It is expected that the growth rate of my country's IC substrate output will be significantly higher than the international level in the future. According to the data It shows that the total operating income of my country's IC substrate industry in 2020 is about 4.035 billion yuan, a year-on-year increase of 6.07%." According to the information released by the research report network, PCBs are mainly divided into hard boards (including single-layer boards, double-layer boards and multi-layer boards), HDI boards, IC substrates , flexible boards, rigid-flex boards, materials and functions And application areas are different. In recent years, with the continuous development of industries such as smart terminals, smart wearable devices, 5G and cloud computing, the market demand for flexible boards and rigid-flex boards, HDI boards, and IC substrates has continued to grow. In terms of subdivided product structure, ordinary multi-layer boards accounted for 44.77% of the PCB industry market share, HDI boards accounted for 21.23% of the market share, and flexible boards accounted for 22.62% of the PCB industry market share. IC-Substrate According to the information released by the Guanyan Report Network, IC-Substrates are developed based on HDI boards. They have the characteristics of high density, high performance, and thinness. They are an upgrade to traditional integrated circuit packaging lead frames and are used in various chip packaging links. . In recent years, as the integrated circuit industry continues to approach the direction of small size and high integration, IC packaging has also developed in the direction of ultra-multi-pin, ultra-miniaturization and narrow pitch. According to relevant data, the global IC substrate output value will reach 10.188 billion U.S. dollars in 2020, mainly due to the rapid growth of global integrated circuit sales in 2020. In the context of the rapid growth of downstream industries, the demand for IC substrates has increased substantially. In the Chinese market, with the accelerated investment and expansion of Chinese fabs and the advancement of the independent and controllable national strategy of the semiconductor industry, domestic demand for IC substrates will grow rapidly. It is expected that the growth rate of my country’s IC substrate output will be significantly higher than the international level in the future . According to data, the total operating income of my country's IC substrate industry in 2020 will be approximately 4.035 billion yuan, a year-on-year increase of 6.07%. Rigid Board Rigid boards can be divided into single-layer boards, double-layer boards and multi-layer boards. Single-layer boards are the most ba...

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