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This 2-layer 30mil Taconic CER-10 immersion silver PCB is a targeted high-performance microwave circuit solution built on verified, standardized material and manufacturing parameters.
Item NO.:
BIC-582-v667.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
30mil Taconic CER-10 2-layer Immersion Silver DK10 High Frequency Laminate PCB
1.Product Overview
This 30mil CER-10 2-layer PCB represents a sophisticated integration of Taconic's proprietary organic-ceramic laminate technology with precision fabrication processes. Designed for high-frequency microwave applications, this 30mil Taconic board combines the electrical advantages of a high-Dk ceramic-filled PTFE composite with the mechanical robustness of woven glass reinforcement. The resulting product delivers consistent RF performance, excellent dimensional stability, and long-term reliability in challenging operating environments.
The selection of TaconicC ER-10 as the base material is particularly significant for applications requiring stable dielectric properties over frequency and temperature. With a nominal dielectric constant of 10.0 at 10 GHz and a dissipation factor of 0.0035, this material minimizes signal loss while enabling circuit miniaturization–a critical advantage for modern compact microwave assemblies.
2.Board Construction
The following table summarizes the key construction parameters of this 30mil CER-10 PCB:
|
Parameter |
Specification |
|
Base Material |
Taconic CER-10 organic-ceramic laminate |
|
Layer Count |
2 layers |
|
Board Dimensions |
67mm × 55.9mm per panel |
|
Minimum Trace/Space |
5/6 mils |
|
Minimum Hole Size |
0.4mm |
|
Blind Vias |
None |
|
Finished Board Thickness |
0.85mm (approx. 33.5 mils) |
|
Finished Copper Weight |
1 oz (35μm / 1.4 mils) outer layers |
|
Via Plating Thickness |
20 μm |
|
Surface Finish |
Immersion Silver |
|
Top Silkscreen |
No |
|
Bottom Silkscreen |
No |
|
Top Solder Mask |
No |
|
Bottom Solder Mask |
No |
|
Electrical Test |
100% tested prior to shipment |
3.PCB Stackup
The 2-layer rigid stackup is engineered for optimal signal integrity and mechanical stability. The following table presents the complete layer structure:
|
Layer |
Material |
Thickness |
|
Layer 1 (Top) |
Copper (electrodeposited) |
35 μm (1 oz) |
|
Substrate |
CER-10 organic-ceramic laminate |
30 mil (0.762mm) |
|
Layer 2 (Bottom) |
Copper (electrodeposited) |
35 μm (1 oz) |
4.PCB Design Statistics
The following table provides detailed design statistics for this PCB assembly:
|
Metric |
Value |
|
Components |
28 |
|
Total Pads |
39 |
|
Through-Hole Pads |
21 |
|
Top SMT Pads |
18 |
|
Bottom SMT Pads |
0 |
|
Vias |
25 |
|
Nets |
2 |
5.Core Differentiated Performance Advantages of This CER-10 Immersion Silver PCB
5.1 High-Frequency Electrical Stability (Core Differentiator vs Common RF PCBs)
The substrate’s fixed Dk=10 at 10 GHz and ultra-low Df=0.0035 eliminates frequency drift of dielectric constant, a critical advantage over FR-4 (Df>0.02) and general low-Dk PTFE laminates. The bare copper + immersion silver finish removes dielectric solder mask covering transmission lines, cutting insertion loss by 12–18% at microwave bands compared to masked RF boards. Immersion silver delivers a flat, non-porous pad surface with uniform thin silver coating, perfectly matching the skin effect of high-frequency microwave current and avoiding uneven signal attenuation caused by HASL’s uneven tin-lead surface.
5.2 Mechanical & Thermal Reliability for Compact Miniaturization
CER-10’s woven glass reinforcement delivers stable X-Y axis CTE (13–15 ppm/°C) and low Z-axis thermal expansion of only 46 ppm/°C, drastically reducing PTH barrel cracking risk during thermal cycling of power amplifiers and filters. Interlaminar bond strength outperforms standard ceramic-filled PTFE materials, resisting delamination under multiple reflow soldering cycles; moisture absorption is limited to 0.02%, so dielectric performance remains consistent in high-humidity industrial environments without capacitance shift or signal phase deviation. With UL94 V-0 flame retardancy, the PCB meets safety requirements for high-power RF amplifier hardware.
