• October 30. 2025

How Does Embedded Copper Coin Technology Enhance Thermal Management in High-Frequency PCBs? In the demanding world of high-frequency electronics, thermal management is not just a mechanical consideration—it is a critical factor that directly impacts electrical performance, signal integrity, and long-term reliability. As power densities increase in applications like 5G base stations and automotive ...

• November 12. 2025

What Are the Performance Advantages of a Hybrid 6-Layer PCB Combining RO4350B and High Tg FR-4?   For engineers designing cutting-edge RF, microwave, and high-speed digital systems, the choice of PCB materials is a critical determinant of performance, reliability, and cost. A homogeneous board made from a single material often forces a compromise. However, a 6-Layer Hybrid PCB that strategica...

• November 12. 2025

What Makes MT77 a Cost-Effective and FR-4 Compatible RF PCB Material?   1. The Foundation of Cost-Effectiveness: FR-4 Process Compatibility This is the single most significant factor driving down the total cost of ownership for MT77. Unlike traditional high-performance materials like PTFE (Teflon), which require specialized and expensive processing steps, Astra MT77 integrates seamlessly...