Wangling F4BME217 PCB 1mm Thick DK2.17 Substrate 2-Layer Bare Copper

Wangling F4BME217 PCB 1mm Thick DK2.17 Substrate 2-Layer Bare Copper

1. Product Overview

This is a high-performance 2-layer RF/microwave printed circuit board built on Wangling F4BME217 PTFE composite laminate, with a nominal dielectric core thickness of 1.0 mm and finished board thickness of 1.3 mm. It adopts bare copper surface treatment, no solder mask or silkscreen, and is manufactured to IPC-Class-2 quality standards with 100% electrical testing before shipment. The DK2.17 F4B PCB is purpose-engineered for high-frequency, low-loss, high-stability RF systems such as microwave links, radar front-ends, passive components, antenna feed networks, satellite communication, and 5G base station antennas. It delivers excellent passive intermodulation (PIM) performance, fine-line etching capability, and low conductor loss, serving as a reliable domestic alternative to imported high-frequency RF PCBs.

2. PCB Construction

This section summarizes the mechanical, fabrication, and surface finishing specifications of the finished PCB, covering outline dimensions, line/space capability, hole size, copper weight, surface treatment, and quality control.

3. PCB Stackup & Layer Structure

The stackup defines the layer sequence and thickness distribution, ensuring impedance control, mechanical stability, and low-loss high-frequency transmission.

4. PCB Layout Statistics Summary & Design Data

This table provides key layout metrics for assembly planning, impedance design, and process verification.

5. Core Performance Advantages & Differentiators

5.1 Low Dielectric Loss & High-Frequency Stability

Wangling F4BME217 is a woven fiberglass-reinforced PTFE composite optimized for RF and microwave use. At 10 GHz, its typical dielectric constant Dk = 2.17 (tolerance±0.04) and dissipation factor Df = 0.001; at 20 GHz, Df = 0.0014, enabling extremely low insertion loss and stable phase response across wide bandwidths.

5.2 Superior PIM & Low Conductor Loss

F4BME217 high frequency PCB uses Reverse-Treated Foil (RTF) copper, which greatly improves low-PIM performance, supports finer circuit etching, and reduces conductor loss compared with standard ED foil. This is critical for high-sensitivity receivers, multicarrier power amplifiers, and antenna arrays.

5.3 Excellent Dimensional & Thermal Stability

By balancing PTFE and fiberglass ratio, the material achieves controllable Dk, low loss, and enhanced dimensional stability. Higher fiberglass content increases Dk, lowers CTE, reduces temperature drift, and improves reliability under thermal cycling.

5.4 Bare Copper Structure for RF Performance

Bare copper finish eliminates signal attenuation from surface finishes like ENIG or HASL. The absence of solder mask and silkscreen preserves consistent dielectric environment, reduces parasitic effects, and supports optimal high-frequency performance.

5.5 High Insulation & Voltage Withstand

Volume resistivity≥6×10⁶MΩ·cm, surface resistivity≥1×10⁶MΩ, electrical strength >23 kV/mm, and breakdown voltage >30 kV ensure safe operation in high-voltage RF bias circuits.

5.6 Wide Temperature & Environmental Resistance

Long-term working temperature:−55°C to +260°C. Passes 260°C, 10 s, 3 cycles thermal stress without delamination. Water absorption≤0.08%, making it suitable for outdoor, aerospace, and harsh industrial environments.

6. Typical Target Applications

• Microwave, RF, and radar systems
• Phase shifters, filters, and other passive RF components
• Power dividers, directional couplers, combiners
• Antenna feed networks and phased-array antennas
• Satellite communication terminals
• 5G/6G base station antennas and active antenna units (AAU)

Part 2: CCL (Copper Clad Laminate) Technical Knowledge

1. Introduction to F4BME217 CCL

F4BME217 is a high-performance PTFE-based copper clad laminate developed by Taizhou Wangling Insulation Materials Factory for RF, microwave, and millimeter-wave applications. It combines woven fiberglass cloth, PTFE resin, and film to deliver stable electrical properties, low loss, and good mechanical strength. It outperforms legacy F4B220 with lower loss, higher insulation resistance, and better stability, and serves as a cost-effective domestic substitute for imported high-frequency laminates.

2. Full Datasheet Parameters of F4BME217 CCL

3. Key Technical Features of F4BME217 CCL

3.1 Customizable Dielectric Properties

Dk ranges from 2.17 to 3.0 and can be customized by adjusting PTFE-to-fiberglass ratio. Higher Dk improves dimensional stability and lowers CTE but slightly increases Df, allowing engineers to balance electrical performance, mechanical robustness, and processing needs.

3.2 F4BM vs. F4BME vs. F4BME217

• F4BM: uses ED copper foil, for applications without strict PIM requirements
• F4BME: uses RTF copper foil, excellent PIM, precise line control, low conductor loss
• F4BME217: optimized grade of F4BME with Dk = 2.17, ultra-low loss, best for high-precision RF designs

3.3 Copper Foil Options

• F4BM: ED foil, 0.5 oz, 1 oz, 1.5 oz, 2 oz
• F4BME / F4BME217: RTF foil, 0.5 oz, 1 oz

RTF provides better surface roughness control, improved adhesion, and superior high-frequency performance.

3.4 Available Sizes & Thicknesses

• Standard sizes: 460×610 mm, 500×600 mm, 850×1200 mm, 914×1220 mm, 1000×1200 mm
• Custom sizes: 300×250 mm, 350×380 mm, 500×500 mm, 840×840 mm, 1000×1500 mm
• Thickness range: 0.1 mm ~ 12.0 mm (dielectric or total thickness)
• Note: thickness≥4.0 mm or≤0.2 mm limited to max 500×610 mm.

3.5 Metal-Backed Versions (Al/Cu Base)

• F4BME217-AL: aluminum-backed for shielding and heat dissipation
• F4BME217-CU: copper-backed for higher thermal conductivity
• Metal base thickness: 0.48, 0.98, 1.48, 1.98, 2.98, 3.98 mm (custom available).

4. Why F4BME217 Stands Out in RF/Microwave CCL

• Ultra-low loss at high frequencies: Df = 0.001 @10 GHz, far superior to standard FR-4
• Stable Dk over temperature & frequency: minimal phase shift in broadband systems
• Excellent PIM performance:≤−159 dBc, critical for base stations and radars
• High thermal stability: withstands lead-free reflow and harsh environments
• Domestic high-end alternative: comparable to imported brands at lower cost
• Full ecosystem: standard and custom sizes, thicknesses, metal-backed options

5. Testing & Compliance

Dk/Df: GB/T 12636-1990, IPC-TM-650 2.5.5.5 stripline method

Other properties: IPC-TM-650, GB/T 4722-2017

All data are typical values for material selection; customers should verify suitability for specific applications.

6.Conclusion

This F4BME217 1mm 2-layer PCB integrates advanced PTFE composite material, RTF copper, precision fabrication, and IPC-Class-2 quality to create a high-performance, cost-effective solution for professional RF and microwave systems. Its low loss, low PIM, stable Dk, and mechanical robustness make it suitable for commercial and industrial communication systems while avoiding overspecification and unnecessary cost. Supported by complete CCL engineering data and scalable manufacturing, this platform supports reliable mass production and consistent field performance.