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Home Taconic PCB Board Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg

Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg

They are manufactured with very lightweight woven fiberglass and are more dimensionally stable than chopped fiber reinforced PTFE composites.

  • Item NO.:

    BIC-106-v134.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Taconic TLY laminates are a type of low loss laminates. The woven matrix yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.


The dielectric constant is as low as 2.17-2.20 +/-0.02, and dissipation factor is as low as 0.0009.


RO3003 PCB Circuit Board


Benefits:


Dimensionally stable

Lowest DF

Low moisture absorption

High copper peel strength

Uniform & consistent DK

Laser ablatable


Applications:


Automotive radar

Satellite/cellular communications

Power amplifiers

LNBs, LNAs, LNCs

Aerospace

Ka, E and W band applications



PCB Specifications:

FastRise-28 (FR-28) Typical Value
Property Value Direction Units Condition Test Method
Dielectric Constant,ε 2.78 - - 10 GHz IPC-TM-650 2.5.5.5.1
Dissipation Factor,tanδ 0.0015 - - 10 GHz IPC-TM-650 2.5.5.5.1
Water Absorption 0.08 % IPC TM-650 2.6.2.1
Dielectric breakdown voltage 49 KV IPC TM-650 2.5.6
Dielectric strength 1090 V/mil ASTM D 149
Volume Resistivity 8.00 x 108 MΩ/cm IPC-TM-650 2.5.17.1
Surface Resistivity 3.48 x 108 IPC-TM-650 2.5.17.1
Tg 188 ASTM E 1640
Tensil strength 1690 X psi ASTM D 882
1480 Y psi
Tensil modulus 304 X psi ASTM D 882
295 Y psi
Density 1.82 gm/cm³ ASTM D-792 Method A
Td 709 °F IPC TM-650 2.4.24.6
Peel Strength 7 lbs/in IPC-TM-650 2.4.8
Thermal Conductivity 0.25 W/mk ASTM F433
Coefficient of Thermal Expansion
59
70
72
X
Y
Z
ppm/℃ IPC-TM-650 2.4.41
Hardness 68 Shore D ASTM D 2240


 RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23℃ ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9 j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
17
16
25

X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃TGA ASTM D 3850
Density 2.1 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


FastRise Prepreg
Product Carrier film                (mil) Film Elognation          (%) Pressed Thickness (mil) Pressed Thickness (mil) Pressed Thickness (mil) Nominal DK              (Min. / Max.)                 (10 GHz) Typical Flow (%)
FR-26-0025-60 1 200-300 2.7 1.3 1 2.58 17
FR-27-0030-25 2.3 30-60 3.5 2.1 Not recommended 2.74                          (2.71 / 2.78) 4
FR-27-0035-66 1 200-300 3.7 2.5 2.1 2.7 36
FR-27-0040-25 3 30-60 4.9 3.7 Not recommended 2.74 4
FR-28-0040-50 1 200-300 4.9 3.7 3.5 2.81                                (2.80 / 2.82) 23
FR-27-0042-75 2.3 30-60 5.16 3.96 3.5 2.73 35
FR-27-0045-35 3 30-60 5.8 4.6 4.2 2.75                                (2.73 / 2.77) 13
FR-27-0050-40 3 30-60 6.1 5.5 4.9 2.76                                 (2.71 / 2.80) 23
0.5 oz Cu. 50% removal 1 oz. Cu. 50% removal



6-Layer RF PCB On RO3003 and FR-28


BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION


BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS



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