Introducing the Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer, a cutting-edge solution that combines the exceptional properties of Rogers RO4003C and ITEQ's High Tg FR4 materials. This hybrid PCB offers a unique combination of high-frequency performance, thermal reliability, and mechanical processability. With its tight control on dielectric constant (Dk), low loss, and excellent CAF resistance, the Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer is the ideal choice for applications requiring high-performance circuitry in demanding environments.

RO4003C Profile:

The PCB's core utilizes Rogers RO4003C laminate, a hydrocarbon ceramic woven glass material. The RO4003C profile offers exceptional electrical performance, including a dielectric constant (DK) of 3.38 at 10 GHz, ensuring consistent signal integrity and reliable data transmission. With a dissipation factor of only 0.0027 at 10 GHz, it minimizes signal loss, making it perfect for high-frequency applications. Additionally,Rogers4003CPCBhas a high glass transition temperature (Tg) of >280°C and a decomposition temperature (Td) of >425°C, ensuring robust thermal reliability even in extreme conditions.

FR-4 (IT-180A) Profile:

The Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer also features ITEQ's High Tg FR4 material, known as IT-180A. This profile offers exceptional thermal reliability with a high glass transition temperature (Tg) of >175°C. It is a low CTE (Coefficient of Thermal Expansion) epoxy glass material, ensuring dimensional stability even in environments with significant temperature fluctuations. With a dielectric constant (DK) of 4.4 at 1 GHz and a dissipation factor of 0.015 at 1 GHz, IT-180A provides reliable electrical performance. Its T260> 60 minutes and T288 >20 minutes further enhance its thermal stability and reliability.

Features and Attentions:

The Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer offers several notable features and attentions. The 0.305mm RO4003C laminates provide tight control over dielectric constant (Dk) and low loss, comparable to conventional microwave laminates but at a fraction of the cost. These laminates utilize hydrocarbon ceramic woven glass and non-brominated materials. However, they are not UL 94 V-0 rated.

IT-180A, on the other hand, exhibits excellent CAF (Conductive Anodic Filament) resistance, making it highly reliable in harsh and humid environments. It is also compatible with lead-free processes, ensuring compliance with environmental regulations. The High Tg FR4 material offers high heat resistance, exceptional through-hole reliability, and excellent mechanical processability, making it ideal for a wide range of applications.

Stackup & Construction:

The Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer features a well-designed stackup for optimal performance.

The key construction details are as follows:

1) Board Dimensions: The PCB measures 57mm x 57mm, allowing for compact and space-efficient designs. The dimensions are manufactured with high precision, maintaining tight tolerances of +/- 0.15mm.

2) Copper Layers: The PCB features six copper layers, each with a thickness of 35 μm (1oz). The copper layers ensure excellent signal conductivity and provide a robust foundation for the circuitry.

3) RO4003C Core: The PCB includes two RO4003C cores, each with a thickness of 12mil (0.305mm). These cores provide exceptional electrical performance, low loss, and reliable signal transmission.

4) IT-180A FR-4 Core:The PCB incorporates an IT-180A FR-4 core, offering high thermal reliability, dimensional stability, and compatibility with lead-free processes.

5) Prepreg: The PCB includes two layers of prepreg, each with a thickness of 0.1mm. Prepreg provides insulation between the copper layers and enhances the overall structural integrity.

6) Finished Board Thickness: The finished board thickness of the Hybrid PCB is 1.1mm, ensuring a compact and robust design.

7) Via Plating Thickness: The vias on the PCB have a plating thickness of 25 μm, ensuring reliable conductivity and interconnections between layers.

8) Surface Finish: The PCB is finished with immersion gold (ENIG), providing a smooth and uniform surface that enhances solderability and ensures excellent electrical performance.

9) Silkscreen and Solder Mask: The top and bottom silkscreens are printed in white, providing clear and legible component markings for easy assembly and identification. The top and bottom solder masksare matte blue, offering excellent protection for the copper traces and preventing solder bridges during assembly.

10) Impedance Control: The Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer allows for precise impedance control. The top layer features a 7 mil trace with a single-end impedance of 90 ohms, ensuring accurate signal transmission and minimizing signal reflections.

11) Electrical Test: To guarantee the highest quality, each PCB undergoes a 100% electrical test before shipment, ensuring that all circuits are functioning correctly.

PCB Statistics:

The Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer offers the following statistics:

Components:The PCB supports up to 28 components, providing flexibility for various circuit designs and applications.

Total Pads: There are a total of 68 pads on the PCB, offering ample connectivity options for components and interconnections.

Thru Hole Pads: The PCB features 32 thru-hole pads, allowing for secure and reliable connections using through-hole components.

Top and Bottom SMT Pads: The top and bottom surfaces of the PCB provide 21 and 15 surface-mount technology (SMT) pads, respectively, enabling easy and efficient placement of SMT components.

Vias: The PCB includes a total of 73 vias, facilitating interconnections between different layers and ensuring robust signal routing.

Nets: The Hybrid PCB supports up to 6 nets, allowing for complex circuit configurations and versatile design possibilities.

Type of Artwork Supplied and Quality Standard:

The Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer accepts Gerber RS-274-X artwork, a widely used industry standard for PCB design files. This compatibility ensures seamless integration into existing design workflows, simplifying the manufacturing process.

The PCB adheres to the IPC-Class-2 quality standard, ensuring reliable and consistent performance. IPC-Class-2 specifies the criteria for acceptable quality levels for electronic assemblies, ensuring that the PCB meets the highest industry standards.

Availability:

The Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer is available worldwide, making it easily accessible for engineers, designers, and manufacturers across the globe. This global availability ensures that customers can leverage the performance and versatility of this PCB in their projects, regardless of their geographic location.

Typical Applications:

The Hybrid PCB 0.305mm RO4003C+High Tg FR4 6-Layer finds applications in a wide range of industries, thanks to its exceptional electrical performance, thermal reliability, and mechanical processability. Some typical applications include:

1. Cellular Base Station Antennas and Power Amplifiers: The PCB's high-frequency performance and low loss make it ideal for cellular base station antennas and power amplifiers, ensuring reliable and efficient wireless communication.

2. RF Identification Tags: The PCB's excellent signal integrity and dimensional stability make it suitable for RF identification tags, enabling reliable and accurate identification and tracking.

3. Automotive Radar and Sensors: The PCB's thermal reliability, mechanical processability, and high-frequency performance make it well-suited for automotive radar and sensors, enabling advanced driver assistance systems (ADAS) and autonomous driving applications.

4. LNB's for Direct Broadcast Satellites: The PCB's high-frequency performance and low loss make it suitable for LNB's (Low Noise Block) used in direct broadcast satellites, ensuring reliable reception and transmission of satellite signals.

In conclusion, the multilayer RO4003C FR4 PCB offers a unique combination of high-frequency performance, thermal reliability, and mechanical processability. With its exceptional electrical properties, dimensional stability, and compatibility with lead-free processes, this PCB is an excellent choice for various applications in the telecommunications, automotive, and satellite industries. Its availability worldwide ensures that engineers and manufacturers can benefit from its performance and versatility in their projects, regardless of their location.