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20 mil RO4003C PCB
20 mil RO4003C PCB
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  • Can You Handle High-frequency (RF/microwave) PCBs? Materials?
    • April 16. 2025

    Can You Handle High-frequency (RF/microwave) PCBs? Materials? Introduction High-frequency PCBs, particularly those used in RF (Radio Frequency) and microwave applications, require specialized materials and manufacturing expertise. Unlike standard FR-4 PCBs, these boards must maintain signal integrity, minimize dielectric losses, and withstand extreme thermal conditions. A common question we encoun...

  • What Is Your Minimum Drill Hole Size?
    • April 16. 2025

    What Is Your Minimum Drill Hole Size? A Comprehensive Guide to PCB Drilling Capabilities When designing a printed circuit board (PCB), one critical specification engineers must consider is the minimum drill hole size. This parameter determines the feasibility of vias, through-holes, and microvias, directly impacting the board’s functionality, density, and cost. In this article, we’ll explore: - St...

  • How to Choose the Right PCB Substrate for High-Frequency Applications?
    • May 21. 2025

    How to Choose the Right PCB Substrate for High-Frequency Applications? (Rogers vs. FR4 Comparison) Introduction In today's rapidly advancing electronics industry, selecting the right printed circuit board (PCB) substrate material has become increasingly critical—especially for high-frequency applications. Whether you're designing cellular base stations, automotive radar systems, or satellite commu...

  • Why Dk/Df Values Matter: Dielectric Properties' Impact on Signal Integrity in High-Frequency PCBs
    • May 21. 2025

    Why Dk/Df Values Matter: Dielectric Properties' Impact on Signal Integrity in High-Frequency PCBs Introduction In the world of high-frequency printed circuit boards(PCBs), signal integrity is paramount. As data rates increase and wireless technologies evolve, the dielectric properties of PCB materials play a critical role in ensuring reliable performance. Two key parameters—dielectric constant (Dk...

  • Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs
    • May 21. 2025

    Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs Introduction In high-speed PCB design, signal integrity is paramount. As data rates increase, crosstalk—unwanted electromagnetic coupling between traces—becomes a critical challenge. A well-optimized multilayer stackup is essential to minimize crosstalk while ensuring signal integrity, power delivery, and manufacturability. This ar...

  • What Makes RT/duroid 5880 the Ideal Choice for High-Frequency PCBs?
    • July 14. 2025

    What Makes RT/duroid 5880 the Ideal Choice for High-Frequency PCBs? Overview RT/duroid 5880 laminates are composite materials made by combining PTFE with randomly distributed glass fibers, celebrated for their exceptional performance characteristics. They are specially designed to meet the needs of applications requiring high-frequency operation and broadband functionality. With a low dielectric c...

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