• April 16. 2025

How Do You Handle PCB Panelization? PCB Panelization: Optimizing Panel Size for Cost-Efficiency (V-Cut vs. Tab Routing) Introduction In PCB manufacturing, panelizationis a critical step that directly impacts production efficiency, material utilization, and overall cost. Panelization involves arranging multiple PCB designs onto a single manufacturing panel to optimize fabrication and assembly ...

• June 12. 2025

PTFE Materials Are Difficult to Process—How to Solve Lamination and Drilling Challenges? Introduction Polytetrafluoroethylene (PTFE), commonly known by the brand name Teflon (TFE), is a high-performance material widely used in printed circuit boards (PCBs) for high-frequency applications. Its low dielectric constant (Dk) and dissipation factor (Df) make it ideal for RF, microwave, and millimeter-w...

• June 12. 2025

What Are the Design Considerations for Hybrid High-Frequency PCBs? Introduction Hybrid (mixed dielectric) high-frequency PCBs combine different materials to optimize electrical performance, thermal stability, and manufacturability. These mixed dielectric hybrid boards are widely used in RF/microwave applications, aerospace, radar systems, and telecommunications, where signal integrity and thermal ...