Taconic TLX-0 PCB 2-Layer 20mil DK2.45 Substrate HASL Bare Copper

Taconic TLX-0 PCB 2-Layer 20mil DK2.45 Substrate HASL Bare Copper

Product Overview

This PCB utilizes 20mil TLX-0 substrate, a PTFE fiberglass composite renowned for its low, stable dielectric constant (Dk) of 2.45±0.04. Unlike standard FR-4 materials, Taconic TLX-0 provides the low loss required for high-frequency operation while maintaining the mechanical reinforcement necessary to withstand severe environmental stresses—including vibration, high temperature, and radiation. The board is manufactured without solder mask or silkscreen to optimize performance for RF sensitivity and impedance control, utilizing a Hot Air Solder Leveling (HASL) finish for robust solderability.

PCB Construction Details

The construction details highlight the precision engineering and stringent quality controls applied to this board. Notably, the absence of solder mask and silkscreen, combined with a 100% electrical test, ensures uncompromised RF performance and reliability.

PCB Stackup

The stackup is a minimalist yet highly effective 2-layer configuration. The core material, TLX-0, serves as both the dielectric and the mechanical backbone, providing a controlled impedance environment with a symmetrical copper weight distribution to prevent warpage.*

PCB Statistics

The statistical breakdown reveals a design focused on simple, high-power or high-frequency networks. With only 2 nets and 67 vias, this board is optimized for straightforward RF paths, utilizing through-hole components for robust mechanical anchoring alongside surface-mount devices for compact circuit integration.*

Material Deep Dive: TLX-0 Properties

The selection of TLX-0 PCB is the defining feature of this product. This material is a workhorse in the RF/microwave industry, offering reliability that standard laminates cannot match. The fiberglass reinforcement provides exceptional mechanical stability, making it ideal for applications where theTaconicPCB is subjected to physical stress, such as bolted installations experiencing high vibration during space launch or thermal cycling in engine modules.

Key Features:

• Dielectric Constant (Dk): 2.45±0.04 @ 10GHz (Tightly controlled for consistent impedance)
• Dissipation Factor (Df): 0.0021 @ 10GHz (Low loss for minimal signal attenuation)
• Moisture Absorption: 0.02% (Critical for maintaining Dk stability in humid environments)
• CTE (X/Y): 21/23 ppm/°C (Matches copper, ensuring reliability during thermal cycling)
• Peel Strength: 12 lbs/in (Strong copper adhesion)

Benefits & Performance:

1)Excellent Passive Intermodulation (PIM): Measured below -160 dBc, essential for high-performance antenna and combiner applications where signal distortion is unacceptable.

2)Environmental Resistance: Exhibits resistance to creep, high temperature exposure, radiation (low outgassing per NASA standards), and wide temperature ranges, making it suitable for space, defense, and automotive radar.

3)UL 94 V0 Rating: Ensures flammability compliance for commercial and industrial safety.

Manufacturing & Quality Standards

• This product is manufactured to meet the IPC-Class-2 quality standard, ensuring high reliability and consistent performance for industrial and telecommunications equipment.
• The artwork is supplied in Gerber RS-274-X format, ensuring seamless data transfer and fabrication compatibility with global manufacturing facilities.
• Availability: Worldwide shipping with standard lead times.

Typical Applications

Given the combination of TLX-0's high-frequency performance and the board's 2-layer, solder-mask-free design, this Taconic High Frequency PCB is ideally suited for:

- Couplers, splitters, combiners, amplifiers,antennas and passive components

- Radar systems, mobile communications,

- Microwave test equipment,

- Microwave transmission devices and RF components.

In summary, this TLX-0 2-layer PCB represents a strategic balance betweenhigh-frequency material science and practical manufacturing. It is engineered for engineers who require predictable RF performance, mechanical durability under extreme conditions, and a reliable supply chain.