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The 370HR 12-Layer 1.6mm PCB is a high-reliability, high-performance solution for advanced electronic applications.
Item NO.:
BIC-375-v458.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Isola 370HR PCB 12-layer 1.6mm Thick ENIG High-Tg FR-4 Multilayer Board
Introduction
The 370HR 12-Layer PCB is a high-reliability, high-performance multilayer printed circuit board designed for demanding applications in computing, networking, automotive, aerospace, and industrial electronics. Manufactured using Isola 370HR laminate, this Isola370HR PCB offers superior thermal stability, low expansion rates, and excellent electrical performance, making it ideal for sequential lamination designs and high-speed signal integrity requirements.
With a 1.6mm thickness, ENIG surface finish, and impedance-controlled routing, this High-Tg FR-4 PCB ensures optimal performance in harsh environments. The board features blind vias (L1-L4, L1-L10), tight trace/spacing (4/6 mils), and UL certification, meeting IPC-Class-2 quality standards.
Below is a detailed breakdown of the PCB’s construction, stackup, statistics, and key features.
PCB Construction Details
The following table summarizes the key construction parameters of the 370HR 12-layer PCB:
|
Parameter |
Specification |
|
Base Material |
Isola 370HR (High-Tg FR-4) |
|
Layer Count |
12-Layer Rigid PCB |
|
Board Dimensions |
120mm x 88mm (±0.15mm tolerance) |
|
Minimum Trace/Space |
4/6 mils |
|
Minimum Hole Size |
8 mils |
|
Blind Vias |
L1-L4, L1-L10 |
|
Finished Cu Weight |
1oz (signal & plane layers) |
|
Silkscreen |
White (Top/Bottom) |
|
Solder Mask |
Green (Top/Bottom) |
|
Board Thickness |
1.58mm (±10%) |
|
UL Mark |
Required |
|
Electrical Test |
Required |
|
Silkscreen on Pads |
Not allowed |
|
Surface Finish |
ENIG (0.1µm gold, rated for -40°C to +85°C) |
PCB Stackup–12-Layer Rigid PCB
The stackup structure is optimized for signal integrity, power distribution, and thermal management. Below is the detailed layer-by-layer breakdown.
|
Layer |
Material & Thickness |
Copper Weight |
|
Top Layer (L1) |
1.4mil (1oz) |
Signal Layer |
|
Prepreg 1080 (65%) |
0.0727mm |
Dielectric Spacing |
|
Ground Plane (L2) |
0.7mil (0.5oz) |
Solid Ground |
|
Prepreg 1080 (65%) |
0.0727mm |
Dielectric Spacing |
|
Mid Layer 1 (L3) |
0.7mil (0.5oz) |
Signal Layer |
|
Prepreg 1080 (65%) |
0.0727mm |
Dielectric Spacing |
|
Mid Layer 2 (L4) |
0.7mil (0.5oz) |
Signal Layer |
|
Prepreg 1080 (65%) x2 |
0.1479mm |
Dielectric Spacing |
|
Power Plane (L5) |
0.7mil (0.5oz) |
Power Distribution |
|
IS370HR Core |
0.2mm |
Dielectric Core |
|
Copper Layer (L6) |
0.7mil (0.5oz) |
Signal Layer |
|
Prepreg 1080 (65%) x2 |
0.1479mm |
Dielectric Spacing |
|
Power Plane (L7) |
0.7mil (0.5oz) |
Power Distribution |
|
IS370HR Core |
0.2mm |
Dielectric Core |
|
Copper Layer (L8) |
0.7mil (0.5oz) |
Signal Layer |
|
Prepreg 1080 (65%) x2 |
0.1479mm |
Dielectric Spacing |
|
Copper Layer (L9) |
1.4mil (1oz) |
Signal Layer |
|
Prepreg 1080 (65%) |
0.0727mm |
Dielectric Spacing |
|
Ground Plane (L10) |
0.7mil (0.5oz) |
Solid Ground |
|
Prepreg 1080 (65%) |
0.0727mm |
Dielectric Spacing |
|
Copper Layer (L11) |
0.7mil (0.5oz) |
Signal Layer |
|
Prepreg 1080 (65%) |
0.0727mm |
Dielectric Spacing |
|
Bottom Layer (L12) |
1.4mil (1oz) |
Signal Layer |
PCB Statistics
The 370HR multilayer PCB statistics provide insights into component density, pad distribution, and via count, ensuring manufacturability and assembly compatibility.
|
Parameter |
Count |
|
Components |
59 |
|
Total Pads |
355 |
|
Thru-Hole Pads |
129 |
|
Top SMT Pads |
178 |
|
Bottom SMT Pads |
48 |
|
Vias |
211 |
|
Nets |
61 |
Additional Specifications
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
Introduction of 370HR
Isola's 370HR is a top-tier FR-4 system engineered for multilayer PCB applications necessitating exceptional thermal performance and reliability. This system combines a high-performance epoxy resin with E-glass fabric, delivering improved thermal performance and low expansion rates while maintaining FR-4 processability.
370HR Key Features
✅High Thermal Performance–Tg: 180°C, Td: 340°C
✅Low CTE (13/14 ppm/°C)–Reduces risk of warping and delamination
✅CAF Resistant–Prevents conductive anodic filamentation
✅UV Blocking & AOI Fluorescence–Enhances inspection accuracy
✅RoHS Compliant–Environmentally friendly
✅Superior Processing–Compatible with standard FR-4 fabrication
Typical Applications
This Isola 370HR FR4 PCB is ideal for:
Conclusion
The 370HR 12-Layer 1.6mm PCB is a high-reliability, high-performance solution for advanced electronic applications. With controlled impedance, blind vias, and superior thermal properties, it ensures long-term durability and signal integrity. Designed to meet IPC-Class-2 and UL standards, this PCB is ideal for mission-critical systems where performance and reliability are paramount.
For custom requirements or bulk orders, contact our sales team for further assistance. Global shipping available.
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