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Home Newly Shipped RF PCB 6-layer I-Tera MT40 High Speed Laminate RO4450F PP 1.501mm Blind Via PCB

6-layer I-Tera MT40 High Speed Laminate RO4450F PP 1.501mm Blind Via PCB

Unlike traditional single-material PCBs,this hybrid design combines the superior electrical performance of I-Tera MT40 with the reliable bonding capability of RO4450F PP, ensuring consistent performance in harsh environments while meeting strict manufacturing standards.

  • Item NO.:

    BIC-540-v625.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


6-layer I-Tera MT40 High Speed Laminate RO4450F PP 1.501mm Blind Via PCB

 

Introduce this high-performance 6-layer hybrid PCB, which integrates I-Tera MT40 high-speed laminate with RO4450F PP prepreg. this product is engineered to balance high-speed signal integrity, thermal stability, and cost-effectiveness, catering to the growing demands of modern high-speed digital and RF/microwave applications. Unlike traditional single-material PCBs,thishybrid design combines the superior electrical performance of I-Tera MT40 with the reliable bonding capability of RO4450F PP, ensuring consistent performance in harsh environments while meeting strict manufacturing standards. Below is a comprehensive, in-depth overview of the product, including key specifications, material advantages, technical explanations, and typical applications.

 

 

1. PCB Construction Details

 

The table below summarizes all key construction parameters of the 6-layer MT40 hybrid PCB, covering material selection, dimensional specifications, manufacturing processes, and quality control, ensuring full transparency of product performance and manufacturability.

 

Construction Item

Detailed Specification

Base Material

I-Tera MT40 + RO4450F PP

Layer Count

6 layers

Board Dimensions

99mm x 99mm (per piece)

Finished Board Thickness

1.501mm

Finished Cu Weight

1 oz for inner layers; 2 oz for outer layers

Minimum Trace/Space

5 mil (for impedance control)

Minimum Hole Size

0.3 mm

Blind Vias

Yes

Via Filling

0.3 mm via resin plugging and copper cap plating

Edge Plating

Yes

Surface Finish

Immersion Gold, 2 u"

Solder Mask

Green

Silkscreen

White

Quality Test

100% Electrical test prior to shipment

Impedance Control

Top layer: 5 mil trace, single-ended, 50 ohm

 

 

2. 6-Layer PCB Stackup

 

The 6-layer PCB stackup is optimized for high-speed signal transmission and structural stability, combining I-Tera MT40’s electrical performance with RO4450F PP’s bonding reliability; the table below details the layer structure and functional allocation.

 

6-layer I-Tera MT40 PCB stackup

 

 

3. Introduction to I-Tera MT40

 

I-Tera MT40 is a high-performance laminate specifically designed for modern high-speed digital and RF/microwave PCB designs. It boasts excellent thermal and electrical performance, making it a cost-effective alternative to PTFE and other high-end microwave laminates.

 

With a glass transition temperature (Tg) of 215°C and decomposition temperature (Td) of 360°C, it offers superior thermal stability, suitable for high-temperature manufacturing processes and harsh application environments. Its dielectric constant (Dk) of 3.45 and dissipation factor (Df) of 0.0031 ensure minimal signal loss, even at frequencies up to W-band. Unlike PTFE-based materials, I-Tera MT40 does not require special through-hole treatments, simplifying manufacturing and reducing costs. Available in both laminate and prepreg forms, it provides a complete material solution for multilayer, hybrid, and double-sided PCBs.


6-layer I-Tera MT40 PCB 

 

4. I-Tera MT40 Data Sheet

 

The table below condenses key technical parameters of I-Tera MT40 from its official data sheet, providing essential reference for engineers in material selection and application design.

