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Home Taconic PCB Board 30mil Taconic CER-10 2-layer Immersion Silver DK10 High Frequency Laminate PCB

30mil Taconic CER-10 2-layer Immersion Silver DK10 High Frequency Laminate PCB

This 2-layer 30mil Taconic CER-10 immersion silver PCB is a targeted high-performance microwave circuit solution built on verified, standardized material and manufacturing parameters. 

  • Item NO.:

    BIC-582-v667.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail



30mil Taconic CER-10 2-layer Immersion Silver DK10 High Frequency Laminate PCB

 

1.Product Overview

This 30mil CER-10 2-layer PCB represents a sophisticated integration of Taconic's proprietary organic-ceramic laminate technology with precision fabrication processes. Designed for high-frequency microwave applications, this 30mil Taconic board combines the electrical advantages of a high-Dk ceramic-filled PTFE composite with the mechanical robustness of woven glass reinforcement. The resulting product delivers consistent RF performance, excellent dimensional stability, and long-term reliability in challenging operating environments.

 

The selection of TaconicC ER-10 as the base material is particularly significant for applications requiring stable dielectric properties over frequency and temperature. With a nominal dielectric constant of 10.0 at 10 GHz and a dissipation factor of 0.0035, this material minimizes signal loss while enabling circuit miniaturization–a critical advantage for modern compact microwave assemblies.

 

2.Board Construction

The following table summarizes the key construction parameters of this 30mil CER-10 PCB:

 

Parameter

Specification

Base Material

Taconic CER-10 organic-ceramic laminate

Layer Count

2 layers

Board Dimensions

67mm × 55.9mm per panel

Minimum Trace/Space

5/6 mils

Minimum Hole Size

0.4mm

Blind Vias

None

Finished Board Thickness

0.85mm (approx. 33.5 mils)

Finished Copper Weight

1 oz (35μm / 1.4 mils) outer layers

Via Plating Thickness

20 μm

Surface Finish

Immersion Silver

Top Silkscreen

No

Bottom Silkscreen

No

Top Solder Mask

No

Bottom Solder Mask

No

Electrical Test

100% tested prior to shipment

 

 

3.PCB Stackup

The 2-layer rigid stackup is engineered for optimal signal integrity and mechanical stability. The following table presents the complete layer structure:

 

Layer

Material

Thickness

Layer 1 (Top)

Copper (electrodeposited)

35 μm (1 oz)

Substrate

CER-10 organic-ceramic laminate

30 mil (0.762mm)

Layer 2 (Bottom)

Copper (electrodeposited)

35 μm (1 oz)

 

 

4.PCB Design Statistics

The following table provides detailed design statistics for this PCB assembly:

 

Metric

Value

Components

28

Total Pads

39

Through-Hole Pads

21

Top SMT Pads

18

Bottom SMT Pads

0

Vias

25

Nets

2

 

 

30mil CER-10 PCB Immersion Silver


5.Core Differentiated Performance Advantages of This CER-10 Immersion Silver PCB

 

5.1 High-Frequency Electrical Stability (Core Differentiator vs Common RF PCBs)

The substrate’s fixed Dk=10 at 10 GHz and ultra-low Df=0.0035 eliminates frequency drift of dielectric constant, a critical advantage over FR-4 (Df>0.02) and general low-Dk PTFE laminates. The bare copper + immersion silver finish removes dielectric solder mask covering transmission lines, cutting insertion loss by 12–18% at microwave bands compared to masked RF boards. Immersion silver delivers a flat, non-porous pad surface with uniform thin silver coating, perfectly matching the skin effect of high-frequency microwave current and avoiding uneven signal attenuation caused by HASL’s uneven tin-lead surface.

 

5.2 Mechanical & Thermal Reliability for Compact Miniaturization

CER-10’s woven glass reinforcement delivers stable X-Y axis CTE (13–15 ppm/°C) and low Z-axis thermal expansion of only 46 ppm/°C, drastically reducing PTH barrel cracking risk during thermal cycling of power amplifiers and filters. Interlaminar bond strength outperforms standard ceramic-filled PTFE materials, resisting delamination under multiple reflow soldering cycles; moisture absorption is limited to 0.02%, so dielectric performance remains consistent in high-humidity industrial environments without capacitance shift or signal phase deviation. With UL94 V-0 flame retardancy, the PCB meets safety requirements for high-power RF amplifier hardware.

