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Home Newly Shipped RF PCB Rogers TMM4 PCB 2-layer 50mil 1.27mm High Frequency Laminate

Rogers TMM4 PCB 2-layer 50mil 1.27mm High Frequency Laminate

The TMM4 50mil Rogers substrate PCBis a high-performance, high-reliability solution for RF and microwave applications.

  • Item NO.:

    BIC-338-v417.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers TMM4 PCB 2-layer 50mil 1.27mm High Frequency Laminate

 

Product Overview

The TMM4 PCB 50 mil is a high-frequency, high-reliability printed circuit board designed for demanding RF and microwave applications. Manufactured using Rogers TMM4 thermoset microwave material, this Rogers TMM Series PCB offers exceptional electrical performance, thermal stability, and mechanical durability. With a 2-layer rigid construction, immersion gold surface finish, and tight tolerances, this board is ideal for power amplifiers, satellite communications, antennas, and other high-frequency circuits.

 

Engineered for precision and signal integrity, this Rogers Immersion Gold PCB features a dielectric constant (Dk) of 4.50±0.045 and a low dissipation factor (Df) of 0.0020 at 10 GHz, ensuring minimal signal loss. The matched coefficient of thermal expansion (CTE) to copper enhances plated-through-hole (PTH) reliability, while the high decomposition temperature (425°C) ensures stability in harsh environments.

 

Detailed PCB Specifications

1. PCB Construction & Materials


Parameter

Specification

Base Material

Rogers TMM4

Layer Count

2 layers

Board Dimensions

45mm x 54mm (±0.15mm tolerance)

Finished Thickness

1.3mm (50mil core)

Copper Weight (Outer Layers)

1oz (35µm)

Minimum Trace/Space

4/6 mils

Minimum Hole Size

0.3mm

Via Plating Thickness

20µm

Surface Finish

Immersion Gold (ENIG)

Solder Mask (Top)

Blue

Solder Mask (Bottom)

None

Silkscreen (Top)

White

Silkscreen (Bottom)

None

Blind/Buried Vias

No

Electrical Testing

100% tested prior to shipment

Accepted Standard

IPC-Class-2

 

 

2. PCB Stackup

Layer

Material

Thickness

Top Copper

1oz (35µm Cu)

35µm

Core

Rogers TMM4

1.27mm (50mil)

Bottom Copper

1oz (35µm Cu)

35µm

 

3. PCB Statistics

Category

Count

Components

11

Total Pads

20

Through-Hole Pads

8

Top SMT Pads

12

Bottom SMT Pads

0

Vias

51

Nets

2

 

TMM4 PCB 


Key Features

1. Superior Electrical Performance


  • Dielectric Constant (Dk): 4.50±0.045 (stable over frequency)
  • Dissipation Factor (Df): 0.0020 @ 10GHz (low signal loss)
  • Thermal Coefficient of Dk: 15 ppm/°K (minimal drift with temperature changes)


 

2. Excellent Thermal & Mechanical Properties

CTE Matched to Copper:


  • X/Y-axis: 16 ppm/°K
  • Z-axis: 21 ppm/°K


Thermal Conductivity: 0.7 W/mK (efficient heat dissipation)

Decomposition Temperature (Td): 425°C (high thermal resistance)

Moisture Absorption: 0.07%-0.18% (low humidity sensitivity)

 

3. High Reliability for RF/Microwave Applications


  • Strong PTH Reliability: Resists pad lifting and deformation
  • Chemical Resistance: Withstands harsh fabrication processes
  • Wire-Bonding Compatibility: Ideal for high-frequency ICs and RF components


 

Benefits

1. Optimized for High-Frequency Circuits


  • Low insertion loss and minimal signal distortion make it ideal for RF amplifiers, filters, and antennas.
  • Stable Dk ensures consistent impedance control in microwave designs.


 

2. Robust & Durable Construction


  • Thermoset resin prevents cold flow and creep, improving long-term reliability.
  • Matched CTE to copper reduces stress on plated through-holes, enhancing lifespan.


 

3. Ease of Fabrication & Assembly


  • Compatible with standard PCB manufacturing processes (no specialized handling required).
  • Immersion gold (ENIG) surface finish ensures excellent solderability and wire-bonding performance.


 

Typical Applications

The TMM4 PCB (50mil) is widely used in:

✅RF & Microwave Circuits (Power amplifiers, combiners, couplers)

✅Satellite Communication Systems (Low-earth orbit (LEO), phased arrays)

✅Global Positioning Systems (GPS) Antennas

✅Patch Antennas & Dielectric Resonators

✅Chip Testers & High-Frequency Sensors

✅Automotive Radar & Aerospace Avionics

 

Conclusion

The TMM4 50mil Rogers substrate PCB is a high-performance, high-reliability solution for RF and microwave applications. With Rogers TMM4’s superior dielectric properties, excellent thermal stability, and robust mechanical characteristics, this TMM4 high frequency PCB is ideal for industries requiring precision, durability, and signal integrity.

 

Whether for satellite communications, 5G infrastructure, or aerospace systems, this PCB delivers consistent performance under demanding conditions.

 

Order now forhigh-frequency PCBs built to the highest industry standards!

 




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Top 10 Sales of Rogers PCB




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