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This ultra-thin TLY-5 PCB combines the unparalleled high-frequency electrical properties of Rogers' premier laminate with precision manufacturing to deliver a reliable, high-performance interconnect solution for the most challenging RF and microwave designs.
Item NO.:
BIC-461-v547.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaShipping Port:
ShenzhenLead Time:
7-10 days
TLY-5 2-layer 10mil 0.254mm Immersion Gold Taconic RF PCB Circuit Board
The TLY-5 2-Layer 10mil PCB is a high-frequency precision solution built with premium TLY-5 laminates. It features exceptional dimensional stability, ultra-low dielectric loss, and reliable electrical performance, tailored for industries requiring uncompromised signal integrity. Below is a structured breakdown of its key specifications, advantages, and application value.
PCB Construction Details
The following table summarizes the core manufacturing parameters of the TLY-5 2-Layer PCB, ensuring consistent quality and compliance with high-precision application requirements.
|
Parameter |
Specification |
|
Base Material |
Rogers TLY-5 |
|
Layer Count |
2 Layers |
|
Board Dimensions |
55.0 mm x 50.0 mm (±0.15mm) |
|
Minimum Trace / Space |
6 mil / 8 mil |
|
Minimum Hole Size |
0.2 mm |
|
Blind/Buried Vias |
No |
|
Finished Board Thickness |
0.3 mm |
|
Finished Copper Weight (Outer) |
1 oz (35 μm / ~1.4 mils) |
|
Via Plating Thickness |
20 μm (min) |
|
Surface Finish |
Immersion Gold (ENIG) |
|
Top/Bottom Silkscreen |
No |
|
Top/Bottom Solder Mask |
No |
|
Electrical Test |
100% Electrical test prior to shipment |
PCB Stackup
The stackup structure of this 2-layer rigid PCB is designed to balance signal transmission efficiency and mechanical stability, with clear layer distribution as shown below.
|
Layer |
Material |
Thickness |
|
Top Layer (L1) |
Copper |
35 μm (1 oz) |
|
Dielectric Core |
TLY-5 |
0.254 mm (10 mil) |
|
Bottom Layer (L2) |
Copper |
35 μm (1 oz) |
PCB Statistics
The following table presents key statistical data of the Taconic TLY-5 PCB, reflecting its component layout and connection design characteristics.
|
Item |
Quantity |
|
Total Components |
9 |
|
Total Pads |
41 |
|
Thru-Hole Pads |
23 |
|
Top-Side SMT Pads |
18 |
|
Bottom-Side SMT Pads |
0 |
|
Vias |
17 |
|
Nets |
2 |

Core Advantages: Material & Performance
- Premium 10mil TLY-5 substrate: Made of lightweight woven fiberglass, offering superior dimensional stability vs. chopped fiber-reinforced PTFE composites; woven matrix ensures mechanical robustness for high-volume manufacturing.
- Outstanding Performance Metrics:
Dielectric Constant: 2.2 (±0.02 tolerance at 10 GHz/23°C)
- Loss Tangent: 0.0009 at 10 GHz (ultra-low)
- Density: 2.19 g/cm³; Moisture Absorption: 0.02% (minimal)
- CTE: 26 ppm/°C (X-axis), 15 ppm/°C (Y-axis), 217 ppm/°C (Z-axis)–stable across temperature fluctuations
- Tangible Business Benefits:
Dimensional stability: Eliminates deformation during production/operation
- Ultra-low DF: Ensures efficient 77 GHz high-frequency signal transmission (ideal for automotive radar)
- Low moisture absorption: Boosts reliability in humid environments
- High copper peel strength: Guarantees structural durability
- Uniform DK: Maintains consistent signal quality, reducing failure rates & maintenance costs
Additional Specifications & Availability
Typical Applications
This Taconic TLY-5 DK2.2 PCB is ideally suited for:
In summary, this ultra-thin TLY-5 PCB combines the unparalleled high-frequency electrical properties of Rogers' premier laminate with precision manufacturing to deliver a reliable, high-performance interconnect solution for the most challenging RF and microwave designs. Its global availability and compliance with industry standards make it a trusted choice for engineers pushing the boundaries of wireless technology.
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