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20 mil RO4003C PCB
20 mil RO4003C PCB
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  • Why RO4350B is the Go-To Material for High-Frequency PCB Applications?
    • February 20. 2025

    Why RO4350B is the Go-To Material for High-Frequency PCB Applications? In the ever-evolving world of electronics, the demand for high-performance printed circuit boards (PCBs) is growing exponentially. Whether it’s for telecommunications, automotive systems, or aerospace applications, engineers and designers require PCBs that deliver exceptional electrical performance, thermal stability, and relia...

  • Why Does the Color of Immersion Gold on PCBs Vary?
    • March 24. 2025

    Why Does the Color of Immersion Gold on PCBs Vary? An In-Depth Analysis of ENIG Process and Its Influencing Factors In modern electronics manufacturing, the surface finish of printed circuit boards (PCBs) plays a critical role in determining the performance and reliability of the final product. Electroless Nickel Immersion Gold (ENIG), a widely used surface finish, is favored for its excellent sol...

  • How to Choose the Right PCB Substrate for High-Frequency Applications?
    • May 21. 2025

    How to Choose the Right PCB Substrate for High-Frequency Applications? (Rogers vs. FR4 Comparison) Introduction In today's rapidly advancing electronics industry, selecting the right printed circuit board (PCB) substrate material has become increasingly critical—especially for high-frequency applications. Whether you're designing cellular base stations, automotive radar systems, or satellite commu...

  • Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs
    • May 21. 2025

    Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs Introduction In high-speed PCB design, signal integrity is paramount. As data rates increase, crosstalk—unwanted electromagnetic coupling between traces—becomes a critical challenge. A well-optimized multilayer stackup is essential to minimize crosstalk while ensuring signal integrity, power delivery, and manufacturability. This ar...

  • How to Choose Between RO4350B, PTFE, and Ceramic-Filled Substrates?
    • June 12. 2025

    How to Choose Between RO4350B, PTFE, and Ceramic-Filled Substrates? Introduction High-frequency PCBs are critical in modern RF and microwave applications, including 5G communications, radar systems, and satellite technology. Selecting the right substrate material is essential to ensure signal integrity, thermal stability, and manufacturability. Three of the most commonly used high-frequency PCB ma...

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