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Home Newly Shipped RF PCB Rogers RO4725JXR PCB 2-layer 60.7mil 1.542mm Immersion Gold Bare Copper Board

Rogers RO4725JXR PCB 2-layer 60.7mil 1.542mm Immersion Gold Bare Copper Board

Choose this RO4725JXR high frequenc yPCB to optimize the balance between exceptional high-frequency performance, long-term reliability, and total project cost for your next-generation wireless designs.

  • Item NO.:

    BIC-459-v545.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers RO4725JXR PCB 2-layer 60.7mil 1.542mm Immersion Gold Bare Copper Board

 

In the demanding world of high-frequency electronics, where signal integrity and reliability are paramount, the choice of printed circuit board material and construction is critical. This advanced 2-layer PCB fabricated on Rogers RO4725JXR, a laminate engineered specifically for superior radio frequency (RF) and antenna applications. ThisRogersboard exemplifies a perfect synergy of cutting-edge material science and precision manufacturing, designed to deliver consistent, high-performance results in critical wireless infrastructure. Moving beyond traditional PTFE-based materials, 60.7mil RO4725JXR PCB offers a cost-optimized solution without compromising on the electrical properties essential for today's cellular, base station, and advanced communication systems. Every aspect of this board, from its 60.7-mil core to its immersion gold finish, is tailored to ensure minimal signal loss, excellent thermal management, and robust field performance.

 

The physical construction of this RO4725JXR PCB is defined by exacting tolerances and high-quality finishes to meet rigorous application demands. Below is a detailed breakdown of its key structural parameters.

 

PCB Construction Details:

This table summarizes the critical physical and manufacturing specifications that define the board's construction and quality assurance standards.

 

Parameter

Specification

Base Material

Rogers RO4725JXR

Layer Count

2-layer

Board Dimensions

115.1mm x 66.3mm (1PCS), Tolerance: +/- 0.15mm

Minimum Trace/Space

5 mil / 6 mil

Minimum Hole Size

0.3mm

Blind Vias

No

Finished Board Thickness

1.62mm

Finished Cu Weight (Outer Layers)

1 oz (35 μm, ~1.4 mils)

Via Plating Thickness

20 μm (Minimum)

Surface Finish

Immersion Gold (ENIG)

Top / Bottom Silkscreen

No

Top / Bottom Solder Mask

No (Bare Copper)

Electrical Test

100% tested prior to shipment

 

 

PCB Stackup:

This table outlines the simple yet effective two-layer stackup, highlighting the substantial low-loss core material that is central to its RF performance.

 

Layer

Material

Thickness

Layer 1 (Top)

Copper

35 μm (1 oz)

Core

Rogers RO4725JXR

1.542 mm (60.7 mil)

Layer 2 (Bottom)

Copper

35 μm (1 oz)

 

 

PCB Statistics:

This table provides a quantitative overview of the board's component and connectivity density, illustrating its design complexity.

 

Item

Quantity

Components

25

Total Pads

150

Thru-Hole Pads

92

Top-Side SMT Pads

58

Bottom-Side SMT Pads

0

Vias

131

Nets

2

 

 

Material Advantage: The RO4725JXR Core

At the heart of this PCB lies Rogers RO4725JXR, a hydrocarbon/ceramic/woven glass laminate that sets a new standard for cost-effective, high-performance antenna-grade materials. It serves as a reliable, drop-in alternative to conventional PTFE-based laminates, fully compatible with standard FR-4 and lead-free assembly processes without requiring special through-hole treatments.


RO4725JXR PCB 2-layer 60.7mil ENIG

 

Its exceptional electrical properties are the foundation of its performance:

 

1) Stable Dielectric Constant (Dk): 2.55±0.05 @ 10GHz, ensuring predictable impedance control and phase stability.

 

2) Ultra-Low Loss Tangent (Df): As low as 0.0022 @ 2.5GHz, which minimizes signal attenuation and insertion loss, crucial for antenna gain and efficiency.

 

3) Excellent Thermal Coefficient of Dk: +34 ppm/°C, guaranteeing consistent electrical performance across operating temperature ranges.

 

4) Copper-Matched CTE: (13.9/19/25.6 ppm/°C in X/Y/Z axes) reduces the risk of plated through-hole reliability issues under thermal cycling.

 

5) High Thermal Reliability: Tg >280°C ensures robustness during high-temperature assembly and operation.

 

6) Superior Passive Intermodulation (PIM) Performance: Typical values better than -160 dBc, with perfect PIM as low as -166 dBc, making it ideal for multi-carrier, high-power antenna systems where signal purity is critical.

 

Key Benefits & Applications

The combination of this advanced material and precise manufacturing translates into tangible benefits for designers and OEMs: 

Reduced system signal loss, minimized PIM distortion for clearer signals, consistent and predictable circuit performance, and a significant cost advantage over traditional PTFE solutions.

 

 

Consequently, this RO4725JXR 2-layer PCB is ideally suited for demanding applications, including:


  • Cellular Base Station Antennas (4G/LTE, 5G)
  • Broadcast and Satellite Communication Antennas
  • Various High-Frequency RF Components and Subsystems


 

Quality & Delivery

This product is manufactured in full compliance with IPC-Class-2 standards, ensuring high reliability for dedicated service electronic products. Artwork is supplied in the universally accepted Gerber RS-274-X format, and we support worldwide availability to meet global project demands.

 

Choose this RO4725JXR high frequency PCB to optimize the balance between exceptional high-frequency performance, long-term reliability, and total project cost for your next-generation wireless designs.

 





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