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Home PCB Prototype Rogers AD450 High Frequency PCB 10mil Substrate With ENIG

Rogers AD450 High Frequency PCB 10mil Substrate With ENIG

The electrical properties of AD450 suggest it can readily replace FR-4 in applications where higher frequencies and expectations for increased fidelity with broadband signal are beyond the performance offered by FR-4.

  • Item NO.:

    BIC-154-v40.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$1.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers AD450 High Frequency PCB Built on 10mil 0.254mm Substrate With Immersion Gold for Wide Band Antennas.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Rogers' (Arlon) AD450 is a woven fiberglass reinforced, ceramic filled, PTFE based composite material for use as a printed circuit board substrate. The woven fiberglass provides better dielectric constant and thickness uniformity, better dimensional stability as well as reduced manufacturing costs.


2L 10mil AD450 PCB


With a dielectric constant of 4.5, most FR-4 designs can be readily transferred. Its higher thermal conductivity and lower CTE also promote its use in higher power designs, where temperature extremes and heat rejection are primary considerations.

 

AD450 is compatible with processing used for standard PTFE based printed circuit board substrates. In addition, its low Z-axis thermal expansion will improve plated through hole reliability, compared to typical PTFE based laminates.


10mil Arlon PCB


Typical Applications:


1. Circuit Board Miniaturization

2. Multimedia Transmission Systems

3. Wide Band Antenna Applications

4. Replacement of FR-4 in Higher Frequency Applications


DK VS Frequency AD450

Figure 1 demonstrates the stability of dielectric constant across frequency.


DF VS Frequency AD450

Figure 2 demonstrates the stability of dissipation factor across frequency.


Our PCB Capability(AD450):


PCB Material: Woven Fiberglass Reinforced, Ceramic filled, PTFE based Composite
Designation: AD450
Dielectric constant: 4.5
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 30mil(0.762mm), 40mil(1.016mm), 50mil (1.27mm), 60mil (1.524mm), 70mil(1.778mm), 90mil (2.286mm), 180mil (4.572mm),        200mil (5.08mm), 230mil (5.842mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..


Data Sheet of AD450:


Typical Properties: AD450
Property Test Method Condition Result
Dielectric Constant @ 200 MHz IPC TM-650 2.5.5.6 C23/50 4.5
Loss Tangent @ 10 GHz IPC TM-650 2.5.5.6 C23/50 0.0035
Thermal Coefficient of Er IPC TM-650 2.5.5.6 - 10℃TO +140℃ -233.5
Copper Peel Strength (lb/in) IPC TM-650 2.4.8 A, TS >12
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 1.2 X 109
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 4.5 X 107
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23℃ >700
Tensile Strength (kpsi) ASTM D-882 A, 23℃ >20
Compressive Modulus (kpsi) ASTM D-685 A, 23℃ >350
Flexural Modulus (kpsi) ASTM D-790 A, 23℃ >540
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Density (g/cm3) ASTM D-792 Method A A, 23℃ 2.45
Water Absorption (%) IPC TM-650 2.6.2.2 E1/105 + D24/23 0.07
Coefficient of Thermal Expansion (ppm/℃)                                                     X Axis                                                          Y Axis                                                             Z Axis IPC TM-650 2.4.24 TMA 0℃to 100℃ 8                                             11                                            42
Thermal Conductivity (W /mK) ASTM E-1225 100℃ 0.38
Outgassing                                        Total Mass Loss (%)                             Collected Volatile                               Condensable Material (%)               Water Vapor Recovered NASA SP-R-0022A         Maximum 1.00%                 Maximum 0.10%          125℃,≦10-6torr 0.01                           0.01                                  0.00 
Flammability UL 94 Vertical Burn C48/23/50, E24/125 UL94-V0


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