Flexible PCB With Stainless Steel Stiffener Flex with
Stainless Steel Shim
(Flexible
printed circuits are custom-made products, the picture and parameters shown are
just for reference)
General
description:
This
is a type of flexible printed circuit for the application of Wifi Booster. It’s
a 2 layer flexible circuit at 0.25mm thick. The base laminate is from Shengyi.
Parameter
and data sheet:
|
Size of
Flexible PCB
|
20.80 X 80.17mm
|
|
Number of Layers
|
2
|
|
Board Type
|
Flexible PCB
|
|
Board Thickness
|
0.25mm
|
|
Board Material
|
Polyimde
50µm
|
|
Board Material Supplier
|
ITEQ
|
|
Tg Value of Board Material
|
60℃
|
|
|
|
PTH Cu thickness
|
≥20 µm
|
|
Inner Iayer Cu thicknes
|
N/A
|
|
Surface Cu thickness
|
35
µm
|
|
|
|
|
Coverlay Colour
|
Yellow
|
|
Number of Coverlay
|
2
|
|
Thickness of Coverlay
|
25
µm
|
|
Stiffener Material
|
Stainless
steel
|
|
Stiffener Thickness
|
0.3mm
|
|
|
|
|
Type of Silkscreen Ink
|
IJR-4000
MW300
|
|
Supplier of Silkscreen
|
TAIYO
|
|
Color of Silkscreen
|
White
|
|
Number of Silkscreen
|
1
|
|
|
|
Peeling test of Coverlay
|
No
peelable
|
|
Legend Adhesion
|
3M 90℃No
peeling after Min. 3 times test
|
|
|
|
Surface Finish
|
Immersion
Gold
|
|
Thickness of Nickle/Gold
|
Au:
0.03µm(Min.); Ni 2-4µm
|
|
RoHS Required
|
Yes
|
|
Famability
|
94-V0
|
|
|
|
Thermal Shock Test
|
Pass, -25℃±125℃, 1000 cycles.
|
|
Thermal Stress
|
Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
|
|
Function
|
100%
Pass electrical test
|
|
Workmanship
|
Compliance
with IPC-A-600H & IPC-6013C Class 2
|
Features
and benefits:
Excellent
flexibility
Reducing
the volume
Weight
reduction
Consistency
of assembly
Increased
reliability
The
end can be whole soldered
Low
cost
Continuity
of processing
Competitive
price
High
technology
Applications:
Toy
lamp strip, industrial control touch remote control soft board, Automobile
sensor flex board
Stiffener:
In
many applications where there are components soldered, the flexible boards require external stiffeners (Stiffener, also known as the reinforcing board)
for external support. The stiffener materials are PI or Polyester film, glass
fiber, polymer materials, steel foil, aluminum shim and so on.
(1)PI
or Polyester
PI
and polyester films are commonly used stiffener materials for flexible circuit
board. The commonly used thickness is 125μm (5mil), some hardness can be
obtained.
(2)Glass
fibers
Glass
fibers (such as FR-4), which are also commonly used materials for stiffeners.
The fiber glass stiffener has a higher hardness than that of PI or Polyester,
used where the requirements of harness is higher. The thickness range is
typically 125μm (5mil) to 3.175mm (125mils). However, its processing is
relatively difficult than PI, and may not be a standing material for some FPC
factories.
(3)Polymer
Polymer,
such as plastic, etc. is also used as stiffeners.
Its
water absorption is low, with high pressure and high temperature resistance.
(4)Steel
foil, aluminum shim
The
support hardness of steel foil, aluminum shim is high, the heat can also be
dissipated. The hardness or heat dissipation in the design is the main concern.
More
Displays of Stainless Steel Stiffener
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