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The Copper Coin Embedded 6-Layer M6 & Isola 370HR Hybrid PCB is engineered for high-frequency, high-power, and high-reliability applications.
Item NO.:
BIC-376-v459.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Copper Coin Embedded PCB 6-Layer M6 and Isola 370HR Material Hybrid Board
Product Overview
The Copper Coin Embedded 6-Layer M6 Isola 370HR Hybrid PCB is a high-reliability, high-speed printed circuit board designed for demanding applications in 5G communications, automotive radar, aerospace, and networking infrastructure. Combining M6 high-speed PCB material with Isola 370HR high-Tg FR-4, this PCB delivers superior signal integrity, thermal stability, and mechanical durability.
With a 6-layer PCB construction, embedded copper coin for enhanced thermal dissipation, and ENIG (Electroless Nickel Immersion Gold) surface finish, this board ensures optimal performance in high-frequency and high-power environments. Compliant with IPC-Class-2 standards and RoHS requirements, it is manufactured with precision to meet stringent industry demands.
PCB Construction Details
The PCB features a 6-layer hybrid construction withMegtron 6 hybrid PCB material and Isola 370HR high-Tg FR-4, ensuring excellent electrical and thermal performance.
Parameter |
Specification |
Base Material |
M6 High-Speed +Isola 370HR High-Tg FR-4 |
Layer Count |
6 Layers |
Board Dimensions |
120mm x 60mm (±0.15mm) |
Minimum Trace/Space |
4/4 mils |
Minimum Hole Size |
0.2mm |
Blind Vias |
No |
Finished Board Thickness |
1.0mm |
Outer Layer Cu Weight |
1oz (35μm) |
Via Plating Thickness |
20μm |
Surface Finish |
ENIG (Electroless Nickel Immersion Gold) |
Top/Bottom Silkscreen |
White |
Top/Bottom Solder Mask |
Green |
Special Features |
Copper Coin Embedded, Resin-Filled Vias |
Electrical Testing |
100% Tested |
PCB Stackup (6-Layer Rigid Construction)
The stackup combines M6 high-speed cores with Isola 370HR prepregs, ensuring optimal signal integrity and thermal performance.
Layer |
Material/Thickness |
Dielectric Constant (Dk) |
Copper Layer 1 |
35μm (1oz) |
- |
Core |
R5775G (M6) – 0.25mm |
3.61 |
Copper Layer 2 |
18μm (½oz) |
- |
Prepreg |
Isola 370HR – 1080 (64%) x 2 – 0.14mm |
3.72 |
Copper Layer 3 |
35μm (1oz) |
- |
Core |
Isola 370HR – 0.1mm |
4.17 |
Copper Layer 4 |
35μm (1oz) |
- |
Prepreg |
Isola 370HR – 1080 (64%) x 2 – 0.14mm |
3.72 |
Copper Layer 5 |
18μm (½oz) |
- |
Core |
Isola 370HR – 0.1mm |
4.17 |
Copper Layer 6 |
35μm (1oz) |
- |
PCB Statistics
The Hybrid PCB Material supports a moderate component density with a balanced distribution of SMT and through-hole pads.
Parameter |
Count |
Components |
67 |
Total Pads |
250 |
Thru-Hole Pads |
198 |
Top SMT Pads |
36 |
Bottom SMT Pads |
16 |
Vias |
91 |
Nets |
23 |
Key Material Properties
Isola 370HR High-Tg FR-4 Benefits
Additional Specifications
Typical Applications
This 6 layer hybrid PCB is widely used for:
- 5G Communication Base Stations: Millimeter-wave antennas, radio - frequency front - ends of AAU (Active Antenna Unit).
- Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver - Assistance Systems).
- Networking & Communications
- Aerospace & Defense
Conclusion
The Copper Coin Embedded 6-Layer M6 &Isola 370HR Hybrid PCB is engineered for high-frequency, high-power, and high-reliability applications. Its advanced material blend, superior thermal management, and precision manufacturing make it an ideal choice for industries requiring ultra-low loss, high-speed signal integrity, and long-term durability.
For OEMs and engineers working on 5G, automotive radar, or aerospace systems, this Copper Coin Embedded hybrid PCB provides a cost-effective, high-performance solution without compromising on quality or reliability.
Interested in samples or bulk orders? Contact our sales team today!
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Isola 370HR PCB 12-layer 1.6mm Thick ENIG High Tg FR-4 Multilayer BoardNext:
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