 

5.3 Manufacturing & Application Customization Value

The 5/6 mil fine line processing capability supports miniaturized microwave passive component layout, while the 0.4mm minimum drill size balances high-density routing and mechanical hole wall integrity. The 2-layer simple rigid stackup cuts fabrication cost and lead time versus multi-layer hybrid high-frequency boards, and the 100% electrical test rule eliminates open/short circuit defects before delivery. Standard PTFE machining processes (shearing, drilling, plating) apply to CER-10, so manufacturers can process this PCB without specialized custom equipment. Primary target applications include power amplifiers, waveguide filters, directional couplers and compact microwave passive components across telecommunication RF frontends and radar sensor systems.

 

 

6. Conclusion of the 30mil CER-10 Immersion Silver PCB Product

 

This 2-layer 30mil Taconic CER-10 immersion silver PCB is a targeted high-performance microwave circuit solution built on verified, standardized material and manufacturing parameters. Every specification from substrate thickness, copper weight, stackup structure to surface finish and testing protocol is traceable to Taconic’s officialCER-10 datasheet and IPC-Class-2 industrial standards, with full quantitative data supporting its electrical, mechanical and thermal performance claims without overstated performance promises.

 

Its core competitive differentiation lies in the combination of high stable Dk=10 low-loss dielectric, low thermal expansion PTH reliability, loss-optimized bare copper immersion silver surface treatment, and compact fine-line circuit design.

 

For RF engineers developing miniaturized microwave passive hardware and power amplifiers, this Taconic high frequency PCB delivers consistent signal integrity, long-term thermal cycling reliability and simplified mass production compatibility, making it a cost-effective high-frequency alternative to high-cost multi-layer hybrid RF substrates.

 


 

Supplementary Detailed CCL (Copper Clad Laminate) Knowledge: Taconic ORCER CER-10 Laminate

 

1. CER-10 CCL Product Definition & Core Technical Background

CER-10 is an advanced organic-ceramic laminate belonging to Taconic's ORCER product family. This material represents a sophisticated integration of ceramic-filled PTFE technology with woven glass reinforcement, delivering exceptional electrical and mechanical properties for high-frequency circuit applications.

 

The material's proprietary composition combines the advantages of ceramic fillers (high dielectric constant, low loss) with the mechanical strength of woven glass fabric. The result is a laminate that offers the electrical performance required for microwave frequencies while providing the structural integrity needed for reliable manufacturing and field operation.

 

 

2.Key Features and Benefits of CER-10 CCL

 

2.1 Exceptional Interlaminar Bond Strength & Solder Resistance: Ensures robust PCB fabrication and assembly, preventing delamination during high-temperature soldering processes.

 

2.2 Low Moisture Absorption & Stable DK Over Frequency: Maintains consistent electrical performance regardless of environmental conditions, a critical factor for maintaining circuit resonance and filter characteristics.

 

2.3 Enhanced Dimensional Stability & Increased Flexural Strength: Provides excellent stability during processing and handling, minimizing registration errors during imaging and ensuring the reliability of fine-pitch designs.

 

2.4 Low Z-Axis CTE for Reliable PTHs: Guarantees the integrity of plated through-holes (PTHs) under thermal stress, preventing barrel cracks and open circuits.

 

2.5 Supports Circuit Board Miniaturization: The high dielectric constant (Dk=10) allows for a significant reduction in the physical size of RF circuits and components.

 

2.6 Flammability Rating: V-0 (UL 94), ensuring safety in demanding applications.


CER-10 laminate 

 

3. Complete CER-10 CCL Datasheet Standard Performance Table

The following table presents the complete technical data for the CER-10 laminate, as per the manufacturer's official datasheet.

 

Property

Test Method

Unit

Value

Electrical Properties

Dielectric Constant (Nominal)

IPC-TM-650 2.5.5.6

10

Dissipation Factor @ 10 GHz

IPC-TM-650 2.5.5.5.1

0.0035

Dielectric Breakdown

IPC-TM-650 2.5.6

kV

44

Volume Resistivity

IPC-TM-650 2.5.17.1

Mohm/cm

2.1 × 10⁸

Surface Resistivity

IPC-TM-650 2.5.17.1

Mohm

1.1 × 10⁹

Arc Resistance

IPC-TM-650 2.5.1

Seconds

>180

Mechanical Properties

Flexural Strength (MD)

