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Can You Handle High-frequency (RF/microwave) PCBs? Materials? Introduction High-frequency PCBs, particularly those used in RF (Radio Frequency) and microwave applications, require specialized materials and manufacturing expertise. Unlike standard FR-4 PCBs, these boards must maintain signal integrity, minimize dielectric losses, and withstand extreme thermal conditions. A common question we encoun...
What Is Your Minimum Drill Hole Size? A Comprehensive Guide to PCB Drilling Capabilities When designing a printed circuit board (PCB), one critical specification engineers must consider is the minimum drill hole size. This parameter determines the feasibility of vias, through-holes, and microvias, directly impacting the board’s functionality, density, and cost. In this article, we’ll explore: - St...
Why Dk/Df Values Matter: Dielectric Properties' Impact on Signal Integrity in High-Frequency PCBs Introduction In the world of high-frequency printed circuit boards(PCBs), signal integrity is paramount. As data rates increase and wireless technologies evolve, the dielectric properties of PCB materials play a critical role in ensuring reliable performance. Two key parameters—dielectric constant (Dk...
Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs Introduction In high-speed PCB design, signal integrity is paramount. As data rates increase, crosstalk—unwanted electromagnetic coupling between traces—becomes a critical challenge. A well-optimized multilayer stackup is essential to minimize crosstalk while ensuring signal integrity, power delivery, and manufacturability. This ar...
PTFE Materials Are Difficult to Process—How to Solve Lamination and Drilling Challenges? Introduction Polytetrafluoroethylene (PTFE), commonly known by the brand name Teflon (TFE), is a high-performance material widely used in printed circuit boards (PCBs) for high-frequency applications. Its low dielectric constant (Dk) and dissipation factor (Df) make it ideal for RF, microwave, and millimeter-w...
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