• October 30. 2025

How Does the RO3035 Laminate's Thermal Stability Enhance PCB Reliability? In high-frequency electronics, heat is an inevitable byproduct of operation. Components like power amplifiers (PAs) in cellular base stations or automotive radar modules generate significant heat. If the PCB substrate is not stable, this heat can cause catastrophic failures. The RO3035 laminate is engineered to prevent these...

• December 23. 2025

What Are the Key Advantages of Using F4BM220 Laminate for High-Frequency 2-Layer PCBs?   For engineers designing high-frequency circuits, selecting the right PCB substrate is a critical decision that directly impacts performance, reliability, and cost. When it comes to 2-layer boards for RF, microwave, and fast digital applications, F4BM220 laminate emerges as a superior choice over...

• December 23. 2025

How Does the 30mil Dk 3.3 RO4533 Optimize Performance in RF PCB Designs?   In the precise engineering realm of radio frequency (RF) and microwave circuit design, every material parameter serves a specific function. Rogers RO4533 laminate achieves an optimal balance for many antenna and RF applications through two defining characteristics: a 30mil (0.762mm) Rogers substrate thickness...