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Unlike traditional single-material PCBs,this hybrid design combines the superior electrical performance of I-Tera MT40 with the reliable bonding capability of RO4450F PP, ensuring consistent performance in harsh environments while meeting strict manufacturing standards.
Item NO.:
BIC-540-v625.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
6-layer I-Tera MT40 High Speed Laminate RO4450F PP 1.501mm Blind Via PCB
Introduce this high-performance 6-layer hybrid PCB, which integrates I-Tera MT40 high-speed laminate with RO4450F PP prepreg. this product is engineered to balance high-speed signal integrity, thermal stability, and cost-effectiveness, catering to the growing demands of modern high-speed digital and RF/microwave applications. Unlike traditional single-material PCBs,thishybrid design combines the superior electrical performance of I-Tera MT40 with the reliable bonding capability of RO4450F PP, ensuring consistent performance in harsh environments while meeting strict manufacturing standards. Below is a comprehensive, in-depth overview of the product, including key specifications, material advantages, technical explanations, and typical applications.
1. PCB Construction Details
The table below summarizes all key construction parameters of the 6-layer MT40 hybrid PCB, covering material selection, dimensional specifications, manufacturing processes, and quality control, ensuring full transparency of product performance and manufacturability.
|
Construction Item |
Detailed Specification |
|
Base Material |
I-Tera MT40 + RO4450F PP |
|
Layer Count |
6 layers |
|
Board Dimensions |
99mm x 99mm (per piece) |
|
Finished Board Thickness |
1.501mm |
|
Finished Cu Weight |
1 oz for inner layers; 2 oz for outer layers |
|
Minimum Trace/Space |
5 mil (for impedance control) |
|
Minimum Hole Size |
0.3 mm |
|
Blind Vias |
Yes |
|
Via Filling |
0.3 mm via resin plugging and copper cap plating |
|
Edge Plating |
Yes |
|
Surface Finish |
Immersion Gold, 2 u" |
|
Solder Mask |
Green |
|
Silkscreen |
White |
|
Quality Test |
100% Electrical test prior to shipment |
|
Impedance Control |
Top layer: 5 mil trace, single-ended, 50 ohm |
2. 6-Layer PCB Stackup
The 6-layer PCB stackup is optimized for high-speed signal transmission and structural stability, combining I-Tera MT40’s electrical performance with RO4450F PP’s bonding reliability; the table below details the layer structure and functional allocation.
3. Introduction to I-Tera MT40
I-Tera MT40 is a high-performance laminate specifically designed for modern high-speed digital and RF/microwave PCB designs. It boasts excellent thermal and electrical performance, making it a cost-effective alternative to PTFE and other high-end microwave laminates.
With a glass transition temperature (Tg) of 215°C and decomposition temperature (Td) of 360°C, it offers superior thermal stability, suitable for high-temperature manufacturing processes and harsh application environments. Its dielectric constant (Dk) of 3.45 and dissipation factor (Df) of 0.0031 ensure minimal signal loss, even at frequencies up to W-band. Unlike PTFE-based materials, I-Tera MT40 does not require special through-hole treatments, simplifying manufacturing and reducing costs. Available in both laminate and prepreg forms, it provides a complete material solution for multilayer, hybrid, and double-sided PCBs.
4. I-Tera MT40 Data Sheet
The table below condenses key technical parameters of I-Tera MT40 from its official data sheet, providing essential reference for engineers in material selection and application design.
