Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
The RO4533 2-layer 20mil PCB is a high-performance RF circuit board optimized for low-loss, high-frequency applications.
Item NO.:
BIC-377-v460.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO4533 PCB 2-layer 20mil 0.508mm Rogers 4533 Substrate Immersion Gold
Product Overview
The RO4533 2-layer 20 mil PCB is a high-frequency, low-loss printed circuit board designed for RF and antenna applications. Built with Rogers RO4533 laminate, this Rogers 4533 PCB offers excellent dielectric stability, low passive intermodulation (PIM), and superior thermal performance. With a 2-layer rigid construction, this board is ideal for telecommunications, WiMAX, and cellular infrastructure applications.
This Rogers PCB board features immersion gold surface finish, 1oz copper weight, and 4/7 mil trace/space capability, ensuring high reliability and signal integrity. The 0.6mm finished thickness and 20mil core provide mechanical stability while maintaining excellent electrical performance.
PCB Construction Details
This PCB is constructed with Rogers RO4533 core material, featuring a 2-layer rigid design, 1oz copper layers, and immersion gold surface finish for optimal RF performance.
|
Parameter |
Specification |
|
Base Material |
Rogers RO4533 |
|
Layer Count |
2 layers |
|
Board Dimensions |
52mm x 35mm (±0.15mm) |
|
Minimum Trace/Space |
4/7 mils |
|
Minimum Hole Size |
0.3mm |
|
Blind Vias |
No |
|
Finished Board Thickness |
0.6mm |
|
Finished Copper Weight |
1oz (35µm) on outer layers |
|
Via Plating Thickness |
20µm |
|
Surface Finish |
Immersion Gold (ENIG) |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
No |
|
Top Solder Mask |
Green |
|
Bottom Solder Mask |
No |
|
Electrical Testing |
100% tested prior to shipment |
Stackup
The PCB consists of two copper layers (35μm each) with a 20 mil RO4533 core, ensuring stable RF performance.
|
Layer |
Material |
Thickness |
|
Copper (Top Layer) |
1oz (35µm) Cu |
35µm |
|
Core |
Rogers RO4533 |
0.508mm (20mil) |
|
Copper (Bottom Layer) |
1oz (35µm) Cu |
35µm |
PCB Statistics
The board supports a variety of components and interconnections, optimized for RF applications.
|
Parameter |
Value |
|
Components |
25 |
|
Total Pads |
31 |
|
Through-Hole Pads |
21 |
|
Top SMT Pads |
10 |
|
Bottom SMT Pads |
0 |
|
Vias |
32 |
|
Nets |
2 |
Additional Specifications
Introduction to RO4533 Material
Rogers RO4533 is a ceramic-filled, glass-reinforced hydrocarbon laminate designed for high-frequency applications. It provides controlled dielectric constant (Dk = 3.3 @ 10GHz), low loss (Df = 0.0025 @ 10GHz), and excellent passive intermodulation (PIM) performance, making it ideal for microstrip antennas and RF circuits.
Key Features of RO4533
Benefits of RO4533
✔Low loss & stable Dk for high-frequency applications
✔Compatible with standard PCB fabrication (no special PTFE treatments needed)
✔Excellent dimensional stability for high yields in large panels
✔Low PIM response for improved signal integrity in RF systems
✔High thermal conductivity for better heat dissipation
Typical Applications
This RO4533 2-layer PCB is widely used in:
Cellular base station antennas
WiMAX antenna networks
RF power amplifiers
Microwave circuits
Satellite communication systems
Conclusion
The RO4533 2-layer 20mil PCB is a high-performance RF circuit board optimized for low-loss, high-frequency applications. With Rogers RO4533 laminate, immersion gold finish, and precise manufacturing tolerances, this PCB ensures excellent signal integrity, thermal stability, and long-term reliability.
Whether for 5G infrastructure, WiMAX, or RF antenna designs, this RO4533 high frequency PCB offers a cost-effective, high-performance solution for demanding RF applications.
Available worldwide with IPC-Class-2 quality assurance, this board is ready for integration into your next high-frequency project.
Previous:
Rogers RT/duroid 5880 PCB 4-layer 3.0mm Thick OSP Surface Finish Blind Via BoardNext:
Copper Coin Embedded PCB 6-Layer M6 and Isola 370HR Material Hybrid BoardIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
20-Layer Panasonic TU872 HDI PCB ENEPIG 3.0mm Finished Thick Laser-drilled Blind Vias
10-Layer Rogers RO4003C + 370HR FR4 Hybrid Laminate PCB ENIG Impedance Control
8-Layer 10oz Heavy Copper TU-865 Substrate PCB With ENIG Blind &Buried Via
4-Layer Rogers RO3210 + RO4450F PCB ISIG Surface Finish 1.321mm With Blind Via
4-Layer Rogers RO3003+TG170 FR-4 Hybrid PCB Immersion Silver Green Solder Mask
WL-CT440 PCB 30mil 0.762mm Wangling Laminate ENIG Finish No Solder Mask
TP1600 PCB 31.49mil High DK16 Wangling Laminate Pure Gold Plating
TLX-9 PCB 10mil 0.254mm Taconic High Frequency Laminate EPIG Nickle-free
© Copyright: 2026 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported