Rogers RO3003 6-layer RF PCB bonded by FastRise-28 Prepreg

They are manufactured with very lightweight woven fiberglass and are more dimensionally stable than chopped fiber reinforced PTFE composites.

Item NO.:
BIC-106-v134.0
Order(MOQ):
1-10
Payment:
T/T
Price Range:1 - 50/$99
Price Range:1 - 50/$2.9
Product Origin:
China
Color:
White
Shipping Port:
Shenzhen
Lead Time:
7-10 days

Product Detail

Taconic High Frequency PCB Built On TLY-3 30mil 0.762mm With Immersion Gold for Satellite / Cellular Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Taconic TLY laminates are a type of low loss laminates. The woven matrix yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.

The dielectric constant is as low as 2.17-2.20 +/-0.02, and dissipation factor is as low as 0.0009.

Benefits:

Dimensionally stable

Lowest DF

Low moisture absorption

High copper peel strength

Uniform & consistent DK

Laser ablatable

Applications:

Automotive radar

Satellite/cellular communications

Power amplifiers

LNBs, LNAs, LNCs

Aerospace

Ka, E and W band applications

PCB Specifications:

FastRise-28 (FR-28) Typical Value
Property	Value	Direction	Units	Condition	Test Method
Dielectric Constant,ε	2.78	-	-	10 GHz	IPC-TM-650 2.5.5.5.1
Dissipation Factor,tanδ	0.0015	-	-	10 GHz	IPC-TM-650 2.5.5.5.1
Water Absorption	0.08		%		IPC TM-650 2.6.2.1
Dielectric breakdown voltage	49		KV		IPC TM-650 2.5.6
Dielectric strength	1090		V/mil		ASTM D 149
Volume Resistivity	8.00 x 108		MΩ/cm		IPC-TM-650 2.5.17.1
Surface Resistivity	3.48 x 108		MΩ		IPC-TM-650 2.5.17.1
Tg	188		℃		ASTM E 1640
Tensil strength	1690	X	psi		ASTM D 882
Tensil strength	1480	Y	psi		ASTM D 882
Tensil modulus	304	X	psi		ASTM D 882
Tensil modulus	295	Y	psi		ASTM D 882
Density	1.82		gm/cm³		ASTM D-792 Method A
Td	709		°F		IPC TM-650 2.4.24.6
Peel Strength	7		lbs/in		IPC-TM-650 2.4.8
Thermal Conductivity	0.25		W/mk		ASTM F433
Coefficient of Thermal Expansion	59 70 72	X Y Z	ppm/℃		IPC-TM-650 2.4.41
Hardness	68		Shore D		ASTM D 2240

RO3003 Typical Value
Property	RO3003	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.0±0.04	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.001	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-3	Z	ppm/℃	10 GHz -50℃to 150℃	IPC-TM-650 2.5.5.5
Dimensional Stability	0.06 0.07	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Volume Resistivity	107		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	107		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	930 823	X Y	MPa	23℃	ASTM D 638
Moisture Absorption	0.04		%	D48/50	IPC-TM-650 2.6.2.1
Specific Heat	0.9		j/g/k		Calculated
Thermal Conductivity	0.5		W/M/K	50℃	ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288℃)	17 16 25	X Y Z	ppm/℃	23℃/50% RH	IPC-TM-650 2.4.4.1
Td	500		℃TGA		ASTM D 3850
Density	2.1		gm/cm3	23℃	ASTM D 792
Copper Peel Stength	12.7		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

FastRise Prepreg

Product	Carrier film (mil)	Film Elognation (%)	Pressed Thickness (mil)	Pressed Thickness (mil)	Pressed Thickness (mil)	Nominal DK (Min. / Max.) (10 GHz)	Typical Flow (%)
FR-26-0025-60	1	200-300	2.7	1.3	1	2.58	17
FR-27-0030-25	2.3	30-60	3.5	2.1	Not recommended	2.74 (2.71 / 2.78)	4
FR-27-0035-66	1	200-300	3.7	2.5	2.1	2.7	36
FR-27-0040-25	3	30-60	4.9	3.7	Not recommended	2.74	4
FR-28-0040-50	1	200-300	4.9	3.7	3.5	2.81 (2.80 / 2.82)	23
FR-27-0042-75	2.3	30-60	5.16	3.96	3.5	2.73	35
FR-27-0045-35	3	30-60	5.8	4.6	4.2	2.75 (2.73 / 2.77)	13
FR-27-0050-40	3	30-60	6.1	5.5	4.9	2.76 (2.71 / 2.80)	23

				0.5 oz Cu. 50% removal	1 oz. Cu. 50% removal

6-Layer RF PCB On RO3003 and FR-28

BICHNEG PCB WORKSHOP:

BICHNEG PCB WORKSHOP

BICHNEG PCB CERTIFICATION:

BICHNEG PCB CERTIFICATION

BICHENG PCB MAIN COURIERS:

BICHENG PCB MAIN COURIERS

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FastRise-28 Prepreg Circuit Board 6-layer Rogers RO3003 PCB RO3003 FR-28 Prepreg PCB FastRise-28 Prepreg Printed Circuit Board 6-layer RO3003 FR-28 Prepreg PCB FastRise™28 Multilayer PCB Board

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