Rogers RO3003 Microwave PCB 2-Layer Rogers 3003
20mil Circuit Board DK3.0 DF 0.001 High Frequency PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Rogers RO3003 PCB is a high-frequency material
known for its excellent electrical properties, low loss, and high thermal
conductivity. It is widely used in applications such as wireless communication
systems, radar systems, satellite systems, and high-speed digital circuits.
One of the significant benefits of RO3003 is
its low dielectric loss, making it ideal for high-frequency applications. It
also has a low dissipation factor, high thermal conductivity, and excellent
dimensional stability. The material's high glass transition temperature (Tg)
also ensures its stability in high-temperature environments.
RO3003 substrate has a dielectric constant of
3.0 and a loss tangent of 0.0013 at 10 GHz, which is lower than other
high-frequency PCB materials. It also has a low moisture absorption rate and
excellent electrical and mechanical properties over a wide temperature range,
from -55°C to 150°C.
The material's excellent properties make it an
ideal choice for applications that require high-frequency performance and
reliability, such as high-speed digital circuits, microwave devices, power
amplifiers, and antennas.
Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers
PCB Specifications
|
PCB SIZE
|
90 x
75mm=1PCS
|
|
BOARD TYPE
|
Double sided PCB
|
|
Number of Layers
|
2
layers
|
|
Surface Mount Components
|
YES
|
|
Through Hole Components
|
NO
|
|
LAYER STACKUP
|
copper ------- 18um(0.5 oz)+plate TOP layer
|
|
RO3003 0.508mm
|
|
copper ------- 18um(0.5 oz) +
plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
5 mil / 5 mil
|
|
Minimum / Maximum Holes:
|
0.5mm
|
|
Number of Different Holes:
|
1
|
|
Number of Drill Holes:
|
1
|
|
Number of Milled Slots:
|
0
|
|
Number of Internal Cutouts:
|
0
|
|
Impedance Control:
|
no
|
|
Number of Gold finger:
|
0
|
|
BOARD MATERIAL
|
|
|
Glass Epoxy:
|
RO3003 0.508mm
|
|
Final foil external:
|
1 oz
|
|
Final foil internal:
|
N/A
|
|
Final height of PCB:
|
0.6 mm ±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion
gold (31%)
|
|
Solder Mask Apply To:
|
NO
|
|
Solder Mask Color:
|
N/A
|
|
Solder Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of Component Legend
|
Top
Side
|
|
Colour of Component Legend
|
Black
|
|
Manufacturer
Name or Logo:
|
Marked
on the board in a conductor and legend FREE AREA
|
|
VIA
|
N/A
|
|
FLAMIBILITY RATING
|
UL 94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline dimension:
|
0.0059"
|
|
Board plating:
|
0.0029"
|
|
Drill tolerance:
|
0.002"
|
|
TEST
|
100% Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide, Globally.
|
Data Sheet of Rogers 3003 (RO3003)
|
RO3003 Typical Value
|
|
Property
|
RO3003
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
3.0±0.04
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric
Constant,εDesign
|
3
|
Z
|
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation
Factor,tanδ
|
0.001
|
Z
|
|
10
GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal
Coefficient of ε
|
-3
|
Z
|
ppm/℃
|
10 GHz -50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Dimensional
Stability
|
0.06
0.07
|
X
Y
|
mm/m
|
COND A
|
IPC-TM-650 2.2.4
|
|
Volume
Resistivity
|
107
|
|
MΩ.cm
|
COND A
|
IPC 2.5.17.1
|
|
Surface
Resistivity
|
107
|
|
MΩ
|
COND A
|
IPC 2.5.17.1
|
|
Tensile
Modulus
|
930
823
|
X
Y
|
MPa
|
23℃
|
ASTM D 638
|
|
Moisture
Absorption
|
0.04
|
|
%
|
D48/50
|
IPC-TM-650 2.6.2.1
|
|
Specific
Heat
|
0.9
|
|
j/g/k
|
|
Calculated
|
|
Thermal
Conductivity
|
0.5
|
|
W/M/K
|
50℃
|
ASTM D 5470
|
Coefficient of Thermal Expansion
(-55 to 288℃)
|
17
16
25
|
X
Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650 2.4.4.1
|
|
Td
|
500
|
|
℃TGA
|
|
ASTM D 3850
|
|
Density
|
2.1
|
|
gm/cm3
|
23℃
|
ASTM D 792
|
|
Copper
Peel Stength
|
12.7
|
|
Ib/in.
|
1oz,EDC After Solder
Float
|
IPC-TM 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free
Process Compatible
|
Yes
|
|
|
|
|
BICHENG PCB EQUIPMENT:
BICHENG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
Email : info@bichengpcb.com
