Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
The RO4533 2-layer 20mil PCB is a high-performance RF circuit board optimized for low-loss, high-frequency applications.
Item NO.:
BIC-377-v460.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
RO4533 PCB 2-layer 20mil 0.508mm Rogers 4533 Substrate Immersion Gold
Product Overview
The RO4533 2-layer 20 mil PCB is a high-frequency, low-loss printed circuit board designed for RF and antenna applications. Built with Rogers RO4533 laminate, this Rogers 4533 PCB offers excellent dielectric stability, low passive intermodulation (PIM), and superior thermal performance. With a 2-layer rigid construction, this board is ideal for telecommunications, WiMAX, and cellular infrastructure applications.
This Rogers PCB board features immersion gold surface finish, 1oz copper weight, and 4/7 mil trace/space capability, ensuring high reliability and signal integrity. The 0.6mm finished thickness and 20mil core provide mechanical stability while maintaining excellent electrical performance.
PCB Construction Details
This PCB is constructed with Rogers RO4533 core material, featuring a 2-layer rigid design, 1oz copper layers, and immersion gold surface finish for optimal RF performance.
|
Parameter |
Specification |
|
Base Material |
Rogers RO4533 |
|
Layer Count |
2 layers |
|
Board Dimensions |
52mm x 35mm (±0.15mm) |
|
Minimum Trace/Space |
4/7 mils |
|
Minimum Hole Size |
0.3mm |
|
Blind Vias |
No |
|
Finished Board Thickness |
0.6mm |
|
Finished Copper Weight |
1oz (35µm) on outer layers |
|
Via Plating Thickness |
20µm |
|
Surface Finish |
Immersion Gold (ENIG) |
|
Top Silkscreen |
White |
|
Bottom Silkscreen |
No |
|
Top Solder Mask |
Green |
|
Bottom Solder Mask |
No |
|
Electrical Testing |
100% tested prior to shipment |
Stackup
The PCB consists of two copper layers (35μm each) with a 20 mil RO4533 core, ensuring stable RF performance.
|
Layer |
Material |
Thickness |
|
Copper (Top Layer) |
1oz (35µm) Cu |
35µm |
|
Core |
Rogers RO4533 |
0.508mm (20mil) |
|
Copper (Bottom Layer) |
1oz (35µm) Cu |
35µm |
PCB Statistics
The board supports a variety of components and interconnections, optimized for RF applications.
|
Parameter |
Value |
|
Components |
25 |
|
Total Pads |
31 |
|
Through-Hole Pads |
21 |
|
Top SMT Pads |
10 |
|
Bottom SMT Pads |
0 |
|
Vias |
32 |
|
Nets |
2 |
Additional Specifications
Introduction to RO4533 Material
Rogers RO4533 is a ceramic-filled, glass-reinforced hydrocarbon laminate designed for high-frequency applications. It provides controlled dielectric constant (Dk = 3.3 @ 10GHz), low loss (Df = 0.0025 @ 10GHz), and excellent passive intermodulation (PIM) performance, making it ideal for microstrip antennas and RF circuits.
Key Features of RO4533
Benefits of RO4533
✔Low loss & stable Dk for high-frequency applications
✔Compatible with standard PCB fabrication (no special PTFE treatments needed)
✔Excellent dimensional stability for high yields in large panels
✔Low PIM response for improved signal integrity in RF systems
✔High thermal conductivity for better heat dissipation
Typical Applications
This RO4533 2-layer PCB is widely used in:
Cellular base station antennas
WiMAX antenna networks
RF power amplifiers
Microwave circuits
Satellite communication systems
Conclusion
The RO4533 2-layer 20mil PCB is a high-performance RF circuit board optimized for low-loss, high-frequency applications. With Rogers RO4533 laminate, immersion gold finish, and precise manufacturing tolerances, this PCB ensures excellent signal integrity, thermal stability, and long-term reliability.
Whether for 5G infrastructure, WiMAX, or RF antenna designs, this RO4533 high frequency PCB offers a cost-effective, high-performance solution for demanding RF applications.
Available worldwide with IPC-Class-2 quality assurance, this board is ready for integration into your next high-frequency project.
Previous:
Copper Coin Embedded PCB 6-Layer M6 and Isola 370HR Material Hybrid BoardNext:
Rogers RT/duroid 5880 PCB 4-layer 3.0mm Thick OSP Surface Finish Blind Via BoardIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Wangling F4BTM300 0.254mm 10mil 2 Layers ENIG Black Solder Mask Custom PCB
Rogers CLTE-AT PCB Double Sided 5mil Immersion Gold Green Solder Mask Black Silkscreen
Rogers 15mil TMM10 PCB 2-layer EPIG Finish Green Solder Mask White Silkscreen
15mil Rogers TMM6 PCB DK6.0 Double-layer ENEPIG 1oz Bare Copper
10mil Rogers RT/duroid 5880LZ 2-layer Immersion Gold White Silkscreen Custom Board
Wangling 2-layer F4BM217 3.9mil F4B DK2.17 High Frequency Laminate ENIG PCB
IsoClad 917 Copper Clad laminates DK2.17 Rogers Substrate 0.0013 Dissipation Factor
Taconic TLY-5Z Low DK2.2 Low Z-Axis Expansion Low Density Laminates
© Copyright: 2026 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported