• May 21. 2025

Multilayer Stackup Design: Minimizing Crosstalk in High-Speed PCBs Introduction In high-speed PCB design, signal integrity is paramount. As data rates increase, crosstalk—unwanted electromagnetic coupling between traces—becomes a critical challenge. A well-optimized multilayer stackup is essential to minimize crosstalk while ensuring signal integrity, power delivery, and manufacturability. This ar...

• June 12. 2025

How to Choose Between RO4350B, PTFE, and Ceramic-Filled Substrates？ Introduction High-frequency PCBs are critical in modern RF and microwave applications, including 5G communications, radar systems, and satellite technology. Selecting the right substrate material is essential to ensure signal integrity, thermal stability, and manufacturability. Three of the most commonly used high-frequency PCB ma...

• July 14. 2025

What Makes RT/duroid 5880 the Ideal Choice for High-Frequency PCBs?   Overview  RT/duroid 5880 laminates are composite materials made by combining PTFE with randomly distributed glass fibers, celebrated for their exceptional performance characteristics. They are specially designed to meet the needs of applications requiring high-frequency operation and broadband functionality. With ...

• July 14. 2025

Why is RT/duroid 6035HTC the Ultimate Choice for High-Power RF Applications?   Introduction Rogers RT/duroid 6035HTC high-frequency circuit materials are ceramic-reinforced polytetrafluoroethylene (PTFE) composites, engineered specifically for high-power radio frequency (RF) and microwave uses. These materials excel in high-power settings: their thermal conductivity surpasses that of sta...