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AD450 is compatible with processing used for standard
PTFE based printed circuit board substrates. In addition, it's low Z-axis
thermal expansion will improve plated through holes reliability, compare to
typical PTFE based laminates.
Item NO.:
BIC-105-v19.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 daysArlon AD450 High Frequency PCB with 10mil, 20mil, 30mil, 40mil, 50mil, 60mil and 70mil Coating Immersion Gold for Antennas
Arlon's AD450 is a woven fiberglass reinforced, ceramic filled, PTFE based composite material for microwave printed circuit boards.
It provides better dielectric constant and thickness uniformity, better dimensional stability as well as reduced manufacturing costs. The electrical properties of AD450 suggest it can readily replace FR-4 in applications where high frequencies and expectations for increased fidelity with broadband signal are beyond the performance offered by FR-4.
With a dielectric constant of 4.5, most FR-4 designs can be readily transferred. Its higher thermal conductivity and lower CTE also promote its use in high power designs, where temperature extremes and heat rejection are primary considerations.
Typical Applications:
Circuit board miniaturization
Higher frequency applications
Broadband antenna
Multimedia transmission systems
Our Capability (AD450):
PCB Material: | Woven Fiberglass Reinforced, Ceramic filled, PTFE based Composite |
Designation: | AD450 |
Dielectric constant: | 4.5 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil(0.762mm), 40mil(1.016mm), 50mil (1.27mm), 60mil (1.524mm), 70mil(1.778mm), 90mil (2.286mm), 180mil (4.572mm), 200mil (5.08mm), 230mil (5.842mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of AD450:
Property | Test Method | Condition | Result |
Dielectric Constant @ 200 MHz | IPC TM-650 2.5.5.6 | C23/50 | 4.5 |
Loss Tangent @ 10 GHz | IPC TM-650 2.5.5.6 | C23/50 | 0.0035 |
Thermal Coefficient of Er | IPC TM-650 2.5.5.6 | - 10℃TO +140℃ | -233.5 |
Copper Peel Strength (lb/in) | IPC TM-650 2.4.8 | A, TS | >12 |
Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.2 X 109 |
Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 4.5 X 107 |
Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 |
Tensile Modulus (kpsi) | ASTM D-638 | A, 23℃ | >700 |
Tensile Strength (kpsi) | ASTM D-882 | A, 23℃ | >20 |
Compressive Modulus (kpsi) | ASTM D-685 | A, 23℃ | >350 |
Flexural Modulus (kpsi) | ASTM D-790 | A, 23℃ | >540 |
Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
Density (g/cm3) | ASTM D-792 Method A | A, 23℃ | 2.45 |
Water Absorption (%) | IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.07 |
Coefficient of Thermal Expansion (ppm/℃) X Axis Y Axis Z Axis | IPC TM-650 2.4.24 TMA | 0℃to 100℃ | 8 11 42 |
Thermal Conductivity (W /mK) | ASTM E-1225 | 100℃ | 0.38 |
Outgassing Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Recovered | NASA SP-R-0022A Maximum 1.00% Maximum 0.10% | 125℃,≦10-6torr | 0.01 0.01 0.00 |
Flammability | UL 94 Vertical Burn | C48/23/50, E24/125 | UL94-V0 |
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