8-Layer on RO4350B Material RO4450F Bondply HDI RF PCB with 1.6mm Thick ENEPIG Surface Finish

8-Layer on RO4350B Material RO4450F Bondply HDI RF PCB with1.6mm Thick ENEPIG Surface Finish

In the ever-evolving landscape of technology and innovation, the need for reliable and high-performance printed circuit boards (PCBs) is paramount. Introducing our cutting-edge 8-layer High-Density Interconnect HDI RF PCB, meticulously crafted with precision using RO4350B core material and RO4450F bondply. This advanced PCB promises exceptional electrical performance and reliability tailored to meet the demands of modern RF applications across various industries such as telecommunications, automotive, and satellite communications.

PCB Construction Details

PCB Stackup Details

This 8-layer HDI RF PCB features a mixed dielectric construction with Rogers RO4350B cores and RO4450F bondply for optimal RF performance:

PCB Statistics

Introduction to RO4350B Core and RO4450F Bondply

Rogers 4350B and RO4450F materials are at the forefront of PCB technology, offering a unique blend of performance and manufacturability. The RO4350B core material delivers exceptional dielectric control, low loss characteristics, and stability across a wide range of temperatures. Its UL 94 V-0 rating and thermal properties make it ideal for high-power RF applications and mixed dielectric multi-layer constructions.

On the other hand, the RO4450F bondply complements the core material by enhancing lateral flow capabilities and facilitating multiple lamination cycles. The compatibility with RO4000 laminates and FR-4 bonding requirements make it a versatile choice for complex multi-layer designs, ensuring reliability and performance in demanding environments.

Key Features of RO4350B Core

• Dielectric Constant (DK): 3.48 +/- 0.05 at 10GHz/23°C
• Dissipation Factor: 0.0037 at 10GHz/23°C
• Thermal Conductivity: 0.69 W/m/°K
• Coefficient of Thermal Expansion (CTE): X=10 ppm/°C, Y=12 ppm/°C, Z=32 ppm/°C
• High Glass Transition Temperature (Tg): >280°C
• Low Water Absorption: 0.06%

Key Features of RO4450F Bondply

• Dielectric Constant (DK): 3.52 +/- 0.05 at 10GHz/23°C
• Dissipation Factor: 0.004 at 10GHz/23°C
• Thermal Conductivity: 0.65 W/m/°K
• Coefficient of Thermal Expansion (CTE): X=19 ppm/°C, Y=17 ppm/°C, Z=50 ppm/°C

Typical Applications

This 8-Layer HDI material RF PCB is ideal for:

• Cellular Base Station Antennas and Power Amplifiers
• RF Identification Tags
• Automotive Radar and Sensors
• LNB's for Direct Broadcast Satellites

Ordering Information

-Availability: Worldwide

-Lead Time: Contact for details

-Customization: Available upon request

For inquiries, samples, or bulk orders, contact our sales team today!

Conclusion

Elevate your RF designs with our state-of-the-art 8-layer HDI PCB featuring RO4350B core and RO4450F bondply. With meticulous craftsmanship, superior material properties, and strict adherence to quality standards, this High-Density Interconnect HDI PCB guarantees optimal performance, reliability, and longevity for your cutting-edge applications. Reach out to our global availability and experience the difference in RF PCB technology today.