Wangling F4BM220 PCB 2-layer 6.0mm Thick ENIG F4BM Series High Frequency Laminates

Wangling F4BM220 PCB 2-layer 6.0mm Thick ENIG F4BM Series High Frequency Laminates

Product Overview

The F4BM220 PCB is a high-frequency, double-sided printed circuit board designed for demanding RF and microwave applications. With a 6.0 mm thick F4BM220 core, this F4B substrate PCB offers superior electrical performance, including low dielectric loss, excellent thermal stability, and high insulation resistance. It is an ideal choice for microwave systems, radar, satellite communications, and phased array antennas, where signal integrity and reliability are critical.

This 6.0 mm F4BM220 substrate PCB is manufactured using Wangling F4BM 220 laminate, a PTFE (polytetrafluoroethylene)-based material reinforced with fiberglass cloth, ensuring precise dielectric constant control (Dk = 2.2±0.04) and ultra-low dissipation factor (0.001 at 10GHz). The board features 1oz copper layers (35μm), immersion gold surface finish, and strict IPC-Class-2 quality compliance, making it suitable for high-performance applications worldwide.

PCB Construction Details

PCB Stackup (2-Layer Rigid Structure)

The stackup consists of a 6.0mm F4BM220 core with 1oz copper on both sides, ensuring optimal signal integrity for high-frequency applications.

PCB Statistics

This DK2.2 F4B PCB is designed for low-complexity RF circuits, featuring: 

Introduction to F4BM220 Material

The F4BM220 laminate is a PTFE (polytetrafluoroethylene)-based composite engineered for high-frequency applications. It combines fiberglass cloth, PTFE resin, and PTFE film to achieve low dielectric loss, enhanced stability, and improved insulation resistance compared to standard FR-4 or even F4B220 laminates.

Key Features of F4BM220

• Dielectric Constant (Dk): 2.2±0.04 @ 10GHz (tight tolerance for precise impedance control)
• Dissipation Factor (Df): 0.001 @ 10GHz (ultra-low signal loss)
• Thermal Stability:
• -CTE (Coefficient of Thermal Expansion):
• -X-axis: 25 ppm/°C
• -Y-axis: 34 ppm/°C
• -Z-axis: 240 ppm/°C (from -55°C to 288°C) 
• Thermal Coefficient of Dk: -142 ppm/°C (-55°C to 150°C)
• Moisture Absorption:≤0.08% (minimal impact on performance in humid environments)
• Flammability Rating: UL-94 V0 (self-extinguishing for safety)

Copper Foil Options

• F4BM220: Uses ED (Electrodeposited) copper foil (standard for non-PIM applications).
• F4BME220: Uses RTF (Reverse-Treated Foil) copper foil for better PIM performance, lower conductor loss, and finer line control (ideal for 5G and high-frequency RF).

 Typical Applications

The F4BM220 high frequency PCB is widely used in high-frequency, low-loss applications, including:

• -Microwave & RF circuits
• -Radar & satellite communication systems
• -Phase shifters & power dividers
• -Antenna feed networks
• -Phased array antennas
• -5G base station components

Conclusion

The F4BM220 PCB 2-layer 6.0 mm thick is a high-performance RF/microwave board designed for low-loss, high-stability applications. With its PTFE-based core, 1oz copper layers, and immersion gold finish, it ensures superior signal integrity and reliability in demanding environments. Whether for radar, satellite comms, or phased array antennas, this F4BM Series PCB delivers exceptional electrical and thermal performance.

For custom configurations or bulk orders, contact our sales team for worldwide shipping options.