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The TMM4 50mil Rogers substrate PCBis a high-performance, high-reliability solution for RF and microwave applications.
Item NO.:
BIC-338-v417.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
Rogers TMM4 PCB 2-layer 50mil 1.27mm High Frequency Laminate
Product Overview
The TMM4 PCB 50 mil is a high-frequency, high-reliability printed circuit board designed for demanding RF and microwave applications. Manufactured using Rogers TMM4 thermoset microwave material, this Rogers TMM Series PCB offers exceptional electrical performance, thermal stability, and mechanical durability. With a 2-layer rigid construction, immersion gold surface finish, and tight tolerances, this board is ideal for power amplifiers, satellite communications, antennas, and other high-frequency circuits.
Engineered for precision and signal integrity, this Rogers Immersion Gold PCB features a dielectric constant (Dk) of 4.50±0.045 and a low dissipation factor (Df) of 0.0020 at 10 GHz, ensuring minimal signal loss. The matched coefficient of thermal expansion (CTE) to copper enhances plated-through-hole (PTH) reliability, while the high decomposition temperature (425°C) ensures stability in harsh environments.
Detailed PCB Specifications
1. PCB Construction & Materials
Parameter |
Specification |
Base Material |
Rogers TMM4 |
Layer Count |
2 layers |
Board Dimensions |
45mm x 54mm (±0.15mm tolerance) |
Finished Thickness |
1.3mm (50mil core) |
Copper Weight (Outer Layers) |
1oz (35µm) |
Minimum Trace/Space |
4/6 mils |
Minimum Hole Size |
0.3mm |
Via Plating Thickness |
20µm |
Surface Finish |
Immersion Gold (ENIG) |
Solder Mask (Top) |
Blue |
Solder Mask (Bottom) |
None |
Silkscreen (Top) |
White |
Silkscreen (Bottom) |
None |
Blind/Buried Vias |
No |
Electrical Testing |
100% tested prior to shipment |
Accepted Standard |
IPC-Class-2 |
2. PCB Stackup
Layer |
Material |
Thickness |
Top Copper |
1oz (35µm Cu) |
35µm |
Core |
Rogers TMM4 |
1.27mm (50mil) |
Bottom Copper |
1oz (35µm Cu) |
35µm |
3. PCB Statistics
Category |
Count |
Components |
11 |
Total Pads |
20 |
Through-Hole Pads |
8 |
Top SMT Pads |
12 |
Bottom SMT Pads |
0 |
Vias |
51 |
Nets |
2 |
Key Features
1. Superior Electrical Performance
2. Excellent Thermal & Mechanical Properties
CTE Matched to Copper:
Thermal Conductivity: 0.7 W/mK (efficient heat dissipation)
Decomposition Temperature (Td): 425°C (high thermal resistance)
Moisture Absorption: 0.07%-0.18% (low humidity sensitivity)
3. High Reliability for RF/Microwave Applications
Benefits
1. Optimized for High-Frequency Circuits
2. Robust & Durable Construction
3. Ease of Fabrication & Assembly
Typical Applications
The TMM4 PCB (50mil) is widely used in:
✅RF & Microwave Circuits (Power amplifiers, combiners, couplers)
✅Satellite Communication Systems (Low-earth orbit (LEO), phased arrays)
✅Global Positioning Systems (GPS) Antennas
✅Patch Antennas & Dielectric Resonators
✅Chip Testers & High-Frequency Sensors
✅Automotive Radar & Aerospace Avionics
Conclusion
The TMM4 50mil Rogers substrate PCB is a high-performance, high-reliability solution for RF and microwave applications. With Rogers TMM4’s superior dielectric properties, excellent thermal stability, and robust mechanical characteristics, this TMM4 high frequency PCB is ideal for industries requiring precision, durability, and signal integrity.
Whether for satellite communications, 5G infrastructure, or aerospace systems, this PCB delivers consistent performance under demanding conditions.
Order now forhigh-frequency PCBs built to the highest industry standards!
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