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Home Flexible Printed Circuit Flexible PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener

Flexible PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener

This is a type of single layer flexible printed circuit for the application of Wireless Dongle, 0.2mm thick.

  • Item NO.:

    BIC-254-v57.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$1.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Flexible PCB with Polyimide Stiffener Flexible Printed Circuit (FPC) with PI Stiffener

(FPC’s are custom-made products, the picture and parameters shown are just for reference)


General description:

The base laminate is from Shengyi, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting head.


FPC wit PI stiffener


Parameter and data sheet:


Size of Flexible PCB 230.5 X 40.8mm 
Number of Layers 1
Board Type Flexible PCB
Board Thickness 0.20mm
Board Material Polyimide (PI) 25µm
Board Material Supplier ITEQ
Tg Value of Board Material  60℃
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes N/A
Surface Cu thickness  35µm (1oz)
Coverlay Colour Yellow
Number of Coverlay 1
Thickness of Coverlay 25 µm
Stiffener Material Polyimide
Stiffener Thickness 0.2mm
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃No peeling after Min. 3 times test
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles. 
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function  100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2


FPC wit PI stiffener


Features and benefits:


Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Low cost

Continuity of processing

Focus on low to medium volume production

More than 18 years of experience


Applications:


Mobile phone built-in antenna FPC, flex keyboard for mobile phone keys, Industrial control computer soft board


Stiffener:


In many applications where there are components soldered, the flexible boards require external stiffeners (Stiffener, also known as the reinforcing board) for external support. The stiffener materials are PI or Polyester film, glass fiber, polymer materials, steel foil, aluminum shim and so on.


(1)PI or Polyester

PI and polyester films are commonly used stiffener materials for flexible circuit board. The commonly used thickness is 125μm (5mil), some hardness can be obtained.

       

(2)Glass fibers

Glass fibers (such as FR-4), which are also commonly used materials for stiffeners. The fiber glass stiffener has a higher hardness than that of PI or Polyester, used where the requirements of harness is higher. The thickness range is typically 125μm (5mil) to 3.175mm (125mils). However, its processing is relatively difficult than PI, and may not be a standing material for some FPC factories.    

             

(3)Polymer

Polymer, such as plastic, etc. is also used as stiffeners.

Its water absorption is low, with high pressure and high temperature resistance.  

     

(4)Steel foil, aluminum shim

The support hardness of steel foil, aluminum shim is high, the heat can also be dissipated. The hardness or heat dissipation in the design is the main concern.


More Displays of PI Stiffener:


PI Stiffener  PI Stiffener PI Stiffener 

PI Stiffener PI Stiffener


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