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The TLX-8 2-layer 10mil PCB is engineered for high-frequency, high-reliability applications where signal integrity, thermal stability, and environmental resistance are critical.
Item NO.:
BIC-379-v462.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
TLX-8 PCB 2-layer 10mil 0.254mm Taconic Laminate ENIG High Frequency Board
Product Overview
The TLX-8 PCB 2-layer 10mil ENIG is a high-frequency printed circuit board designed for RF, microwave, and antenna applications where signal integrity, thermal stability, and mechanical robustness are critical. This PCB is constructed using Taconic TLX-8, a PTFE fiberglass laminate known for its low dielectric constant (Dk), low dissipation factor (Df), and excellent dimensional stability.
With a 2-layer rigid construction, ENIG (Electroless Nickel Immersion Gold) surface finish, and ultra-thin 0.3mm profile, this 10mil TLX-8 PCB is ideal for space, aerospace, military, and high-frequency communication systems. It is IPC-Class-2 compliant, ensuring high reliability for industrial and commercial applications.
PCB Construction Details
Parameter |
Specification |
Base Material |
Taconic TLX-8 PTFE Fiberglass |
Layer Count |
2 Layers |
Board Dimensions |
20mm x 21.35mm (±0.15mm) |
Minimum Trace/Space |
5/6 mils |
Minimum Hole Size |
0.2mm |
Blind/Buried Vias |
No |
Finished Board Thickness |
0.3mm |
Finished Cu Weight |
1oz (35µm) Outer Layers |
Via Plating Thickness |
20µm |
Surface Finish |
ENIG (Electroless Nickel Immersion Gold) |
Top/Bottom Silkscreen |
No |
Top/Bottom Solder Mask |
No |
Electrical Testing |
100% Tested Prior to Shipment |
PCB Stackup (2-Layer Rigid PCB)
The stackup is optimized for high-frequency signal integrity with minimal dielectric loss.
Layer |
Material |
Thickness |
Copper Layer 1 |
1oz (35µm) Cu |
35µm |
Core |
Taconic TLX-8 |
0.254mm (10mil) |
Copper Layer 2 |
1oz (35µm) Cu |
35µm |
PCB Statistics
This 2-layer TLX-8 PCB is designed for compact RF circuits with minimal component count.
Parameter |
Count |
Components |
2 |
Total Pads |
14 |
Thru-Hole Pads |
10 |
Top SMT Pads |
4 |
Bottom SMT Pads |
0 |
Vias |
5 |
Nets |
2 |
Main Properties of TLX-8 Material
Taconic TLX-8 substrate offers exceptional electrical, thermal, and mechanical properties for high-frequency applications.
Electrical Properties
Property |
Value |
Test Standard |
Dielectric Constant (Dk) @ 10 GHz |
2.55 ± 0.04 |
IPC-650 2.5.5.3 |
Dissipation Factor (Df) @ 10 GHz |
0.0018 |
IPC-650 2.5.5.5.1 |
Surface Resistivity (Elevated Temp.) |
6.605 x 10<sup>8</sup> Mohm |
IPC-650 2.5.17.1 Sec. 5.2.1 |
Surface Resistivity (Humidity Cond.) |
3.550 x 10<sup>6</sup> Mohm |
IPC-650 2.5.17.1 Sec. 5.2.1 |
Volume Resistivity (Elevated Temp.) |
1.110 x 10<sup>10</sup> Mohm/cm |
IPC-650 2.5.17.1 Sec. 5.2.1 |
Volume Resistivity (Humidity Cond.) |
1.046 x 10<sup>10</sup> Mohm/cm |
IPC-650 2.5.17.1 Sec. 5.2.1 |
Dimensional Stability
Property |
Value (mm/M) |
Test Standard |
MD After Bake |
0.06 |
IPC-650 2.4.39 Sec. 5.4 |
CD After Bake |
0.08 |
IPC-650 2.4.39 Sec. 5.4 |
MD Thermal Stress |
0.09 |
IPC-650 2.4.39 Sec. 5.5 |
CD Thermal Stress |
0.1 |
IPC-650 2.4.39 Sec. 5.5 |
Coefficient of Thermal Expansion (CTE)
Direction |
Value (ppm/°C) |
Test Standard |
X-axis |
21 |
IPC-650 2.4.41 / ASTM D 3386 |
Y-axis |
23 |
IPC-650 2.4.41 / ASTM D 3386 |
Z-axis |
215 |
IPC-650 2.4.41 / ASTM D 3386 |
Thermal Decomposition (Td)
Weight Loss |
Temperature (°C) |
Test Standard |
2% |
535 |
IPC-650 2.4.24.6 (TGA) |
5% |
553 |
IPC-650 2.4.24.6 (TGA) |
Chemical & Physical Properties
Property |
Value |
Test Standard |
Moisture Absorption |
0.02% |
IPC-650 2.6.2.1 |
Dielectric Breakdown |
>45 kV |
IPC-650 2.5.6 |
Flammability Rating |
V-0 |
UL-94 |
Typical Applications
The TLX-8 high frequency PCB is widely used in high-frequency and harsh-environment applications, including:
✔Radar & Satellite Communication Systems
✔5G & Mobile Base Station Antennas
✔Microwave Test Equipment & RF Filters
✔Aerospace & Defense Electronics
✔Military Radar & Naval Antennas
✔Low-PIM Passive Components (Couplers, Splitters, Amplifiers)
Conclusion
The TLX-8 2-layer 10mil PCB is engineered for high-frequency, high-reliability applications where signal integrity, thermal stability, and environmental resistance are critical. With TLX-8’s superior RF properties, ultra-thin profile, and ENIG surface finish, thisTaconic Substrate PCB is an excellent choice for aerospace, military, telecom, and industrial applications requiring consistent performance under extreme conditions.
For global availability and IPC-Class-2 certified quality, this Taconic PCB ensures long-term reliability in the most demanding electronic systems.
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