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Home PCB Prototype High Tg PCB on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

High Tg PCB on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

S1000-2M is a type of High Tg printed circuit board material manufactured by Shengyi with characteristics of high performance and low CTE.


  • Item NO.:

    BIC-504-v80.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description


S1000-2M is suitable for high multilayer PCB. The thickness ranges 0.05mm to 3.2mm, copper weight 0.5oz to 3oz etc.


Features


Lead-free compatible FR-4 laminate

Tg170℃ (DSC), UV Blocking/AOI compatible

High heat resistance

Lower Z-axis CTE

Excellent through-hole reliability

Excellent Anti-CAF performance

Low water absorption

Excellent mechanical processability


S1000-2M PCB


Applications


Computer

Communication

Automotive electronics

Suitable for high layer count PCB


Our PCB Capability (S1000-2M)


PCB Material: High Tg, High Performance and Low CTE Epoxy Resin 
Designation: S1000-2M
Dielectric constant: 4.6 at 10GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.


S1000-2M PCB Board


General Properties of S1000-2M


Test Items Test Method Test Condition Unit Typical Value
Tg IPC-TM-650 2.4.24.4 DMA 185
IPC-TM-650 2.4.25D DSC 180
Td IPC-TM-650 2.4.24.6 TGA (5% W.L) 355
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min 30
T300 IPC-TM-650 2.4.24.1 TMA min 15
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip s >100
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 41
IPC-TM-650 2.4.24 After Tg ppm/℃ 208
IPC-TM-650 2.4.24 50-260℃ % 2.4
Permittivity (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 4.6
Loss Tangent (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 0.018
Volume Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ-cm 8.7×108
Surface Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 2.2×107
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-0.5/23 s 133
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz) IPC-TM-650 2.4.8 288℃/10s N/mm [lb/in] 1.3 [7.43]
Flexural Strength (LW/CW) IPC-TM-650 2.4.4 A Mpa 567/442
Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.08
Flammability UL94 C-48/23/50 Rating V-0
CTI IEC60112 A Rating PLC 3



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