 

I-Tera® MT40

Property

Typical Value

Units

Test Method

Metric (English)

IPC-TM-650 (or as noted)

Glass Transition Temperature (Tg) by DSC

215

°C

2.4.25C

Glass Transition Temperature (Tg) by DMA

230

°C

2.4.24.4

Glass Transition Temperature (Tg) by TMA

210

°C

2.4.24C

Decomposition Temperature (Td) by TGA @ 5% weight loss

360

°C

2.4.24.6

Time to Delaminate by TMA    (Copper removed)

A. T260

>60

Minutes

2.4.24.1

B. T288

Z-Axis CTE

A. Pre-Tg

55

ppm/°C

2.4.24C

B. Post-Tg

290

ppm/°C

C. 50 to 260°C, (Total Expansion)

2.8

%

X/Y-Axis CTE

Pre-Tg

12

ppm/°C

2.4.24C

Thermal Conductivity

0.61

W/m·K

ASTM E1952

Thermal Stress 10 sec @ 288ºC (550.4ºF)

A. Unetched

Pass

Pass Visual

2.4.13.1

B. Etched

Dk, Permittivity

A. @ 2 GHz

3.45

2.5.5.5

B. @ 5 GHz

C. @ 10 GHz

Df, Loss Tangent

A. @ 2 GHz

0.0031

Bereskin Stripline

B. @ 5 GHz

C. @ 10 GHz

Volume Resistivity

C-96/35/90

1.33 x 10^7

MΩ-cm

2.5.17.1

Surface Resistivity

C-96/35/90

1.33 x 10^5

2.5.17.1

Dielectric Breakdown

45.4

kV

2.5.6B

Arc Resistance

139

Seconds

2.5.1B

Electric Strength (Laminate & laminated prepreg)

45 (1133)

kV/mm (V/mil)

2.5.6.2A

Comparative Tracking Index (CTI)

3

Class (Volts)

UL 746A

ASTM D3638

Peel Strength

1 oz. EDC foil

1.0 (5.7)

N/mm (lb/inch)

2.4.8C

Flexural Strength

A. Length direction

490 (71.0)

MPa (kpsi)

2.4.4B

B. Cross direction

400 (58.0)

Tensile Strength

A. Length direction

269 (39.0)

MPa (kpsi)

ASTM D3039

B. Cross direction

241 (35.0)

Young's Modulus

A. Length direction

3060

ksi

ASTM D790-15e2

B. Cross direction

2784

Poisson's Ratio

A. Length direction

0.234

ASTM D3039

B. Cross direction

0.222

Moisture Absorption

0.1

%

2.6.2.1A

Flammability (Laminate & laminated prepreg)

V-0

Rating

UL 94

Relative Thermal Index (RTI)

130

°C

UL 796

 

 

5. Typical Applications

 

Leveraging the advantages of I-Tera MT40 and RO4450F PP, this 6-layer hybrid PCB is widely applied in: 

 


  • High-speed communication equipment
  • RF/microwave devices
  • Industrial control systems
  • Medical electronics
  • Automotive electronics


 

Its impedance control, edge plating, and resin-filled vias ensure reliable performance in these demanding applications.

 

 

6. What is Single-Ended Impedance Control?

 

Single-ended impedance control refers to the process of designing PCB traces to maintain a specific impedance (50 ohm inthisproduct) between a single signal trace and its reference plane. It is critical for high-speed signal transmission, as impedance mismatches can cause signal reflection, distortion, and loss.thistop layer uses 5 mil traces to achieve 50 ohm single-ended impedance, ensuring stable signal integrity and minimizing interference in high-frequency applications.

 

 

 

7. Why Edge Plating?

 

Edge plating (metalized board edges) is essential forthis PCB for three key reasons: First, it enhances mechanical strength, preventing edge damage during assembly and use. Second, it improves electrical performance by providing a continuous ground path, reducing electromagnetic interference (EMI) and crosstalk. Third, it facilitates reliable soldering and grounding when the PCB is mounted in enclosures, ensuring consistent connectivity and stability in harsh operating environments.

 

 

This product meets international industry standards, with strict quality control and optimized design to deliver consistent, reliable performance for high-end electronic applications. It perfectly balances performance, cost, and manufacturability, making it an ideal choice for engineers and enterprises pursuing high-quality PCB solutions.

 






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