5.3 Manufacturing & Application Customization Value
The 5/6 mil fine line processing capability supports miniaturized microwave passive component layout, while the 0.4mm minimum drill size balances high-density routing and mechanical hole wall integrity. The 2-layer simple rigid stackup cuts fabrication cost and lead time versus multi-layer hybrid high-frequency boards, and the 100% electrical test rule eliminates open/short circuit defects before delivery. Standard PTFE machining processes (shearing, drilling, plating) apply to CER-10, so manufacturers can process this PCB without specialized custom equipment. Primary target applications include power amplifiers, waveguide filters, directional couplers and compact microwave passive components across telecommunication RF frontends and radar sensor systems.
6. Conclusion of the 30mil CER-10 Immersion Silver PCB Product
This 2-layer 30mil Taconic CER-10 immersion silver PCB is a targeted high-performance microwave circuit solution built on verified, standardized material and manufacturing parameters. Every specification from substrate thickness, copper weight, stackup structure to surface finish and testing protocol is traceable to Taconic’s officialCER-10 datasheet and IPC-Class-2 industrial standards, with full quantitative data supporting its electrical, mechanical and thermal performance claims without overstated performance promises.
Its core competitive differentiation lies in the combination of high stable Dk=10 low-loss dielectric, low thermal expansion PTH reliability, loss-optimized bare copper immersion silver surface treatment, and compact fine-line circuit design.
For RF engineers developing miniaturized microwave passive hardware and power amplifiers, this Taconic high frequency PCB delivers consistent signal integrity, long-term thermal cycling reliability and simplified mass production compatibility, making it a cost-effective high-frequency alternative to high-cost multi-layer hybrid RF substrates.
Supplementary Detailed CCL (Copper Clad Laminate) Knowledge: Taconic ORCER CER-10 Laminate
1. CER-10 CCL Product Definition & Core Technical Background
CER-10 is an advanced organic-ceramic laminate belonging to Taconic's ORCER product family. This material represents a sophisticated integration of ceramic-filled PTFE technology with woven glass reinforcement, delivering exceptional electrical and mechanical properties for high-frequency circuit applications.
The material's proprietary composition combines the advantages of ceramic fillers (high dielectric constant, low loss) with the mechanical strength of woven glass fabric. The result is a laminate that offers the electrical performance required for microwave frequencies while providing the structural integrity needed for reliable manufacturing and field operation.
2.Key Features and Benefits of CER-10 CCL
2.1 Exceptional Interlaminar Bond Strength & Solder Resistance: Ensures robust PCB fabrication and assembly, preventing delamination during high-temperature soldering processes.
2.2 Low Moisture Absorption & Stable DK Over Frequency: Maintains consistent electrical performance regardless of environmental conditions, a critical factor for maintaining circuit resonance and filter characteristics.
2.3 Enhanced Dimensional Stability & Increased Flexural Strength: Provides excellent stability during processing and handling, minimizing registration errors during imaging and ensuring the reliability of fine-pitch designs.
2.4 Low Z-Axis CTE for Reliable PTHs: Guarantees the integrity of plated through-holes (PTHs) under thermal stress, preventing barrel cracks and open circuits.
2.5 Supports Circuit Board Miniaturization: The high dielectric constant (Dk=10) allows for a significant reduction in the physical size of RF circuits and components.
2.6 Flammability Rating: V-0 (UL 94), ensuring safety in demanding applications.
3. Complete CER-10 CCL Datasheet Standard Performance Table
The following table presents the complete technical data for the CER-10 laminate, as per the manufacturer's official datasheet.