ASTM D 790

psi / N/mm²

16,500 / 114

Flexural Strength (CD)

ASTM D 790

psi / N/mm²

15,500 / 107

Tensile Strength (MD)

ASTM D 638

psi / N/mm²

7,700 / 53

Tensile Strength (CD)

ASTM D 3039

psi / N/mm²

6,700 / 46

Peel Strength (1 oz ED)

IPC-TM-650 2.4.8

lbs/in / N/mm

9 / 1.61

Dimensional Stability (MD)

IPC-TM-650 2.4.39

in/in

-0.0002

Dimensional Stability (CD)

IPC-TM-650 2.4.39

in/in

-0.0003

Density (Specific Gravity)

g/cm³

3.05

Thermal Properties

Thermal Conductivity

ASTM F 433

W/m/K

0.63

CTE (X-axis)

ASTM D 3386 (TMA)

ppm/°C

13

CTE (Y-axis)

ASTM D 3386 (TMA)

ppm/°C

15

CTE (Z-axis)

ASTM D 3386 (TMA)

ppm/°C

46

Environmental Properties

Moisture Absorption

IPC-TM-650 2.6.2.1

%

0.02

Outgassing – TML

ASTM E 595

%

0.02

Outgassing – CVCM

ASTM E 595

%

0.01

Outgassing – WVR

ASTM E 595

%

0.01

Flammability Rating

UL 94

V-0

 

 

4. CER-10 CCL Standard Sheet Sizes & Order Specification Rules

 

4.1 Standard Raw Laminate Sheet Sizes (Taconic Factory Default)


  • 12×18 inch (304mm×457mm)
  • 16×18 inch (406mm×457mm)
  • 18×24 inch (457mm×610mm, mainstream standard stock size)


 Custom special sheet sizes are available via advance factory inquiry.

 

4.2 Standard Core Dielectric Thickness & Corresponding Dk Tolerance

 

Designation

Typical Thickness (Inches)

Typical Thickness (mm)

Dk

CER-10

0.025

0.64

9.50 ± 0.50

CER-10

0.03

0.76

9.70 ± 0.50

CER-10

0.047

1.19

9.80 ± 0.50

CER-10

0.05

1.27

9.80 ± 0.50

CER-10

0.062

1.58

10.0 ± 0.50

CER-10

0.075

1.91

10.0 ± 0.50

CER-10

0.1

2.54

10.0 ± 0.50

CER-10

0.125

3.18

10.2 ± 0.50

 

 

5. Standard Fabrication Guidelines

CER-10 substrates can be processed using standard methods for PTFE/woven fiberglass materials:


  • Shearing: Standard shearing equipment with appropriate blade clearance
  • Drilling: Carbide drill bits with appropriate speeds and feeds
  • Milling: Standard routing equipment with proper bit selection
  • Plating: Standard electroless copper plating followed by electrolytic plating


 

6. Typical Applications

Based on the material properties, CER-10 is ideally suited for:


  • Power Amplifiers: Low loss and high Dk enable compact matching networks
  • Waveguide Filters: Stable Dk over frequency ensures consistent filter response
  • Directional Couplers: Low loss and tight coupling capability
  • Microwave Passive Components: Ideal for discrete microwave structures requiring high Dk
  • PCB-Based Antennas: Miniaturization advantages for compact designs


 

 

Ordering Information

Taconic part number format: Cer-10-[Thickness]-CV1/CV1 - 18"×24"

Example: Cer-10-0500-CV1/CV1 - 18"×24" (457 mm×610 mm)

 

Available copper cladding:


  • CV1: 0.5 oz (17μm)
  • CV2: 1 oz (35μm)
  • CV3: 2 oz (70μm)


 

 

Conclusion

 

Taconic CER-10 ORCER organic-ceramic CCL is a specialized high-frequency substrate engineered to solve traditional PTFE laminate mechanical and processing weaknesses while retaining industry-leading low-loss electrical properties at microwave bands. The 30mil core variant selected for this immersion silver PCB strikes an optimal balance between board miniaturization, thermal cycling reliability and manufacturability for power amplifiers, waveguide filters and directional couplers. 


Its comprehensive standardized test data, consistent dimensional stability and V-0 flammability rating make it a trusted material choice for IPC Class 2 dedicated service RF hardware worldwide, with clearly defined differentiation against mainstream epoxy and unmodified PTFE copper-clad laminates.



 




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