Rogers RT/duroid 6035HTC PCB 30mil 0.762mm 2-layer Immersion Silver Blue Solder Mask

Rogers RT/duroid 6035HTC PCB 30mil 0.762mm2-layer Immersion Silver Blue Solder Mask

Product Overview

This double-sided printed circuit board is engineered specifically for high-power RF and microwave circuits where thermal management is critical. Utilizing RT/duroid 6035HTC as the core dielectric, this 2-layer rigid PCB achieves a balance between high thermal conductivity and low electrical loss. The design emphasizes robust power handling with a finished thickness of 0.85mm and 1 oz copper outer layers, finished with Immersion Silver to ensure solderability and low surface roughness. Fabricated to IPC-Class-2 standards and supported by 100% electrical testing, this board is suitable for worldwide deployment in demanding amplifier and filter networks.

The following tables detail the precise construction, stack-up, and statistical breakdown of the board.

PCB Construction Details

The construction details highlight the use of advanced materials and precision fabrication techniques to ensure high thermal conductivity, fine-feature resolution, and robust reliability for mission-critical RF applications.

PCB Stackup

The stackup is optimized for thermal dissipation, utilizing a thick, thermally conductive dielectric core sandwiched between two standard-weight copper layers to facilitate high-power RF transmission.

PCB Statistics

The statistical overview reflects a moderately complex, high-power RF design with a focus on through-hole connectivity for robust mechanical anchoring and a high via count to facilitate thermal management across the two-layer structure.

Material Deep Dive: RT/duroid 6035HTC

The core of this 30mil Rogers PCB’s superior performance lies in the Rogers RT/duroid 6035HTC laminate. Unlike standard PTFE materials, this ceramic-filled composite is specifically formulated for high-power applications. Its defining characteristic is a thermal conductivity of 1.44 W/m/K, which is approximately 2.4 times higher than standard RT/duroid 6000 series materials. This allows heat generated by active components (such as power amplifiers) to be efficiently conducted away from the RF traces, significantly lowering the operating temperature of the circuit and improving long-term reliability.

Additionally, the RT duroid 6035HTC material maintains exceptional high-frequency stability with a Dielectric Constant (Dk) of 3.5±0.05 at 10 GHz and a low Dissipation Factor of 0.0013. This ensures minimal signal loss and consistent impedance control across the board. From a manufacturing perspective, the advanced filler system in the 6035HTC provides superior drill-ability compared to traditional alumina-filled high-thermal laminates, reducing manufacturing costs and tool wear while maintaining clean via walls for reliable plating.

Key Features & Benefits:

Features:

• Dielectric Constant (Dk): 3.5±0.05 at 10 GHz/23°C
• Dissipation Factor (Df): 0.0013 at 10 GHz/23°C
• Thermal Coefficient of Dk: -66 ppm/°C
• Moisture Absorption: 0.06%
• Thermal Conductivity: 1.44 W/m/K at 80°C
• CTE (X/Y/Z): 19 / 19 / 39 ppm/°C

Benefits:

1)High Thermal Conductivity: Efficiently dissipates heat, enabling higher power density designs without thermal runaway.

2)Improved Dielectric Heat Dissipation: Lowers operating temperatures for active components, extending the lifespan of high-power amplifiers.

3)Excellent High Frequency Performance: Maintains signal integrity at microwave frequencies with consistent dielectric constant across temperature variations.

4)Lower Insertion Loss: The combination of low Df and stable copper adhesion results in minimal signal degradation, critical for receiver paths and filter networks.

Typical Applications

This 30mil RT/duroid 6035HTC PCB is ideally suited for the most demanding RF and microwave systems, including:

• High Power RF and Microwave Amplifiers
• Power Amplifiers for 5G Infrastructure
• Combiner and Divider Networks
• High-Q Couplers and Filters
• Radar Systems

Conclusion

This 2-layer RT/duroid 6035HTC PCB represents a sophisticated solution for engineers requiring high thermal conductivity without compromising RF performance. The combination of a 30mil (0.762mm) thermally optimized core, Immersion Silver finish, and precise IPC-Class-2 fabrication standards ensures that this board is ready for deployment in high-reliability, high-power applications worldwide. The design data (Gerber RS-274-X) and strict quality controls, including 100% electrical testing, guarantee that this product meets the exacting standards required for modern microwave subsystems.