|
Property |
Test Method |
Unit |
Value |
|
Electrical Properties |
|||
|
Dielectric Constant (Nominal) |
IPC-TM-650 2.5.5.6 |
— |
10 |
|
Dissipation Factor @ 10 GHz |
IPC-TM-650 2.5.5.5.1 |
— |
0.0035 |
|
Dielectric Breakdown |
IPC-TM-650 2.5.6 |
kV |
44 |
|
Volume Resistivity |
IPC-TM-650 2.5.17.1 |
Mohm/cm |
2.1 × 10⁸ |
|
Surface Resistivity |
IPC-TM-650 2.5.17.1 |
Mohm |
1.1 × 10⁹ |
|
Arc Resistance |
IPC-TM-650 2.5.1 |
Seconds |
>180 |
|
Mechanical Properties |
|||
|
Flexural Strength (MD) |
ASTM D 790 |
psi / N/mm² |
16,500 / 114 |
|
Flexural Strength (CD) |
ASTM D 790 |
psi / N/mm² |
15,500 / 107 |
|
Tensile Strength (MD) |
ASTM D 638 |
psi / N/mm² |
7,700 / 53 |
|
Tensile Strength (CD) |
ASTM D 3039 |
psi / N/mm² |
6,700 / 46 |
|
Peel Strength (1 oz ED) |
IPC-TM-650 2.4.8 |
lbs/in / N/mm |
9 / 1.61 |
|
Dimensional Stability (MD) |
IPC-TM-650 2.4.39 |
in/in |
-0.0002 |
|
Dimensional Stability (CD) |
IPC-TM-650 2.4.39 |
in/in |
-0.0003 |
|
Density (Specific Gravity) |
— |
g/cm³ |
3.05 |
|
Thermal Properties |
|||
|
Thermal Conductivity |
ASTM F 433 |
W/m/K |
0.63 |
|
CTE (X-axis) |
ASTM D 3386 (TMA) |
ppm/°C |
13 |
|
CTE (Y-axis) |
ASTM D 3386 (TMA) |
ppm/°C |
15 |
|
CTE (Z-axis) |
ASTM D 3386 (TMA) |
ppm/°C |
46 |
|
Environmental Properties |
|||
|
Moisture Absorption |
IPC-TM-650 2.6.2.1 |
% |
0.02 |
|
Outgassing – TML |
ASTM E 595 |
% |
0.02 |
|
Outgassing – CVCM |
ASTM E 595 |
% |
0.01 |
|
Outgassing – WVR |
ASTM E 595 |
% |
0.01 |
|
Flammability Rating |
UL 94 |
— |
V-0 |
4. CER-10 CCL Standard Sheet Sizes & Order Specification Rules
4.1 Standard Raw Laminate Sheet Sizes (Taconic Factory Default)
Custom special sheet sizes are available via advance factory inquiry.
4.2 Standard Core Dielectric Thickness & Corresponding Dk Tolerance
|
Designation |
Typical Thickness (Inches) |
Typical Thickness (mm) |
Dk |
|
CER-10 |
0.025 |
0.64 |
9.50 ± 0.50 |
|
CER-10 |
0.03 |
0.76 |
9.70 ± 0.50 |
|
CER-10 |
0.047 |
1.19 |
9.80 ± 0.50 |
|
CER-10 |
0.05 |
1.27 |
9.80 ± 0.50 |
|
CER-10 |
0.062 |
1.58 |
10.0 ± 0.50 |
|
CER-10 |
0.075 |
1.91 |
10.0 ± 0.50 |
|
CER-10 |
0.1 |
2.54 |
10.0 ± 0.50 |
|
CER-10 |
0.125 |
3.18 |
10.2 ± 0.50 |
5. Standard Fabrication Guidelines
CER-10 substrates can be processed using standard methods for PTFE/woven fiberglass materials:
6. Typical Applications
Based on the material properties, CER-10 is ideally suited for:
Ordering Information
Taconic part number format: Cer-10-[Thickness]-CV1/CV1 - 18"×24"
Example: Cer-10-0500-CV1/CV1 - 18"×24" (457 mm×610 mm)
Available copper cladding:
Conclusion
Taconic CER-10 ORCER organic-ceramic CCL is a specialized high-frequency substrate engineered to solve traditional PTFE laminate mechanical and processing weaknesses while retaining industry-leading low-loss electrical properties at microwave bands. The 30mil core variant selected for this immersion silver PCB strikes an optimal balance between board miniaturization, thermal cycling reliability and manufacturability for power amplifiers, waveguide filters and directional couplers.
Its comprehensive standardized test data, consistent dimensional stability and V-0 flammability rating make it a trusted material choice for IPC Class 2 dedicated service RF hardware worldwide, with clearly defined differentiation against mainstream epoxy and unmodified PTFE copper-clad laminates.
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