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S1000-2M is a type of High Tg printed circuit
board material manufactured by Shengyi with characteristics of high performance
and low CTE.
Item NO.:
BIC-504-v80.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysHigh Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
S1000-2M is suitable for high multilayer PCB. The thickness ranges 0.05mm to 3.2mm, copper weight 0.5oz to 3oz etc.
Features
Lead-free compatible FR-4 laminate
Tg170℃ (DSC), UV Blocking/AOI compatible
High heat resistance
Lower Z-axis CTE
Excellent through-hole reliability
Excellent Anti-CAF performance
Low water absorption
Excellent mechanical processability
Applications
Computer
Communication
Automotive electronics
Suitable for high layer count PCB
Our PCB Capability (S1000-2M)
PCB Material: | High Tg, High Performance and Low CTE Epoxy Resin |
Designation: | S1000-2M |
Dielectric constant: | 4.6 at 10GHz |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm) |
PCB thickness: | 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
General Properties of S1000-2M
Test Items | Test Method | Test Condition | Unit | Typical Value |
Tg | IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 |
IPC-TM-650 2.4.25D | DSC | ℃ | 180 | |
Td | IPC-TM-650 2.4.24.6 | TGA (5% W.L) | ℃ | 355 |
T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 |
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 |
T300 | IPC-TM-650 2.4.24.1 | TMA | min | 15 |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | s | >100 |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 41 |
IPC-TM-650 2.4.24 | After Tg | ppm/℃ | 208 | |
IPC-TM-650 2.4.24 | 50-260℃ | % | 2.4 | |
Permittivity (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | - | 4.6 |
Loss Tangent (1GHz) | IPC-TM-650 2.5.5.9 | C-24/23/50 | - | 0.018 |
Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ-cm | 8.7×108 |
Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 2.2×107 |
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-0.5/23 | s | 133 |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-0.5/23 | kV | >45 |
Peel Strength (1oz) | IPC-TM-650 2.4.8 | 288℃/10s | N/mm [lb/in] | 1.3 [7.43] |
Flexural Strength (LW/CW) | IPC-TM-650 2.4.4 | A | Mpa | 567/442 |
Water Absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.08 |
Flammability | UL94 | C-48/23/50 | Rating | V-0 |
CTI | IEC60112 | A | Rating | PLC 3 |
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