|
I-Tera® MT40 |
||||
|
Property |
Typical Value |
Units |
Test Method |
|
|
Metric (English) |
IPC-TM-650 (or as noted) |
|||
|
Glass Transition Temperature (Tg) by DSC |
215 |
°C |
2.4.25C |
|
|
Glass Transition Temperature (Tg) by DMA |
230 |
°C |
2.4.24.4 |
|
|
Glass Transition Temperature (Tg) by TMA |
210 |
°C |
2.4.24C |
|
|
Decomposition Temperature (Td) by TGA @ 5% weight loss |
360 |
°C |
2.4.24.6 |
|
|
Time to Delaminate by TMA (Copper removed) |
A. T260 |
>60 |
Minutes |
2.4.24.1 |
|
B. T288 |
||||
|
Z-Axis CTE |
A. Pre-Tg |
55 |
ppm/°C |
2.4.24C |
|
B. Post-Tg |
290 |
ppm/°C |
||
|
C. 50 to 260°C, (Total Expansion) |
2.8 |
% |
||
|
X/Y-Axis CTE |
Pre-Tg |
12 |
ppm/°C |
2.4.24C |
|
Thermal Conductivity |
0.61 |
W/m·K |
ASTM E1952 |
|
|
Thermal Stress 10 sec @ 288ºC (550.4ºF) |
A. Unetched |
Pass |
Pass Visual |
2.4.13.1 |
|
B. Etched |
||||
|
Dk, Permittivity |
A. @ 2 GHz |
3.45 |
— |
2.5.5.5 |
|
B. @ 5 GHz |
||||
|
C. @ 10 GHz |
||||
|
Df, Loss Tangent |
A. @ 2 GHz |
0.0031 |
— |
Bereskin Stripline |
|
B. @ 5 GHz |
||||
|
C. @ 10 GHz |
||||
|
Volume Resistivity |
C-96/35/90 |
1.33 x 10^7 |
MΩ-cm |
2.5.17.1 |
|
Surface Resistivity |
C-96/35/90 |
1.33 x 10^5 |
MΩ |
2.5.17.1 |
|
Dielectric Breakdown |
45.4 |
kV |
2.5.6B |
|
|
Arc Resistance |
139 |
Seconds |
2.5.1B |
|
|
Electric Strength (Laminate & laminated prepreg) |
45 (1133) |
kV/mm (V/mil) |
2.5.6.2A |
|
|
Comparative Tracking Index (CTI) |
3 |
Class (Volts) |
UL 746A |
|
|
ASTM D3638 |
||||
|
Peel Strength |
1 oz. EDC foil |
1.0 (5.7) |
N/mm (lb/inch) |
2.4.8C |
|
Flexural Strength |
A. Length direction |
490 (71.0) |
MPa (kpsi) |
2.4.4B |
|
B. Cross direction |
400 (58.0) |
|||
|
Tensile Strength |
A. Length direction |
269 (39.0) |
MPa (kpsi) |
ASTM D3039 |
|
B. Cross direction |
241 (35.0) |
|||
|
Young's Modulus |
A. Length direction |
3060 |
ksi |
ASTM D790-15e2 |
|
B. Cross direction |
2784 |
|||
|
Poisson's Ratio |
A. Length direction |
0.234 |
— |
ASTM D3039 |
|
B. Cross direction |
0.222 |
|||
|
Moisture Absorption |
0.1 |
% |
2.6.2.1A |
|
|
Flammability (Laminate & laminated prepreg) |
V-0 |
Rating |
UL 94 |
|
|
Relative Thermal Index (RTI) |
130 |
°C |
UL 796 |
|
5. Typical Applications
Leveraging the advantages of I-Tera MT40 and RO4450F PP, this 6-layer hybrid PCB is widely applied in:
Its impedance control, edge plating, and resin-filled vias ensure reliable performance in these demanding applications.
6. What is Single-Ended Impedance Control?
Single-ended impedance control refers to the process of designing PCB traces to maintain a specific impedance (50 ohm inthisproduct) between a single signal trace and its reference plane. It is critical for high-speed signal transmission, as impedance mismatches can cause signal reflection, distortion, and loss.thistop layer uses 5 mil traces to achieve 50 ohm single-ended impedance, ensuring stable signal integrity and minimizing interference in high-frequency applications.
7. Why Edge Plating?
Edge plating (metalized board edges) is essential forthis PCB for three key reasons: First, it enhances mechanical strength, preventing edge damage during assembly and use. Second, it improves electrical performance by providing a continuous ground path, reducing electromagnetic interference (EMI) and crosstalk. Third, it facilitates reliable soldering and grounding when the PCB is mounted in enclosures, ensuring consistent connectivity and stability in harsh operating environments.
This product meets international industry standards, with strict quality control and optimized design to deliver consistent, reliable performance for high-end electronic applications. It perfectly balances performance, cost, and manufacturability, making it an ideal choice for engineers and enterprises pursuing high-quality PCB solutions.
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