RO4003C PCB 2-layer 8mil 0.203mm Rogers 4003C Immersion Silver No Solder Mask

RO4003C PCB 2-layer 8mil 0.203mm Rogers 4003C Immersion Silver No Solder Mask

RO4003C 2-layer 8mil PCB—an advanced circuit board tailored for performance-critical RF, microwave, and high-frequency applications. Leveraging Rogers’ proprietary RO4003C laminate, this 8mil Rogers PCB combines exceptional electrical stability, cost-effectiveness, and seamless manufacturability, making it the preferred choice for industries ranging from telecommunications to automotive electronics. Below is a breakdown of its specifications, capabilities, and value proposition.

Core Material Advantage: Rogers RO4003C

At the heart of this PCB lies Rogers RO4003C—a woven glass-reinforced hydrocarbon/ceramic laminate that bridges the gap between PTFE’s electrical performance and FR-4’s manufacturability. Unlike traditional microwave materials, Rogers 4003C requires no special through-hole treatments or handling, processing just like standard epoxy/glass (FR-4) at a fraction of the cost of conventional PTFE-based laminates. Its non-brominated composition, high Tg (>280°C), and copper-matched thermal coefficient of expansion (CTE) ensure dimensional stability and reliable plated through-holes, even under severe thermal shock—critical for long-term application durability.

PCB Construction Details

The following table outlines the key structural parameters of the 0.203 mm Rogers 4003C PCB, covering material selection, dimensional tolerances, and manufacturing specifications to guarantee performance and compatibility.

PCB Stackup

This 2-layer rigid PCB features a streamlined stackup design that maximizes electrical performance while maintaining structural rigidity, ideal for high-frequency signal transmission.

PCB Statistics

The following statistics reflect the RO4003C PCB’s design complexity and compatibility with standard assembly processes, supporting high-volume production requirements.

Key Electrical & Thermal Performance

This RO4003C high frequency PCB stands out with exceptional electrical characteristics optimized for high-frequency operations:

• Dielectric Constant (Dk): 3.38 +/-0.05 at 10GHz (stable across frequency ranges)
• Dissipation Factor (Df): 0.0027 at 10GHz, 0.0021 at 2.5GHz (ultra-low signal loss)
• Thermal Coefficient of Dk: +40 ppm/°C (consistent performance under temperature fluctuations)
• Thermal Conductivity: 0.71 W/m/°K (efficient heat dissipation)
• CTE: X-axis 11ppm/°C, Y-axis 14ppm/°C, Z-axis 46ppm/°C (excellent dimensional stability)
• Moisture Absorption: 0.06% (resistant to environmental humidity)

Customer Benefits

1) Cost-Effective Manufacturability: Processes like FR-4, eliminating the need for specialized production equipment and reducing fabrication costs.

2) High-Volume Compatibility: Designed for performance-sensitive, high-volume applications without compromising on reliability.

3) Multi-Layer Versatility: Ideal for multi-layer board (MLB) constructions, offering flexibility for complex designs.

4) Competitive Pricing: Delivers PTFE-level performance at a fraction of the cost, maximizing return on investment.

Typical Applications

This RO4003C 2-layer PCB is engineered for industries requiring superior high-frequency performance:

-Cellular Base Station Antennas and Power Amplifiers

-RF Identification (RFID) Tags

-Automotive Radar and Sensors

-Low-Noise Blocks (LNB’s) for Direct Broadcast Satellites

Quality & Availability

Adhering to IPC-Class-2 quality standards, every PCB undergoes 100% electrical testing before shipment, ensuring consistent performance and reliability. We support worldwide availability, with artwork compatibility for Gerber RS-274-X—seamlessly integrating into your existing production workflows.

Whether you’re developing next-generation communication devices or high-precision automotive sensors, our RO4003C 8mil PCB delivers the perfect balance of performance, cost-efficiency, and durability. Contact our sales team today to discuss customizations, volume pricing, or technical support tailored to your application needs.