Introduction to RO4730G3:

RO4730G3 represents a paradigm shift in antenna grade laminates, offering a compelling alternative to traditional PTFE-based materials without compromising on performance. Crafted with precision, the resin systems of RO4730G3 dielectric materials are tailored to deliver optimal antenna functionality, making it a go-to choice for designers seeking a cost-effective yet high-quality solution. Embracing compatibility with FR-4 and high-temperature lead-free solder processing, RO4730G3 eliminates the need for specialized treatment, streamlining the fabrication process and enhancing operational efficiency. With a focus on cost optimization and performance enhancement, RO4730G3 Rogers laminate stands out as a beacon of innovation in the world of antenna materials.

What are the benefits of using RO4730G3 PCB for antenna applications?

Using the RO4730G3 PCB for antenna applications offers a range of benefits that cater to the specific requirements of high-performance antenna designs. Here are some key advantages of utilizing the RO4730G3 Rogers substrates PCB for antenna applications:

1)Dielectric Constant (Dk): 3.0 +/- 0.05 at 10GHz, ensuring stable signal transmission.

2)Dissipation Factor: .0028 at 10GHz, minimizing signal loss.

3)Thermal Conductivity: 0.45W/mK, facilitating efficient heat dissipation.

4)Thermal Coefficient of Dk: 34 ppm/°C, ensuring thermal stability.

5)Coefficient of Thermal Expansion (CTE) matched to copper: x y z: 15.9 ppm/°C, 14.4 ppm/°C, 35.2 ppm/°C, reducing the risk of delamination.

6)Glass Transition Temperature (Tg): >280°C, guaranteeing reliability under extreme conditions.

7)Decomposition Temperature (Td): 411°C TGA, ensuring durability and longevity.

Benefits of Choosing RO4730G3

1)Low Loss Dielectric:

With a low profile foil, RO4730G3 minimizes passive intermodulation (PIM) and insertion loss, optimizing signal integrity.

2)Unique Filler/Closed Microspheres:

Offering low density and lightweight properties, RO4730G3 is 30% lighter than PTFE/Glass laminates, enhancing portability and ease of handling.

3)High Tg and Low Z-axis CTE:

With a Tg exceeding 280°C and a CTE <30ppm/°C, RO4730G3 provides design flexibility, ensuring compatibility with automated assembly processes.

4)Consistent Performance:

Featuring a low TCDk (<40 ppm/°C), RO4730G3 delivers consistent circuit performance across a wide range of operating conditions.

5)Specially Formulated Resin System/Filler:

Equipped with a thermoset resin system and filler, RO4730G3 offers ease of fabrication, PTH process capability, and a Dk of 3.0, catering to diverse design needs.

6)Environmentally Friendly:

Compliant with lead-free processes and RoHS standards, RO4730G3 high frequency PCB prioritizes environmental sustainability without compromising on quality.

PCB Construction Details

Stackup: 2-layer rigid PCB with Rogers RO4730G3 30mil Core .

Board Dimensions: 88.2mm x 66.47mm, ensuring compactness and versatility.

Minimum Trace/Space: 4/4 mils, enabling intricate circuit designs.

Surface Finish: Electroless Nickel Immersion Gold (ENIG), ensuring superior conductivity and corrosion resistance.

Quality Standard: IPC-Class-2, guaranteeing high-quality manufacturing standards.

Availability: Worldwide, catering to a global clientele.

Typical Applications

Cellular Base Station Antennas:

RO4730G3 Rogers antenna PCB is ideal for enhancing the performance and reliability of cellular base station antennas, ensuring seamless connectivity and signal transmission.

Conclusion

In conclusion, RO4730G3 Rogers PCB emerges as a beacon of innovation in the realm of high-frequency antenna design, offering a blend of performance, affordability, and environmental sustainability. By harnessing the power of RO4730G3, designers can unlock new possibilities in antenna applications, paving the way for a more connected and technologically advanced future.